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Class Information
Number: 438/458
Name: Semiconductor device manufacturing: process > Bonding of plural semiconductor substrates > Subsequent separation into plural bodies (e.g., delaminating, dicing, etc.)
Description: Process for joining plural semiconductive substrates into an integral body having a step of dividing the integral body into plural individual bodies subsequent to the joining operation.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7094665 |
Exfoliating method, transferring method of thin film device, and thin film device, thin film integrated circuit device, and liquid crystal display device produced by the same |
Aug. 22, 2006 |
| 7094667 |
Smooth thin film layers produced by low temperature hydrogen ion cut |
Aug. 22, 2006 |
| 7091070 |
Semiconductor device and method of manufacturing the same |
Aug. 15, 2006 |
| 7091107 |
Method for producing SOI wafer and SOI wafer |
Aug. 15, 2006 |
| 7091108 |
Methods and apparatuses for manufacturing ultra thin device layers for integrated circuit devices |
Aug. 15, 2006 |
| 7087502 |
Method for generating chip stacks |
Aug. 8, 2006 |
| 7087446 |
Method of mounting optoelectronic devices on an optical element and article |
Aug. 8, 2006 |
| 7084047 |
Method for the production of individual monolithically integrated semiconductor circuits |
Aug. 1, 2006 |
| 7084045 |
Method for manufacturing semiconductor device |
Aug. 1, 2006 |
| 7083994 |
Method of manufacturing a semiconductor device with outline of cleave marking regions and alignment or registration features |
Aug. 1, 2006 |
| 7081399 |
Method for producing a high quality useful layer on a substrate utilizing helium and hydrogen implantations |
Jul. 25, 2006 |
| 7078320 |
Partial wafer bonding and dicing |
Jul. 18, 2006 |
| 7078317 |
Method and system for source switching and in-situ plasma bonding |
Jul. 18, 2006 |
| 7074696 |
Semiconductor circuit module and method for fabricating semiconductor circuit modules |
Jul. 11, 2006 |
| 7071027 |
Ball grid array package having improved reliability and method of manufacturing the same |
Jul. 4, 2006 |
| 7071014 |
Methods for preserving strained semiconductor substrate layers during CMOS processing |
Jul. 4, 2006 |
| 7071029 |
Methods for fabricating final substrates |
Jul. 4, 2006 |
| 7067352 |
Vertical integrated package apparatus and method |
Jun. 27, 2006 |
| 7067393 |
Substrate assembly for stressed systems |
Jun. 27, 2006 |
| 7067430 |
Method of making relaxed silicon-germanium on insulator via layer transfer with stress reduction |
Jun. 27, 2006 |
| 7067338 |
Method of manufacturing a display device including forming electric connections on a substrate, conductor patterns on a second substrate and coupling the connections |
Jun. 27, 2006 |
| 7064046 |
Manufacturing method of semiconductor device |
Jun. 20, 2006 |
| 7064045 |
Laser based method and device for forming spacer structures for packaging optical reflection devices |
Jun. 20, 2006 |
| 7064014 |
Backside metallization on sides of microelectronic dice for effective thermal contact with heat dissipation devices |
Jun. 20, 2006 |
| 7063993 |
Method of fabricating devices incorporating microelectromechanical systems using at least one UV curable tape |
Jun. 20, 2006 |
| 7060528 |
Method for mounting a semiconductor element to an interposer by compression bonding |
Jun. 13, 2006 |
| 7060591 |
Method for fabricating a semiconductor device by transferring a layer to a support with curvature |
Jun. 13, 2006 |
| 7060592 |
Image sensor and fabricating method thereof |
Jun. 13, 2006 |
| 7060153 |
Display device and method of manufacturing the same |
Jun. 13, 2006 |
| 7056751 |
Method and system for increasing yield of vertically integrated devices |
Jun. 6, 2006 |
| 7056810 |
Method for manufacturing semiconductor apparatus, and semiconductor apparatus and electric appliance |
Jun. 6, 2006 |
| 7056809 |
Method for ion treating a semiconductor material for subsequent bonding |
Jun. 6, 2006 |
| 7056808 |
Cleaving process to fabricate multilayered substrates using low implantation doses |
Jun. 6, 2006 |
| 7056649 |
Process for producing a tool insert for injection molding a part with two-stage microstructures |
Jun. 6, 2006 |
| 7056789 |
Production method for semiconductor substrate and production method for field effect transistor and semiconductor substrate and field effect transistor |
Jun. 6, 2006 |
| 7052978 |
Arrangements incorporating laser-induced cleaving |
May. 30, 2006 |
| 7051424 |
Method and apparatus for electrically and physically coupling a micro-actuator and slider to a hard drive arm suspension for component replacement after detachment from the suspension |
May. 30, 2006 |
| 7052948 |
Film or layer made of semi-conductive material and method for producing said film or layer |
May. 30, 2006 |
| 7051418 |
Method of measuring weak gas flows |
May. 30, 2006 |
| 7049624 |
Member and member manufacturing method |
May. 23, 2006 |
| 7049175 |
Method of packaging RF MEMS |
May. 23, 2006 |
| 7049208 |
Method of manufacturing of thin based substrate |
May. 23, 2006 |
| 7049211 |
In-situ-etch-assisted HDP deposition using SiF.sub.4 |
May. 23, 2006 |
| 7045392 |
Semiconductor device and method of fabrication thereof, semiconductor module, circuit board, and electronic equipment |
May. 16, 2006 |
| 7045441 |
Method for forming a single-crystal silicon layer on a transparent substrate |
May. 16, 2006 |
| 7045442 |
Method of separating a release layer from a substrate comprising hydrogen diffusion |
May. 16, 2006 |
| 7045438 |
Light emitting device, semiconductor device, and method of fabricating the devices |
May. 16, 2006 |
| 7041577 |
Process for manufacturing a substrate and associated substrate |
May. 9, 2006 |
| 7041576 |
Separately strained N-channel and P-channel transistors |
May. 9, 2006 |
| 7041536 |
Semiconductor integrated circuit card manufacturing method, and semiconductor integrated circuit card |
May. 9, 2006 |
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