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Class Information
Number: 438/458
Name: Semiconductor device manufacturing: process > Bonding of plural semiconductor substrates > Subsequent separation into plural bodies (e.g., delaminating, dicing, etc.)
Description: Process for joining plural semiconductive substrates into an integral body having a step of dividing the integral body into plural individual bodies subsequent to the joining operation.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 6451628 |
Method fabricating a semiconductor device with a decreased mounting area |
Sep. 17, 2002 |
| 6452091 |
Method of producing thin-film single-crystal device, solar cell module and method of producing the same |
Sep. 17, 2002 |
| 6448151 |
Process for producing a large number of semiconductor chips from a semiconductor wafer |
Sep. 10, 2002 |
| 6448109 |
Wafer level method of capping multiple MEMS elements |
Sep. 10, 2002 |
| 6448152 |
Method and system for generating a plurality of donor wafers and handle wafers prior to an order being placed by a customer |
Sep. 10, 2002 |
| 6436226 |
Object separating apparatus and method, and method of manufacturing semiconductor substrate |
Aug. 20, 2002 |
| 6436793 |
Methods of forming semiconductor structure |
Aug. 20, 2002 |
| 6429530 |
Miniaturized chip scale ball grid array semiconductor package |
Aug. 6, 2002 |
| 6429094 |
Treatment process for molecular bonding and unbonding of two structures |
Aug. 6, 2002 |
| 6429095 |
Semiconductor article and method of manufacturing the same |
Aug. 6, 2002 |
| 6427748 |
Sample processing apparatus and method |
Aug. 6, 2002 |
| 6429036 |
Backside illumination of CMOS image sensor |
Aug. 6, 2002 |
| 6425971 |
Method of fabricating devices incorporating microelectromechanical systems using UV curable tapes |
Jul. 30, 2002 |
| 6426564 |
Recessed tape and method for forming a BGA assembly |
Jul. 30, 2002 |
| 6426264 |
Method of manufacturing a semiconductor laminated substrate, semiconductor crystal substrate and semiconductor device |
Jul. 30, 2002 |
| 6426274 |
Method for making thin film semiconductor |
Jul. 30, 2002 |
| 6425972 |
Methods of manufacturing microfabricated substrates |
Jul. 30, 2002 |
| 6423614 |
Method of delaminating a thin film using non-thermal techniques |
Jul. 23, 2002 |
| 6423615 |
Silicon wafers for CMOS and other integrated circuits |
Jul. 23, 2002 |
| 6423578 |
Field-effect transistor and manufacture thereof |
Jul. 23, 2002 |
| 6420244 |
Method of making wafer level chip scale package |
Jul. 16, 2002 |
| 6418999 |
Sample separating apparatus and method, and substrate manufacturing method |
Jul. 16, 2002 |
| 6420242 |
Separation of thin films from transparent substrates by selective optical processing |
Jul. 16, 2002 |
| 6420243 |
Method for producing SOI wafers by delamination |
Jul. 16, 2002 |
| 6413874 |
Method and apparatus for etching a semiconductor article and method of preparing a semiconductor article by using the same |
Jul. 2, 2002 |
| 6413799 |
Method of forming a ball-grid array package at a wafer level |
Jul. 2, 2002 |
| 6410406 |
Semiconductor device including edge bond pads and methods |
Jun. 25, 2002 |
| 6406978 |
Method of removing silicon carbide |
Jun. 18, 2002 |
| 6401317 |
Apparatus for fabricating a semiconductor device |
Jun. 11, 2002 |
| 6391743 |
Method and apparatus for producing photoelectric conversion device |
May. 21, 2002 |
| 6391799 |
Process for fabricating a structure of semiconductor-on-insulator type in particular SiCOI |
May. 21, 2002 |
| 6383833 |
Method of fabricating devices incorporating microelectromechanical systems using at least one UV curable tape |
May. 7, 2002 |
| 6384422 |
Method for manufacturing semiconductor device and ultrathin semiconductor device |
May. 7, 2002 |
| 6383890 |
Wafer bonding method, apparatus and vacuum chuck |
May. 7, 2002 |
| 6382292 |
Method and apparatus for separating composite member using fluid |
May. 7, 2002 |
| 6379999 |
Semiconductor device and method of manufacturing the same |
Apr. 30, 2002 |
| 6376332 |
Composite member and separating method therefor, bonded substrate stack and separating method therefor, transfer method for transfer layer, and SOI substrate manufacturing method |
Apr. 23, 2002 |
| 6376333 |
Method of manufacturing flexible display with transfer from auxiliary substrate |
Apr. 23, 2002 |
| 6368943 |
Semiconductor method of manufacture |
Apr. 9, 2002 |
| 6365429 |
Method for nitride based laser diode with growth substrate removed using an intermediate substrate |
Apr. 2, 2002 |
| 6362076 |
Method of fabricating an SOI wafer by hydrogen ion delamination without independent bonding heat treatment |
Mar. 26, 2002 |
| 6362077 |
Structure comprising a thin layer of material made up of conductive zones and insulating zones and a method of manufacturing such a structure |
Mar. 26, 2002 |
| 6352909 |
Process for lift-off of a layer from a substrate |
Mar. 5, 2002 |
| 6346458 |
Transposed split of ion cut materials |
Feb. 12, 2002 |
| 6346459 |
Process for lift off and transfer of semiconductor devices onto an alien substrate |
Feb. 12, 2002 |
| 6344401 |
Method of forming a stacked-die integrated circuit chip package on a water level |
Feb. 5, 2002 |
| 6339010 |
Semiconductor element forming process having a step of separating film structure from substrate |
Jan. 15, 2002 |
| 6337227 |
Method of fabrication of stacked semiconductor devices |
Jan. 8, 2002 |
| 6335263 |
Method of forming a low temperature metal bond for use in the transfer of bulk and thin film materials |
Jan. 1, 2002 |
| 6333208 |
Robust manufacturing method for making a III-V compound semiconductor device by misaligned wafer bonding |
Dec. 25, 2001 |
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