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Class Information
Number: 438/458
Name: Semiconductor device manufacturing: process > Bonding of plural semiconductor substrates > Subsequent separation into plural bodies (e.g., delaminating, dicing, etc.)
Description: Process for joining plural semiconductive substrates into an integral body having a step of dividing the integral body into plural individual bodies subsequent to the joining operation.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 6335263 |
Method of forming a low temperature metal bond for use in the transfer of bulk and thin film materials |
Jan. 1, 2002 |
| 6333208 |
Robust manufacturing method for making a III-V compound semiconductor device by misaligned wafer bonding |
Dec. 25, 2001 |
| 6333215 |
Method for manufacturing a semiconductor device |
Dec. 25, 2001 |
| 6331449 |
Method of forming a dicing area of a semicondutor substrate |
Dec. 18, 2001 |
| 6329606 |
Grid array assembly of circuit boards with singulation grooves |
Dec. 11, 2001 |
| 6329222 |
Interconnect for packaging semiconductor dice and fabricating BGA packages |
Dec. 11, 2001 |
| 6326285 |
Simultaneous multiple silicon on insulator (SOI) wafer production |
Dec. 4, 2001 |
| 6326247 |
Method of creating selectively thin silicon/oxide for making fully and partially depleted SOI on same waffer |
Dec. 4, 2001 |
| 6323108 |
Fabrication ultra-thin bonded semiconductor layers |
Nov. 27, 2001 |
| 6323061 |
Method for manufacturing a semiconductor device |
Nov. 27, 2001 |
| 6316333 |
Method for obtaining a thin film in particular semiconductor, comprising a protected ion zone and involving an ion implantation |
Nov. 13, 2001 |
| 6316332 |
Method for joining wafers at a low temperature and low stress |
Nov. 13, 2001 |
| 6306729 |
Semiconductor article and method of manufacturing the same |
Oct. 23, 2001 |
| 6306730 |
Method of fabricating an SOI wafer and SOI wafer fabricated by the method |
Oct. 23, 2001 |
| 6303471 |
Method of manufacturing semiconductor device having reinforcing member and method of manufacturing IC card using the device |
Oct. 16, 2001 |
| 6303400 |
Temporary attach article and method for temporary attach of devices to a substrate |
Oct. 16, 2001 |
| 6303462 |
Process for physical isolation of regions of a substrate board |
Oct. 16, 2001 |
| 6303468 |
Method for making a thin film of solid material |
Oct. 16, 2001 |
| 6291313 |
Method and device for controlled cleaving process |
Sep. 18, 2001 |
| 6291314 |
Controlled cleavage process and device for patterned films using a release layer |
Sep. 18, 2001 |
| 6291317 |
Method for dicing of micro devices |
Sep. 18, 2001 |
| 6287940 |
Dual wafer attachment process |
Sep. 11, 2001 |
| 6287941 |
Surface finishing of SOI substrates using an EPI process |
Sep. 11, 2001 |
| 6287891 |
Method for transferring semiconductor device layers to different substrates |
Sep. 11, 2001 |
| 6284631 |
Method and device for controlled cleaving process |
Sep. 4, 2001 |
| 6281095 |
Process of manufacturing silicon-on-insulator chip having an isolation barrier for reliability |
Aug. 28, 2001 |
| 6274459 |
Method for non mass selected ion implant profile control |
Aug. 14, 2001 |
| 6263941 |
Nozzle for cleaving substrates |
Jul. 24, 2001 |
| 6261927 |
Method of forming defect-free ceramic structures using thermally depolymerizable surface layer |
Jul. 17, 2001 |
| 6258699 |
Light emitting diode with a permanent subtrate of transparent glass or quartz and the method for manufacturing the same |
Jul. 10, 2001 |
| 6251754 |
Semiconductor substrate manufacturing method |
Jun. 26, 2001 |
| 6248649 |
Controlled cleavage process and device for patterned films using patterned implants |
Jun. 19, 2001 |
| 6245645 |
Method of fabricating an SOI wafer |
Jun. 12, 2001 |
| 6242324 |
Method for fabricating singe crystal materials over CMOS devices |
Jun. 5, 2001 |
| 6235612 |
Edge bond pads on integrated circuits |
May. 22, 2001 |
| 6225190 |
Process for the separation of at least two elements of a structure in contact with one another by ion implantation |
May. 1, 2001 |
| 6225191 |
Process for the manufacture of optical integrated circuits |
May. 1, 2001 |
| 6225192 |
Method of producing a thin layer of semiconductor material |
May. 1, 2001 |
| 6221740 |
Substrate cleaving tool and method |
Apr. 24, 2001 |
| 6221751 |
Wafer fabrication of die-bottom contacts for electronic devices |
Apr. 24, 2001 |
| 6221738 |
Substrate and production method thereof |
Apr. 24, 2001 |
| 6214733 |
Process for lift off and handling of thin film materials |
Apr. 10, 2001 |
| 6214701 |
Semiconductor substrate and thin film semiconductor device, method of manufacturing the same, and anodizing apparatus |
Apr. 10, 2001 |
| 6211041 |
Silicon-on-insulator (SOI) substrate and method of fabricating the same |
Apr. 3, 2001 |
| 6204172 |
Low temperature deposition of barrier layers |
Mar. 20, 2001 |
| 6204079 |
Selective transfer of elements from one support to another support |
Mar. 20, 2001 |
| 6204101 |
Method of manufacturing semiconductor device |
Mar. 20, 2001 |
| 6204093 |
Method and apparatus for applying viscous materials to a lead frame |
Mar. 20, 2001 |
| 6197665 |
Lamination machine and method to laminate a coverlay to a microelectronic package |
Mar. 6, 2001 |
| 6194245 |
Method for making thin film semiconductor |
Feb. 27, 2001 |
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