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Class Information
Number: 438/458
Name: Semiconductor device manufacturing: process > Bonding of plural semiconductor substrates > Subsequent separation into plural bodies (e.g., delaminating, dicing, etc.)
Description: Process for joining plural semiconductive substrates into an integral body having a step of dividing the integral body into plural individual bodies subsequent to the joining operation.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 6194239 |
Method for making thin film semiconductor |
Feb. 27, 2001 |
| 6194291 |
Microelectronic assemblies with multiple leads |
Feb. 27, 2001 |
| 6191007 |
Method for manufacturing a semiconductor substrate |
Feb. 20, 2001 |
| 6190937 |
Method of producing semiconductor member and method of producing solar cell |
Feb. 20, 2001 |
| 6180497 |
Method for producing semiconductor base members |
Jan. 30, 2001 |
| 6180435 |
Semiconductor device with economical compact package and process for fabricating semiconductor device |
Jan. 30, 2001 |
| 6180495 |
Silicon carbide transistor and method therefor |
Jan. 30, 2001 |
| 6177359 |
Method for detaching an epitaxial layer from one substrate and transferring it to another substrate |
Jan. 23, 2001 |
| 6177295 |
Method of manufacturing semiconductor devices with "chip size package" |
Jan. 23, 2001 |
| 6171884 |
Method of manufacturing a chip type electronic element |
Jan. 9, 2001 |
| 6165813 |
Replacing semiconductor chips in a full-width chip array |
Dec. 26, 2000 |
| 6165815 |
Method of fabrication of stacked semiconductor devices |
Dec. 26, 2000 |
| 6165873 |
Process for manufacturing a semiconductor integrated circuit device |
Dec. 26, 2000 |
| 6153497 |
Method for determining a cause for defects in a film deposited on a wafer |
Nov. 28, 2000 |
| 6150239 |
Method for the transfer of thin layers monocrystalline material onto a desirable substrate |
Nov. 21, 2000 |
| 6146920 |
Bump formation method |
Nov. 14, 2000 |
| 6146979 |
Pressurized microbubble thin film separation process using a reusable substrate |
Nov. 14, 2000 |
| 6143628 |
Semiconductor substrate and method of manufacturing the same |
Nov. 7, 2000 |
| 6143583 |
Dissolved wafer fabrication process and associated microelectromechanical device having a support substrate with spacing mesas |
Nov. 7, 2000 |
| 6143629 |
Process for producing semiconductor substrate |
Nov. 7, 2000 |
| 6140209 |
Process for forming an SOI substrate |
Oct. 31, 2000 |
| 6140210 |
Method of fabricating an SOI wafer and SOI wafer fabricated thereby |
Oct. 31, 2000 |
| 6136667 |
Method for bonding two crystalline substrates together |
Oct. 24, 2000 |
| 6136666 |
Method for fabricating silicon-on-insulator wafer |
Oct. 24, 2000 |
| 6130141 |
Flip chip metallization |
Oct. 10, 2000 |
| 6127714 |
Method for producing semiconductor device and photodetector device |
Oct. 3, 2000 |
| 6127244 |
Method of manufacturing semiconductor device |
Oct. 3, 2000 |
| 6124185 |
Method for producing a semiconductor device using delamination |
Sep. 26, 2000 |
| 6120597 |
Crystal ion-slicing of single-crystal films |
Sep. 19, 2000 |
| 6114221 |
Method and apparatus for interconnecting multiple circuit chips |
Sep. 5, 2000 |
| 6110806 |
Process for precision alignment of chips for mounting on a substrate |
Aug. 29, 2000 |
| 6107162 |
Method for manufacture of cleaved light emitting semiconductor device |
Aug. 22, 2000 |
| 6103599 |
Planarizing technique for multilayered substrates |
Aug. 15, 2000 |
| 6103597 |
Method of obtaining a thin film of semiconductor material |
Aug. 15, 2000 |
| 6102267 |
Method and apparatus for non-contact pulsating jet cleaving of a semiconductor material |
Aug. 15, 2000 |
| 6099675 |
Resist removing method |
Aug. 8, 2000 |
| 6100165 |
Method of manufacturing semiconductor article |
Aug. 8, 2000 |
| 6080641 |
Method of manufacturing semiconductor wafer |
Jun. 27, 2000 |
| 6077757 |
Method of forming chip semiconductor devices |
Jun. 20, 2000 |
| 6071795 |
Separation of thin films from transparent substrates by selective optical processing |
Jun. 6, 2000 |
| 6054369 |
Lifetime control for semiconductor devices |
Apr. 25, 2000 |
| 6054370 |
Method of delaminating a pre-fabricated transistor layer from a substrate for placement on another wafer |
Apr. 25, 2000 |
| 6054371 |
Method of manufacturing a semiconductor device by detachably mounting substrates to a holder board |
Apr. 25, 2000 |
| 6040204 |
Method of stacking chips with a removable connecting layer |
Mar. 21, 2000 |
| 6033995 |
Inverted layer epitaxial liftoff process |
Mar. 7, 2000 |
| 6025251 |
Method for producing a plurality of semiconductor components |
Feb. 15, 2000 |
| 6022791 |
Chip crack stop |
Feb. 8, 2000 |
| 6020252 |
Method of producing a thin layer of semiconductor material |
Feb. 1, 2000 |
| 6017804 |
Method and apparatus for cleaving semiconductor material |
Jan. 25, 2000 |
| 6013563 |
Controlled cleaning process |
Jan. 11, 2000 |
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