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Class Information
Number: 438/458
Name: Semiconductor device manufacturing: process > Bonding of plural semiconductor substrates > Subsequent separation into plural bodies (e.g., delaminating, dicing, etc.)
Description: Process for joining plural semiconductive substrates into an integral body having a step of dividing the integral body into plural individual bodies subsequent to the joining operation.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7614137 |
Method of manufacturing a magnetic slider head |
Nov. 10, 2009 |
| 7615466 |
Method for producing a semiconductor-on-insulator structure |
Nov. 10, 2009 |
| 7615465 |
Creation of high mobility channels in thin-body SOI devices |
Nov. 10, 2009 |
| 7615464 |
Transfer method with a treatment of a surface to be bonded |
Nov. 10, 2009 |
| 7615463 |
Method for making thin layers containing microcomponents |
Nov. 10, 2009 |
| 7615394 |
Method for fabricating MEMS device package that includes grinding MEMS device wafer to expose array pads corresponding to a cap wafer |
Nov. 10, 2009 |
| 7611965 |
Semiconductor device and manufacturing method thereof |
Nov. 3, 2009 |
| 7608471 |
Method and apparatus for integrating III-V semiconductor devices into silicon processes |
Oct. 27, 2009 |
| 7608521 |
Producing SOI structure using high-purity ion shower |
Oct. 27, 2009 |
| 7605051 |
Method for forming internal electrode pattern and method for manufacturing multilayer ceramic electronic component using same |
Oct. 20, 2009 |
| 7605019 |
Semiconductor device with stacked chips and method for manufacturing thereof |
Oct. 20, 2009 |
| 7605054 |
Method of forming a device wafer with recyclable support |
Oct. 20, 2009 |
| 7605055 |
Wafer with diamond layer |
Oct. 20, 2009 |
| 7605056 |
Method of manufacturing a semiconductor device including separation by physical force |
Oct. 20, 2009 |
| 7601614 |
Manufacturing method of silicon on insulator wafer |
Oct. 13, 2009 |
| 7601613 |
Manufacturing method of bonded wafer |
Oct. 13, 2009 |
| 7601611 |
Method of fabricating a semiconductor hetero-structure |
Oct. 13, 2009 |
| 7598115 |
Method of fabricating organic light emitting display |
Oct. 6, 2009 |
| 7595256 |
Semiconductor device, method of manufacturing thereof, and method of manufacturing base material |
Sep. 29, 2009 |
| 7592239 |
Flexible single-crystal film and method of manufacturing the same |
Sep. 22, 2009 |
| 7588969 |
Method for manufacturing semiconductor device, and semiconductor device |
Sep. 15, 2009 |
| 7588994 |
Methods for forming strained-semiconductor-on-insulator device structures by mechanically inducing strain |
Sep. 15, 2009 |
| 7588998 |
Method for producing a semiconductor element |
Sep. 15, 2009 |
| 7585749 |
Methods of forming a layer of material on a substrate and structures formed therefrom |
Sep. 8, 2009 |
| 7582512 |
Method of fabricating semiconductor device having conducting portion of upper and lower conductive layers on a peripheral surface of the semiconductor device |
Sep. 1, 2009 |
| 7579260 |
Method of dividing an adhesive film bonded to a wafer |
Aug. 25, 2009 |
| 7579259 |
Simplified method of producing an epitaxially grown structure |
Aug. 25, 2009 |
| 7579654 |
Semiconductor on insulator structure made using radiation annealing |
Aug. 25, 2009 |
| 7579621 |
Integrated BST microwave tunable devices using buffer layer transfer method |
Aug. 25, 2009 |
| 7578891 |
Adhesive bonding sheet, semiconductor device using the same, and method for manufacturing such semiconductor device |
Aug. 25, 2009 |
| 7575983 |
Method for fabricating a device with flexible substrate and method for stripping flexible-substrate |
Aug. 18, 2009 |
| 7575988 |
Method of fabricating a hybrid substrate |
Aug. 18, 2009 |
| 7575982 |
Stacked-substrate processes for production of nitride semiconductor structures |
Aug. 18, 2009 |
| 7572350 |
Method of cutting laminate, apparatus for manufacturing laminate, method of manufacturing laminate, and laminate |
Aug. 11, 2009 |
| 7572714 |
Film taking-off method |
Aug. 11, 2009 |
| 7569421 |
Through-hole via on saw streets |
Aug. 4, 2009 |
| 7569409 |
Isolation structures for CMOS image sensor chip scale packages |
Aug. 4, 2009 |
| 7566633 |
Semiconductor device and method for manufacturing the same |
Jul. 28, 2009 |
| 7563693 |
Method for manufacturing semiconductor substrate and semiconductor substrate |
Jul. 21, 2009 |
| 7563694 |
Scribe based bond pads for integrated circuits |
Jul. 21, 2009 |
| 7563629 |
Method of fabricating vertical structure LEDs |
Jul. 21, 2009 |
| 7557898 |
Substrate gap adjusting device, substrate gap adjusting method, and method of manufacturing liquid crystal display device, comprising substrate pressing sections that independently transmit fo |
Jul. 7, 2009 |
| 7547612 |
Semiconductor device and manufacturing method thereof |
Jun. 16, 2009 |
| 7547579 |
Underfill process |
Jun. 16, 2009 |
| 7544587 |
Wafer dividing method and wafer dividing apparatus |
Jun. 9, 2009 |
| 7544585 |
Structure of strained silicon on insulator and method of manufacturing the same |
Jun. 9, 2009 |
| 7540077 |
Method for bonding slider row bars for photolithography process |
Jun. 2, 2009 |
| 7541257 |
Semiconductor device having three-dimensional construction and method for manufacturing the same |
Jun. 2, 2009 |
| 7541262 |
Method for producing semiconductor device |
Jun. 2, 2009 |
| 7538432 |
Temporary structure to reduce stress and warpage in a flip chip organic package |
May. 26, 2009 |
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