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Class Information
Number: 438/458
Name: Semiconductor device manufacturing: process > Bonding of plural semiconductor substrates > Subsequent separation into plural bodies (e.g., delaminating, dicing, etc.)
Description: Process for joining plural semiconductive substrates into an integral body having a step of dividing the integral body into plural individual bodies subsequent to the joining operation.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 6964914 |
Method of manufacturing a free-standing substrate made of monocrystalline semi-conductor material |
Nov. 15, 2005 |
| 6962829 |
Method of making near chip size integrated circuit package |
Nov. 8, 2005 |
| 6958284 |
Method of smoothing the outline of a useful layer of material transferred onto a support substrate |
Oct. 25, 2005 |
| 6955976 |
Method for dicing wafer stacks to provide access to interior structures |
Oct. 18, 2005 |
| 6953735 |
Method for fabricating a semiconductor device by transferring a layer to a support with curvature |
Oct. 11, 2005 |
| 6953736 |
Process for transferring a layer of strained semiconductor material |
Oct. 11, 2005 |
| 6951796 |
Substrate and manufacturing method therefor |
Oct. 4, 2005 |
| 6949386 |
Method for mass production of a plurality of magnetic sensors |
Sep. 27, 2005 |
| 6946326 |
Method and device for protecting micro electromechanical systems structures during dicing of a wafer |
Sep. 20, 2005 |
| 6946325 |
Methods for packaging microelectronic devices |
Sep. 20, 2005 |
| 6946361 |
Method of peeling off and method of manufacturing semiconductor device |
Sep. 20, 2005 |
| 6946046 |
Method and apparatus for separating member |
Sep. 20, 2005 |
| 6943056 |
Semiconductor device manufacturing method and electronic equipment using same |
Sep. 13, 2005 |
| 6943047 |
Device transferring method, device arraying method, and image display fabrication method using the same |
Sep. 13, 2005 |
| 6939784 |
Wafer scale package and method of assembly |
Sep. 6, 2005 |
| 6939782 |
Method for producing thin layers on a specific support and an application thereof |
Sep. 6, 2005 |
| 6939783 |
Preventive treatment method for a multilayer semiconductor wafer |
Sep. 6, 2005 |
| 6936523 |
Two-stage annealing method for manufacturing semiconductor substrates |
Aug. 30, 2005 |
| 6936500 |
Method for the lateral contacting of a semiconductor chip |
Aug. 30, 2005 |
| 6933209 |
Stacking memory chips using flat lead-frame with breakaway insertion pins and pin-to-pin bridges |
Aug. 23, 2005 |
| 6933208 |
Method of forming wiring, and method of arranging devices and method of manufacturing image display system by using the same |
Aug. 23, 2005 |
| 6927147 |
Coplanar integration of lattice-mismatched semiconductor with silicon via wafer bonding virtual substrates |
Aug. 9, 2005 |
| 6927148 |
Ion implantation method and method for manufacturing SOI wafer |
Aug. 9, 2005 |
| 6927146 |
Chemical thinning of epitaxial silicon layer over buried oxide |
Aug. 9, 2005 |
| 6922890 |
Planarization process for thin film surfaces |
Aug. 2, 2005 |
| 6924210 |
Chip dicing |
Aug. 2, 2005 |
| 6919261 |
Method and resulting structure for manufacturing semiconductor substrates |
Jul. 19, 2005 |
| 6918421 |
Thin film forming apparatus and thin film forming method |
Jul. 19, 2005 |
| 6916676 |
Method for producing a nitride semiconductor element |
Jul. 12, 2005 |
| 6911737 |
Semiconductor device package and method |
Jun. 28, 2005 |
| 6911376 |
Selective heating using flash anneal |
Jun. 28, 2005 |
| 6911107 |
Piezoelectric film type actuator, liquid discharge head, and method of manufacturing the same |
Jun. 28, 2005 |
| 6911667 |
Encapsulation for organic electronic devices |
Jun. 28, 2005 |
| 6911375 |
Method of fabricating silicon devices on sapphire with wafer bonding at low temperature |
Jun. 28, 2005 |
| 6908845 |
Integrated circuit die and an electronic assembly having a three-dimensional interconnection scheme |
Jun. 21, 2005 |
| 6902988 |
Method for treating substrates for microelectronics and substrates obtained by said method |
Jun. 7, 2005 |
| 6902989 |
Method for manufacturing gallium nitride (GaN) based single crystalline substrate that include separating from a growth substrate |
Jun. 7, 2005 |
| 6900114 |
Separating apparatus, separating method, and method of manufacturing semiconductor substrate |
May. 31, 2005 |
| 6897124 |
Method of manufacturing a bonded wafers using a Bernoulli chuck |
May. 24, 2005 |
| 6893942 |
Method for separating a mask from the surface of a semiconductor wafer |
May. 17, 2005 |
| 6895136 |
Integrated optical/electronic circuits and associated methods of simultaneous generation thereof |
May. 17, 2005 |
| 6890835 |
Layer transfer of low defect SiGe using an etch-back process |
May. 10, 2005 |
| 6890788 |
Manufacturing method of a micro structure |
May. 10, 2005 |
| 6890836 |
Scribe street width reduction by deep trench and shallow saw cut |
May. 10, 2005 |
| 6890834 |
Electronic device and method for manufacturing the same |
May. 10, 2005 |
| 6887770 |
Method for fabricating semiconductor device |
May. 3, 2005 |
| 6887650 |
TRANSFER METHOD, METHOD OF MANUFACTURING THIN FILM DEVICES, METHOD OF MANUFACTURING INTEGRATED CIRCUITS, CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF, ELECTRO-OPTICAL APPARATUS AND MANUFACTU |
May. 3, 2005 |
| 6884695 |
Sheet resin composition and process for manufacturing semiconductor device therewith |
Apr. 26, 2005 |
| 6884694 |
Method of fabricating nano SOI wafer and nano SOI wafer fabricated by the same |
Apr. 26, 2005 |
| 6884697 |
Process for cleaving a wafer layer from a donor wafer |
Apr. 26, 2005 |
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