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Class Information
Number: 438/457
Name: Semiconductor device manufacturing: process > Bonding of plural semiconductor substrates > Warping of semiconductor substrate
Description: Process for joining plural semiconductive substrates into an integral body including a step of bending one or more of the semiconductor substrates to be joined.










Patents under this class:
1 2 3 4 5

Patent Number Title Of Patent Date Issued
7387945 Semiconductor chip, semiconductor device and electronic equipment including warpage control film, and manufacturing method of same Jun. 17, 2008
7341924 Method for manufacturing semiconductor device Mar. 11, 2008
7307004 Method with mechanically strained silicon for enhancing speed of integrated circuits or devices Dec. 11, 2007
7307005 Wafer bonding with highly compliant plate having filler material enclosed hollow core Dec. 11, 2007
7303976 Wafer bonding method Dec. 4, 2007
7276429 Method and apparatus for producing ultra-thin semiconductor chip and method and apparatus for producing ultra-thin back-illuminated solid-state image pickup device Oct. 2, 2007
7265028 Method for producing dislocation-free strained crystalline films Sep. 4, 2007
7262112 Method for producing dislocation-free strained crystalline films Aug. 28, 2007
7259080 Glass-type planar substrate, use thereof, and method for the production thereof Aug. 21, 2007
7256108 Method for reducing semiconductor die warpage Aug. 14, 2007
7244636 Semiconductor assembly for improved device warpage and solder ball coplanarity Jul. 17, 2007
7235462 Methods for fabricating a substrate Jun. 26, 2007
7235427 Method for treating substrates for microelectronics and substrates obtained by said method Jun. 26, 2007
7220656 Strained semiconductor by wafer bonding with misorientation May. 22, 2007
7199025 Fabrication and assembly structures and methods for memory devices Apr. 3, 2007
7192841 Method of wafer/substrate bonding Mar. 20, 2007
7163872 Tunable-wavelength optical filter and method of manufacturing the same Jan. 16, 2007
7160476 Method of manufacturing an electronic device Jan. 9, 2007
7144791 Lamination through a mask Dec. 5, 2006
7135383 Composite structure with high heat dissipation Nov. 14, 2006
7115480 Micromechanical strained semiconductor by wafer bonding Oct. 3, 2006
7105421 Silicon on insulator field effect transistor with heterojunction gate Sep. 12, 2006
7094666 Method and system for fabricating strained layers for the manufacture of integrated circuits Aug. 22, 2006
7084045 Method for manufacturing semiconductor device Aug. 1, 2006
7078317 Method and system for source switching and in-situ plasma bonding Jul. 18, 2006
7067352 Vertical integrated package apparatus and method Jun. 27, 2006
7060591 Method for fabricating a semiconductor device by transferring a layer to a support with curvature Jun. 13, 2006
7060592 Image sensor and fabricating method thereof Jun. 13, 2006
7049207 Isolating method and transferring method for semiconductor devices May. 23, 2006
7049624 Member and member manufacturing method May. 23, 2006
7037804 Wafer bonding using a flexible bladder press for three dimensional (3D) vertical stack integration May. 2, 2006
7033868 Semiconductor device and method of manufacturing same Apr. 25, 2006
7026706 Method and packaging structure for optimizing warpage of flip chip organic packages Apr. 11, 2006
6991948 Method of electrical characterization of a silicon-on-insulator (SOI) wafer Jan. 31, 2006
6989291 Method for manufacturing circuit devices Jan. 24, 2006
6958535 Thermal conductive substrate and semiconductor module using the same Oct. 25, 2005
6953735 Method for fabricating a semiconductor device by transferring a layer to a support with curvature Oct. 11, 2005
6946365 Method for producing a thin film comprising introduction of gaseous species Sep. 20, 2005
6939778 Method of joining an insulator element to a substrate Sep. 6, 2005
6908828 Support-integrated donor wafers for repeated thin donor layer separation Jun. 21, 2005
6905911 Semiconductor device, method for manufacturing an electronic equipment, electronic equipment, and portable information terminal Jun. 14, 2005
6900113 Method for producing bonded wafer and bonded wafer May. 31, 2005
6890834 Electronic device and method for manufacturing the same May. 10, 2005
6884718 Semiconductor manufacturing process and apparatus for modifying in-film stress of thin films, and product formed thereby Apr. 26, 2005
6865065 Semiconductor processing chamber substrate holder method and structure Mar. 8, 2005
6815309 Support-integrated donor wafers for repeated thin donor layer separation Nov. 9, 2004
6815278 Ultra-thin silicon-on-insulator and strained-silicon-direct-on-insulator with hybrid crystal orientations Nov. 9, 2004
6797591 Method for forming a semiconductor device and a semiconductor device formed by the method Sep. 28, 2004
6759277 Crystalline silicon die array and method for assembling crystalline silicon sheets onto substrates Jul. 6, 2004
6756285 Multilayer structure with controlled internal stresses and making same Jun. 29, 2004

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