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Class Information
Number:
438/457
Name:
Semiconductor device manufacturing: process
>
Bonding of plural semiconductor substrates
> Warping of semiconductor substrate
Description:
Process for joining plural semiconductive substrates into an integral body including a step of bending one or more of the semiconductor substrates to be joined.
Patents under this class:
1
2
3
Patent Number
Title Of Patent
Date Issued
5300175
Method for mounting a wafer to a submount
Apr. 5, 1994
5129827
Method for bonding semiconductor substrates
Jul. 14, 1992
5071785
Method for preparing a substrate for forming semiconductor devices by bonding warped wafers
Dec. 10, 1991
4883561
Lift-off and subsequent bonding of epitaxial films
Nov. 28, 1989
1
2
3
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