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Class Information
Number: 438/458
Name: Semiconductor device manufacturing: process > Bonding of plural semiconductor substrates > Subsequent separation into plural bodies (e.g., delaminating, dicing, etc.)
Description: Process for joining plural semiconductive substrates into an integral body having a step of dividing the integral body into plural individual bodies subsequent to the joining operation.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7041529 |
Light-emitting device and method of fabricating the same |
May. 9, 2006 |
| 7041536 |
Semiconductor integrated circuit card manufacturing method, and semiconductor integrated circuit card |
May. 9, 2006 |
| 7041576 |
Separately strained N-channel and P-channel transistors |
May. 9, 2006 |
| 7041577 |
Process for manufacturing a substrate and associated substrate |
May. 9, 2006 |
| 7037806 |
Method of fabricating silicon-on-insulator semiconductor substrate using rare earth oxide or rare earth nitride |
May. 2, 2006 |
| 7033914 |
Method of making a package structure by dicing a wafer from the backside surface thereof |
Apr. 25, 2006 |
| 7033905 |
Recycling of a wafer comprising a buffer layer after having separated a thin layer therefrom by mechanical means |
Apr. 25, 2006 |
| 7035489 |
Thin film electro-optical deflector device and a method of fabrication of such a device |
Apr. 25, 2006 |
| 7033913 |
Semiconductor device and method of manufacturing the same |
Apr. 25, 2006 |
| 7033912 |
Silicon carbide on diamond substrates and related devices and methods |
Apr. 25, 2006 |
| 7033910 |
Method of fabricating multi layer MEMS and microfluidic devices |
Apr. 25, 2006 |
| 7029548 |
Method for cutting a block of material and forming a thin film |
Apr. 18, 2006 |
| 7026224 |
Method for dicing semiconductor chips and corresponding semiconductor chip system |
Apr. 11, 2006 |
| 7022586 |
Method for recycling a substrate |
Apr. 4, 2006 |
| 7022585 |
Method for making thin film devices intended for solar cells or silicon-on-insulator (SOI) applications |
Apr. 4, 2006 |
| 7018910 |
Transfer of a thin layer from a wafer comprising a buffer layer |
Mar. 28, 2006 |
| 7018909 |
Forming structures that include a relaxed or pseudo-relaxed layer on a substrate |
Mar. 28, 2006 |
| 7015118 |
Method for forming a scribe line on a semiconductor device and an apparatus for forming the scribe line |
Mar. 21, 2006 |
| 7015117 |
Methods of processing of gallium nitride |
Mar. 21, 2006 |
| 7012319 |
System for integrating a circuit on an isolation layer and method thereof |
Mar. 14, 2006 |
| 7008859 |
Wafer and method of producing a substrate by transfer of a layer that includes foreign species |
Mar. 7, 2006 |
| 7008857 |
Recycling a wafer comprising a buffer layer, after having separated a thin layer therefrom |
Mar. 7, 2006 |
| 7005319 |
Global planarization of wafer scale package with precision die thickness control |
Feb. 28, 2006 |
| 7005324 |
Method of fabricating stacked semiconductor chips |
Feb. 28, 2006 |
| 7001826 |
Wafer with a relaxed useful layer and method of forming the wafer |
Feb. 21, 2006 |
| 6998329 |
SOI wafer producing method, and wafer separating jig |
Feb. 14, 2006 |
| 6998282 |
Method of manufacturing a semiconductor device |
Feb. 14, 2006 |
| 6995030 |
Semiconductor chip for optoelectronics |
Feb. 7, 2006 |
| 6995075 |
Process for forming a fragile layer inside of a single crystalline substrate |
Feb. 7, 2006 |
| 6995034 |
Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates |
Feb. 7, 2006 |
| 6995634 |
Surface-acoustic-wave component adapted to electronic circuit and device, and manufacturing method therefor |
Feb. 7, 2006 |
| 6991948 |
Method of electrical characterization of a silicon-on-insulator (SOI) wafer |
Jan. 31, 2006 |
| 6991995 |
Method of producing a semiconductor structure having at least one support substrate and an ultrathin layer |
Jan. 31, 2006 |
| 6989582 |
Method for making a multi-die chip |
Jan. 24, 2006 |
| 6989285 |
Method of fabrication of stacked semiconductor devices |
Jan. 24, 2006 |
| 6982209 |
Method of transferring devices by lateral etching of a sacrificial layer |
Jan. 3, 2006 |
| 6982184 |
Method of fabricating MEMS devices on a silicon wafer |
Jan. 3, 2006 |
| 6982181 |
Manufacturing process for ultra slim electrooptic display device unit |
Jan. 3, 2006 |
| 6979659 |
Silicon fixture supporting silicon wafers during high temperature processing |
Dec. 27, 2005 |
| 6979629 |
Method and apparatus for processing composite member |
Dec. 27, 2005 |
| 6974726 |
Silicon wafer with soluble protective coating |
Dec. 13, 2005 |
| 6974758 |
Method of producing a light-emitting diode |
Dec. 13, 2005 |
| 6974521 |
Method for separating a film and a substrate |
Dec. 13, 2005 |
| 6972204 |
Method of transferring devices, method of arranging devices using the same, and method of manufacturing an image display system |
Dec. 6, 2005 |
| 6972069 |
Device and method for connecting two wafers in a planar manner for grinding down and cutting up a product wafer |
Dec. 6, 2005 |
| 6969624 |
Method of transferring a device, a method of producing a device holding substrate, and a device holding substrate |
Nov. 29, 2005 |
| 6969668 |
Treatment method of film quality for the manufacture of substrates |
Nov. 29, 2005 |
| 6969667 |
Electrical device and method of making |
Nov. 29, 2005 |
| 6969626 |
Method for forming LED by a substrate removal process |
Nov. 29, 2005 |
| 6967149 |
Storage structure with cleaved layer |
Nov. 22, 2005 |
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