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Class Information
Number: 438/458
Name: Semiconductor device manufacturing: process > Bonding of plural semiconductor substrates > Subsequent separation into plural bodies (e.g., delaminating, dicing, etc.)
Description: Process for joining plural semiconductive substrates into an integral body having a step of dividing the integral body into plural individual bodies subsequent to the joining operation.










Patents under this class:

Patent Number Title Of Patent Date Issued
8709915 Method of manufacturing semiconductor device Apr. 29, 2014
8709914 Method for controlled layer transfer Apr. 29, 2014
8709912 Semiconductor device manufacturing method and device for same Apr. 29, 2014
8709869 Method of manufacturing a plurality of electronic assemblies Apr. 29, 2014
8709868 Sensor packages and method of packaging dies of differing sizes Apr. 29, 2014
8703580 Silicon on insulator (SOI) wafer and process for producing same Apr. 22, 2014
8703521 Multijunction photovoltaic cell fabrication Apr. 22, 2014
8691674 Method for producing group 3-5 nitride semiconductor and method for producing light-emitting device Apr. 8, 2014
8691670 Methods of forming a semiconductor device Apr. 8, 2014
8691666 Method for producing chip with adhesive applied Apr. 8, 2014
8691665 Method for producing bonded wafer Apr. 8, 2014
8691663 Methods of manipulating stressed epistructures Apr. 8, 2014
8691604 Semiconductor device and manufacturing method thereof, delamination method, and transferring method Apr. 8, 2014
8685844 Sub-10 nm graphene nanoribbon lattices Apr. 1, 2014
8685837 Transfer method, method for manufacturing semiconductor device, and semiconductor device Apr. 1, 2014
8685836 Method for forming a silicon layer on any substrate using light irradiation Apr. 1, 2014
8685835 Method for manufacturing thin film integrated circuit, and element substrate Apr. 1, 2014
8685834 Fabrication method of package structure with simplified encapsulation structure and simplified wiring Apr. 1, 2014
8685761 Method for making a redistributed electronic device using a transferrable redistribution layer Apr. 1, 2014
8683674 Method for stacking microelectronic devices Apr. 1, 2014
8681489 Storage control apparatus Mar. 25, 2014
8679943 Fixed curvature force loading of mechanically spalled films Mar. 25, 2014
8679942 Strain engineered composite semiconductor substrates and methods of forming same Mar. 25, 2014
8679883 Method of separating nitride films from growth substrates by selective photo-enhanced wet oxidation and associated semiconductor structure Mar. 25, 2014
8679870 Method of manufacturing semiconductor element Mar. 25, 2014
8673752 Method of forming epitaxial based integrated circuit Mar. 18, 2014
8673743 Wafer dividing method Mar. 18, 2014
8673740 Method for formation of an electrically conducting through via Mar. 18, 2014
8673739 Method of manufacturing semiconductor device Mar. 18, 2014
8673733 Methods of transferring layers of material in 3D integration processes and related structures and devices Mar. 18, 2014
8664085 Method of manufacturing composite substrate Mar. 4, 2014
8664084 Method for making a thin-film element Mar. 4, 2014
8664082 Combination of a substrate and a wafer Mar. 4, 2014
8664028 Semiconductor device production process Mar. 4, 2014
8664025 Substrate dicing technique for separating semiconductor dies with reduced area consumption Mar. 4, 2014
8658514 Method for manufacturing a semiconductor-on-insulator structure having low electrical losses, and corresponding structure Feb. 25, 2014
8652936 Vertical cavity surface emitting devices incorporating wafer fused reflectors Feb. 18, 2014
8647964 Temporary wafer bonding method for semiconductor processing Feb. 11, 2014
8647963 Structure and method of wafer level chip molded packaging Feb. 11, 2014
8647901 Method for forming a nitride semiconductor layer and method for separating the nitride semiconductor layer from the substrate Feb. 11, 2014
8643195 Nickel tin bonding system for semiconductor wafers and devices Feb. 4, 2014
8643117 Semiconductor device, method for manufacturing same, and semiconductor storage device Feb. 4, 2014
8642444 Method of manufacturing bonded substrate, bonded substrate, method of manufacturing solid-state imaging apparatus, solid-state imaging apparatus, and camera Feb. 4, 2014
8642443 Process for the realization of islands of at least partially relaxed strained material Feb. 4, 2014
8637970 Chip package and fabrication method thereof Jan. 28, 2014
8637969 Stacked chips in a semiconductor package Jan. 28, 2014
8637383 Strain relaxation using metal materials and related structures Jan. 28, 2014
8637381 High-k dielectric and silicon nitride box region Jan. 28, 2014
8637380 Method of processing silicon and glass substrates using a laser peeling technique Jan. 28, 2014
8637379 Device including a semiconductor chip and a carrier and fabrication method Jan. 28, 2014











 
 
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