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Class Information
Number: 438/457
Name: Semiconductor device manufacturing: process > Bonding of plural semiconductor substrates > Warping of semiconductor substrate
Description: Process for joining plural semiconductive substrates into an integral body including a step of bending one or more of the semiconductor substrates to be joined.










Patents under this class:
1 2 3 4 5

Patent Number Title Of Patent Date Issued
5300175 Method for mounting a wafer to a submount Apr. 5, 1994
5129827 Method for bonding semiconductor substrates Jul. 14, 1992
5071785 Method for preparing a substrate for forming semiconductor devices by bonding warped wafers Dec. 10, 1991
4883561 Lift-off and subsequent bonding of epitaxial films Nov. 28, 1989

1 2 3 4 5










 
 
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