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Class Information
Number: 438/457
Name: Semiconductor device manufacturing: process > Bonding of plural semiconductor substrates > Warping of semiconductor substrate
Description: Process for joining plural semiconductive substrates into an integral body including a step of bending one or more of the semiconductor substrates to be joined.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7608520 |
Method for bonding substrate, bonded substrate, and direct bonded substrate |
Oct. 27, 2009 |
| 7595255 |
Method for manufacturing strip level substrate without warpage and method for manufacturing semiconductor package using the same |
Sep. 29, 2009 |
| 7585747 |
Low temperature hermetic bonding at water level and method of bonding for micro display application |
Sep. 8, 2009 |
| 7578891 |
Adhesive bonding sheet, semiconductor device using the same, and method for manufacturing such semiconductor device |
Aug. 25, 2009 |
| 7575982 |
Stacked-substrate processes for production of nitride semiconductor structures |
Aug. 18, 2009 |
| 7557898 |
Substrate gap adjusting device, substrate gap adjusting method, and method of manufacturing liquid crystal display device, comprising substrate pressing sections that independently transmit fo |
Jul. 7, 2009 |
| 7547579 |
Underfill process |
Jun. 16, 2009 |
| 7538432 |
Temporary structure to reduce stress and warpage in a flip chip organic package |
May. 26, 2009 |
| 7521292 |
Stretchable form of single crystal silicon for high performance electronics on rubber substrates |
Apr. 21, 2009 |
| 7521334 |
Method for producing direct bonded wafer and direct bonded wafer |
Apr. 21, 2009 |
| 7488667 |
Method for manufacturing nitride-base semiconductor element and nitride-base semiconductor element |
Feb. 10, 2009 |
| 7479441 |
Method and apparatus for flag-less water bonding tool |
Jan. 20, 2009 |
| 7473618 |
Temporary structure to reduce stress and warpage in a flip chip organic package |
Jan. 6, 2009 |
| 7470599 |
Dual-side epitaxy processes for production of nitride semiconductor structures |
Dec. 30, 2008 |
| 7462943 |
Semiconductor assembly for improved device warpage and solder ball coplanarity |
Dec. 9, 2008 |
| 7446020 |
Wafer dividing method and dividing apparatus |
Nov. 4, 2008 |
| 7432174 |
Methods for fabricating semiconductor substrates with silicon regions having differential crystallographic orientations |
Oct. 7, 2008 |
| 7427554 |
Manufacturing strained silicon substrates using a backing material |
Sep. 23, 2008 |
| 7410880 |
Method for measuring bonding quality of bonded substrates, metrology apparatus, and method of producing a device from a bonded substrate |
Aug. 12, 2008 |
| 7387945 |
Semiconductor chip, semiconductor device and electronic equipment including warpage control film, and manufacturing method of same |
Jun. 17, 2008 |
| 7341924 |
Method for manufacturing semiconductor device |
Mar. 11, 2008 |
| 7307004 |
Method with mechanically strained silicon for enhancing speed of integrated circuits or devices |
Dec. 11, 2007 |
| 7307005 |
Wafer bonding with highly compliant plate having filler material enclosed hollow core |
Dec. 11, 2007 |
| 7303976 |
Wafer bonding method |
Dec. 4, 2007 |
| 7276429 |
Method and apparatus for producing ultra-thin semiconductor chip and method and apparatus for producing ultra-thin back-illuminated solid-state image pickup device |
Oct. 2, 2007 |
| 7265028 |
Method for producing dislocation-free strained crystalline films |
Sep. 4, 2007 |
| 7262112 |
Method for producing dislocation-free strained crystalline films |
Aug. 28, 2007 |
| 7259080 |
Glass-type planar substrate, use thereof, and method for the production thereof |
Aug. 21, 2007 |
| 7256108 |
Method for reducing semiconductor die warpage |
Aug. 14, 2007 |
| 7244636 |
Semiconductor assembly for improved device warpage and solder ball coplanarity |
Jul. 17, 2007 |
| 7235427 |
Method for treating substrates for microelectronics and substrates obtained by said method |
Jun. 26, 2007 |
| 7235462 |
Methods for fabricating a substrate |
Jun. 26, 2007 |
| 7220656 |
Strained semiconductor by wafer bonding with misorientation |
May. 22, 2007 |
| 7199025 |
Fabrication and assembly structures and methods for memory devices |
Apr. 3, 2007 |
| 7192841 |
Method of wafer/substrate bonding |
Mar. 20, 2007 |
| 7163872 |
Tunable-wavelength optical filter and method of manufacturing the same |
Jan. 16, 2007 |
| 7160476 |
Method of manufacturing an electronic device |
Jan. 9, 2007 |
| 7144791 |
Lamination through a mask |
Dec. 5, 2006 |
| 7135383 |
Composite structure with high heat dissipation |
Nov. 14, 2006 |
| 7115480 |
Micromechanical strained semiconductor by wafer bonding |
Oct. 3, 2006 |
| 7105421 |
Silicon on insulator field effect transistor with heterojunction gate |
Sep. 12, 2006 |
| 7094666 |
Method and system for fabricating strained layers for the manufacture of integrated circuits |
Aug. 22, 2006 |
| 7084045 |
Method for manufacturing semiconductor device |
Aug. 1, 2006 |
| 7078317 |
Method and system for source switching and in-situ plasma bonding |
Jul. 18, 2006 |
| 7067352 |
Vertical integrated package apparatus and method |
Jun. 27, 2006 |
| 7060592 |
Image sensor and fabricating method thereof |
Jun. 13, 2006 |
| 7060591 |
Method for fabricating a semiconductor device by transferring a layer to a support with curvature |
Jun. 13, 2006 |
| 7049624 |
Member and member manufacturing method |
May. 23, 2006 |
| 7049207 |
Isolating method and transferring method for semiconductor devices |
May. 23, 2006 |
| 7037804 |
Wafer bonding using a flexible bladder press for three dimensional (3D) vertical stack integration |
May. 2, 2006 |
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