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Class Information
Number: 438/458
Name: Semiconductor device manufacturing: process > Bonding of plural semiconductor substrates > Subsequent separation into plural bodies (e.g., delaminating, dicing, etc.)
Description: Process for joining plural semiconductive substrates into an integral body having a step of dividing the integral body into plural individual bodies subsequent to the joining operation.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7341923 |
Substrate, manufacturing method therefor, and semiconductor device |
Mar. 11, 2008 |
| 7338883 |
Process for transferring a layer of strained semiconductor material |
Mar. 4, 2008 |
| 7338882 |
Method of fabricating nano SOI wafer and nano SOI wafer fabricated by the same |
Mar. 4, 2008 |
| 7338202 |
Ultra-high temperature micro-electro-mechanical systems (MEMS)-based sensors |
Mar. 4, 2008 |
| 7335527 |
Method for microfabricating structures using silicon-on-insulator material |
Feb. 26, 2008 |
| 7332381 |
Semiconductor device and method of manufacturing the same |
Feb. 19, 2008 |
| 7332412 |
Structure of strained silicon on insulator and method of manufacturing the same |
Feb. 19, 2008 |
| 7329589 |
Method for manufacturing silicon-on-insulator wafer |
Feb. 12, 2008 |
| 7329588 |
Forming a reticle for extreme ultraviolet radiation and structures formed thereby |
Feb. 12, 2008 |
| 7329587 |
Method for the production of semi-conductor chips |
Feb. 12, 2008 |
| 7329564 |
Wafer dividing method |
Feb. 12, 2008 |
| 7326628 |
Thin layer transfer method utilizing co-implantation to reduce blister formation and to surface roughness |
Feb. 5, 2008 |
| 7326629 |
Method of stacking thin substrates by transfer bonding |
Feb. 5, 2008 |
| 7326649 |
Parylene-based flexible multi-electrode arrays for neuronal stimulation and recording and methods for manufacturing the same |
Feb. 5, 2008 |
| 7326590 |
Method for manufacturing ball grid array package |
Feb. 5, 2008 |
| 7323397 |
Method and apparatus of fabricating a semiconductor device by back grinding and dicing |
Jan. 29, 2008 |
| 7323398 |
Method of layer transfer comprising sequential implantations of atomic species |
Jan. 29, 2008 |
| 7323395 |
Manufacture of solid state electronic components |
Jan. 29, 2008 |
| 7320929 |
Method of fabricating SOI wafer |
Jan. 22, 2008 |
| 7316964 |
Active matrix substrate, a manufacturing method of the active matrix substrate |
Jan. 8, 2008 |
| 7314782 |
Method of manufacturing a semiconductor device and a semiconductor device obtained by means of said method |
Jan. 1, 2008 |
| 7312136 |
Method of fabricating a wafer with strained channel layers for increased electron and hole mobility for improving device performance |
Dec. 25, 2007 |
| 7309925 |
Dicing die-bonding film |
Dec. 18, 2007 |
| 7309642 |
Metallic quantum dots fabricated by a superlattice structure |
Dec. 18, 2007 |
| 7307006 |
Method of manufacturing semiconductor device |
Dec. 11, 2007 |
| 7307005 |
Wafer bonding with highly compliant plate having filler material enclosed hollow core |
Dec. 11, 2007 |
| 7303976 |
Wafer bonding method |
Dec. 4, 2007 |
| 7300853 |
Thin layer semi-conductor structure comprising a heat distribution layer |
Nov. 27, 2007 |
| 7300856 |
Process for detaching layers of material |
Nov. 27, 2007 |
| 7297613 |
Method of fabricating and integrating high quality decoupling capacitors |
Nov. 20, 2007 |
| 7297612 |
Methods for forming strained-semiconductor-on-insulator device structures by use of cleave planes |
Nov. 20, 2007 |
| 7297611 |
Method for producing thin layers of semiconductor material from a donor wafer |
Nov. 20, 2007 |
| 7297610 |
Method of segmenting a wafer |
Nov. 20, 2007 |
| 7294557 |
Method of increasing the area of a useful layer of material transferred onto a support |
Nov. 13, 2007 |
| 7294581 |
Method for fabricating silicon nitride spacer structures |
Nov. 13, 2007 |
| 7294559 |
Wafer dicing process for optical electronic packing |
Nov. 13, 2007 |
| 7294558 |
Method and apparatus for cleaving a wafer through expansion resulting from vaporization or freezing of liquid |
Nov. 13, 2007 |
| 7294531 |
Wafer level chip stack method |
Nov. 13, 2007 |
| 7288489 |
Process for thinning a semiconductor workpiece |
Oct. 30, 2007 |
| 7288435 |
Method for producing a cover, method for producing a packaged device |
Oct. 30, 2007 |
| 7285437 |
Method of separating MEMS devices from a composite structure |
Oct. 23, 2007 |
| 7285476 |
Exfoliating method, transferring method of thin film device, and thin film device, thin film integrated circuit device, and liquid crystal display device produced by the same |
Oct. 23, 2007 |
| 7282381 |
Method of producing self supporting substrates comprising III-nitrides by means of heteroepitaxy on a sacrificial layer |
Oct. 16, 2007 |
| 7279400 |
Method of fabricating single-layer and multi-layer single crystalline silicon and silicon devices on plastic using sacrificial glass |
Oct. 9, 2007 |
| 7279401 |
Fabricating method for flexible thin film transistor array substrate |
Oct. 9, 2007 |
| 7279402 |
Method for fabricating a semiconductor device |
Oct. 9, 2007 |
| 7276429 |
Method and apparatus for producing ultra-thin semiconductor chip and method and apparatus for producing ultra-thin back-illuminated solid-state image pickup device |
Oct. 2, 2007 |
| 7273798 |
Gallium nitride device substrate containing a lattice parameter altering element |
Sep. 25, 2007 |
| 7271033 |
Method for fabricating chip package |
Sep. 18, 2007 |
| 7271076 |
Manufacturing method of thin film integrated circuit device and manufacturing method of non-contact type thin film integrated circuit device |
Sep. 18, 2007 |
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