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Class Information
Number: 438/458
Name: Semiconductor device manufacturing: process > Bonding of plural semiconductor substrates > Subsequent separation into plural bodies (e.g., delaminating, dicing, etc.)
Description: Process for joining plural semiconductive substrates into an integral body having a step of dividing the integral body into plural individual bodies subsequent to the joining operation.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7371594 |
Nitride semiconductor device and method for fabricating the same that minimizes cracking |
May. 13, 2008 |
| 7371612 |
Method of fabrication of stacked semiconductor devices |
May. 13, 2008 |
| 7371660 |
Controlled cleaving process |
May. 13, 2008 |
| 7368030 |
Intermediate suction support and its utilisation for producing a thin film structure |
May. 6, 2008 |
| 7368332 |
SOI substrate manufacturing method |
May. 6, 2008 |
| 7364984 |
Method for manufacturing SOI substrate |
Apr. 29, 2008 |
| 7364983 |
Method and apparatus for creating RFID devices |
Apr. 29, 2008 |
| 7364974 |
Double gate FET and fabrication process |
Apr. 29, 2008 |
| 7364926 |
Method for manufacturing gallium nitride light emitting diode devices |
Apr. 29, 2008 |
| 7364616 |
Wafer demounting method, wafer demounting device, and wafer demounting and transferring machine |
Apr. 29, 2008 |
| 7361574 |
Single-crystal silicon-on-glass from film transfer |
Apr. 22, 2008 |
| 7361573 |
Method of peeling off and method of manufacturing semiconductor device |
Apr. 22, 2008 |
| 7358164 |
Crystal imprinting methods for fabricating substrates with thin active silicon layers |
Apr. 15, 2008 |
| 7358178 |
Semiconductor substrates including I/O redistribution using wire bonds and anisotropically conductive film, methods of fabrication and assemblies including same |
Apr. 15, 2008 |
| 7354815 |
Method for fabricating semiconductor devices using strained silicon bearing material |
Apr. 8, 2008 |
| 7354845 |
In-line process for making thin film electronic devices |
Apr. 8, 2008 |
| 7354809 |
Method for double-sided processing of thin film transistors |
Apr. 8, 2008 |
| 7351300 |
Peeling method and method of manufacturing semiconductor device |
Apr. 1, 2008 |
| 7351641 |
Structure and method of forming capped chips |
Apr. 1, 2008 |
| 7351644 |
Thin handle substrate method and structure for fabricating devices using one or more films provided by a layer transfer process |
Apr. 1, 2008 |
| 7348275 |
Processing method for semiconductor wafer |
Mar. 25, 2008 |
| 7348259 |
Method of fabricating a semiconductor structure that includes transferring one or more material layers to a substrate and smoothing an exposed surface of at least one of the material layers |
Mar. 25, 2008 |
| 7348258 |
Method and device for controlled cleaving process |
Mar. 25, 2008 |
| 7348257 |
Process for manufacturing wafers of semiconductor material by layer transfer |
Mar. 25, 2008 |
| 7348260 |
Method for forming a relaxed or pseudo-relaxed useful layer on a substrate |
Mar. 25, 2008 |
| 7348199 |
Wafer dividing method |
Mar. 25, 2008 |
| 7344960 |
Separation method for cutting semiconductor package assemblage for separation into semiconductor packages |
Mar. 18, 2008 |
| 7341925 |
Method for transferring a semiconductor body from a growth substrate to a support material |
Mar. 11, 2008 |
| 7341924 |
Method for manufacturing semiconductor device |
Mar. 11, 2008 |
| 7341923 |
Substrate, manufacturing method therefor, and semiconductor device |
Mar. 11, 2008 |
| 7338202 |
Ultra-high temperature micro-electro-mechanical systems (MEMS)-based sensors |
Mar. 4, 2008 |
| 7338882 |
Method of fabricating nano SOI wafer and nano SOI wafer fabricated by the same |
Mar. 4, 2008 |
| 7338883 |
Process for transferring a layer of strained semiconductor material |
Mar. 4, 2008 |
| 7335527 |
Method for microfabricating structures using silicon-on-insulator material |
Feb. 26, 2008 |
| 7332381 |
Semiconductor device and method of manufacturing the same |
Feb. 19, 2008 |
| 7332412 |
Structure of strained silicon on insulator and method of manufacturing the same |
Feb. 19, 2008 |
| 7329564 |
Wafer dividing method |
Feb. 12, 2008 |
| 7329587 |
Method for the production of semi-conductor chips |
Feb. 12, 2008 |
| 7329589 |
Method for manufacturing silicon-on-insulator wafer |
Feb. 12, 2008 |
| 7329588 |
Forming a reticle for extreme ultraviolet radiation and structures formed thereby |
Feb. 12, 2008 |
| 7326628 |
Thin layer transfer method utilizing co-implantation to reduce blister formation and to surface roughness |
Feb. 5, 2008 |
| 7326629 |
Method of stacking thin substrates by transfer bonding |
Feb. 5, 2008 |
| 7326590 |
Method for manufacturing ball grid array package |
Feb. 5, 2008 |
| 7326649 |
Parylene-based flexible multi-electrode arrays for neuronal stimulation and recording and methods for manufacturing the same |
Feb. 5, 2008 |
| 7323398 |
Method of layer transfer comprising sequential implantations of atomic species |
Jan. 29, 2008 |
| 7323395 |
Manufacture of solid state electronic components |
Jan. 29, 2008 |
| 7323397 |
Method and apparatus of fabricating a semiconductor device by back grinding and dicing |
Jan. 29, 2008 |
| 7320929 |
Method of fabricating SOI wafer |
Jan. 22, 2008 |
| 7316964 |
Active matrix substrate, a manufacturing method of the active matrix substrate |
Jan. 8, 2008 |
| 7314782 |
Method of manufacturing a semiconductor device and a semiconductor device obtained by means of said method |
Jan. 1, 2008 |
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