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Class Information
Number: 438/457
Name: Semiconductor device manufacturing: process > Bonding of plural semiconductor substrates > Warping of semiconductor substrate
Description: Process for joining plural semiconductive substrates into an integral body including a step of bending one or more of the semiconductor substrates to be joined.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7341924 |
Method for manufacturing semiconductor device |
Mar. 11, 2008 |
| 7307004 |
Method with mechanically strained silicon for enhancing speed of integrated circuits or devices |
Dec. 11, 2007 |
| 7307005 |
Wafer bonding with highly compliant plate having filler material enclosed hollow core |
Dec. 11, 2007 |
| 7303976 |
Wafer bonding method |
Dec. 4, 2007 |
| 7276429 |
Method and apparatus for producing ultra-thin semiconductor chip and method and apparatus for producing ultra-thin back-illuminated solid-state image pickup device |
Oct. 2, 2007 |
| 7265028 |
Method for producing dislocation-free strained crystalline films |
Sep. 4, 2007 |
| 7262112 |
Method for producing dislocation-free strained crystalline films |
Aug. 28, 2007 |
| 7259080 |
Glass-type planar substrate, use thereof, and method for the production thereof |
Aug. 21, 2007 |
| 7256108 |
Method for reducing semiconductor die warpage |
Aug. 14, 2007 |
| 7244636 |
Semiconductor assembly for improved device warpage and solder ball coplanarity |
Jul. 17, 2007 |
| 7235462 |
Methods for fabricating a substrate |
Jun. 26, 2007 |
| 7235427 |
Method for treating substrates for microelectronics and substrates obtained by said method |
Jun. 26, 2007 |
| 7220656 |
Strained semiconductor by wafer bonding with misorientation |
May. 22, 2007 |
| 7199025 |
Fabrication and assembly structures and methods for memory devices |
Apr. 3, 2007 |
| 7192841 |
Method of wafer/substrate bonding |
Mar. 20, 2007 |
| 7163872 |
Tunable-wavelength optical filter and method of manufacturing the same |
Jan. 16, 2007 |
| 7160476 |
Method of manufacturing an electronic device |
Jan. 9, 2007 |
| 7144791 |
Lamination through a mask |
Dec. 5, 2006 |
| 7135383 |
Composite structure with high heat dissipation |
Nov. 14, 2006 |
| 7115480 |
Micromechanical strained semiconductor by wafer bonding |
Oct. 3, 2006 |
| 7105421 |
Silicon on insulator field effect transistor with heterojunction gate |
Sep. 12, 2006 |
| 7094666 |
Method and system for fabricating strained layers for the manufacture of integrated circuits |
Aug. 22, 2006 |
| 7084045 |
Method for manufacturing semiconductor device |
Aug. 1, 2006 |
| 7078317 |
Method and system for source switching and in-situ plasma bonding |
Jul. 18, 2006 |
| 7067352 |
Vertical integrated package apparatus and method |
Jun. 27, 2006 |
| 7060592 |
Image sensor and fabricating method thereof |
Jun. 13, 2006 |
| 7060591 |
Method for fabricating a semiconductor device by transferring a layer to a support with curvature |
Jun. 13, 2006 |
| 7049207 |
Isolating method and transferring method for semiconductor devices |
May. 23, 2006 |
| 7049624 |
Member and member manufacturing method |
May. 23, 2006 |
| 7037804 |
Wafer bonding using a flexible bladder press for three dimensional (3D) vertical stack integration |
May. 2, 2006 |
| 7033868 |
Semiconductor device and method of manufacturing same |
Apr. 25, 2006 |
| 7026706 |
Method and packaging structure for optimizing warpage of flip chip organic packages |
Apr. 11, 2006 |
| 6991948 |
Method of electrical characterization of a silicon-on-insulator (SOI) wafer |
Jan. 31, 2006 |
| 6989291 |
Method for manufacturing circuit devices |
Jan. 24, 2006 |
| 6958535 |
Thermal conductive substrate and semiconductor module using the same |
Oct. 25, 2005 |
| 6953735 |
Method for fabricating a semiconductor device by transferring a layer to a support with curvature |
Oct. 11, 2005 |
| 6946365 |
Method for producing a thin film comprising introduction of gaseous species |
Sep. 20, 2005 |
| 6939778 |
Method of joining an insulator element to a substrate |
Sep. 6, 2005 |
| 6908828 |
Support-integrated donor wafers for repeated thin donor layer separation |
Jun. 21, 2005 |
| 6905911 |
Semiconductor device, method for manufacturing an electronic equipment, electronic equipment, and portable information terminal |
Jun. 14, 2005 |
| 6900113 |
Method for producing bonded wafer and bonded wafer |
May. 31, 2005 |
| 6890834 |
Electronic device and method for manufacturing the same |
May. 10, 2005 |
| 6884718 |
Semiconductor manufacturing process and apparatus for modifying in-film stress of thin films, and product formed thereby |
Apr. 26, 2005 |
| 6865065 |
Semiconductor processing chamber substrate holder method and structure |
Mar. 8, 2005 |
| 6815309 |
Support-integrated donor wafers for repeated thin donor layer separation |
Nov. 9, 2004 |
| 6815278 |
Ultra-thin silicon-on-insulator and strained-silicon-direct-on-insulator with hybrid crystal orientations |
Nov. 9, 2004 |
| 6797591 |
Method for forming a semiconductor device and a semiconductor device formed by the method |
Sep. 28, 2004 |
| 6759277 |
Crystalline silicon die array and method for assembling crystalline silicon sheets onto substrates |
Jul. 6, 2004 |
| 6756285 |
Multilayer structure with controlled internal stresses and making same |
Jun. 29, 2004 |
| 6727549 |
Method of delaminating a pre-fabricated transistor layer from a substrate for placement on another wafer |
Apr. 27, 2004 |
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