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Class Information
Number: 438/457
Name: Semiconductor device manufacturing: process > Bonding of plural semiconductor substrates > Warping of semiconductor substrate
Description: Process for joining plural semiconductive substrates into an integral body including a step of bending one or more of the semiconductor substrates to be joined.










Patents under this class:
1 2 3 4 5

Patent Number Title Of Patent Date Issued
8691663 Methods of manipulating stressed epistructures Apr. 8, 2014
8685833 Stress reduction means for warp control of substrates through clamping Apr. 1, 2014
8664085 Method of manufacturing composite substrate Mar. 4, 2014
8586450 Process for fabricating semiconductor devices and a semiconductor device comprising a chip with through-vias Nov. 19, 2013
8575002 Direct bonding method with reduction in overlay misalignment Nov. 5, 2013
8546238 Method for transferring at least one micro-technological layer Oct. 1, 2013
8536021 Trap rich layer formation techniques for semiconductor devices Sep. 17, 2013
8536022 Method of growing composite substrate using a relaxed strained layer Sep. 17, 2013
8530253 Method of fabricating flexible display device Sep. 10, 2013
8524572 Methods of processing units comprising crystalline materials, and methods of forming semiconductor-on-insulator constructions Sep. 3, 2013
8518804 Semiconductor device manufacturing method and manufacturing apparatus Aug. 27, 2013
8484846 Method of joining components for a composite showerhead electrode assembly for a plasma processing apparatus Jul. 16, 2013
8481405 Trap rich layer with through-silicon-vias in semiconductor devices Jul. 9, 2013
8481408 Relaxation of strained layers Jul. 9, 2013
8475612 Method for molecular adhesion bonding with compensation for radial misalignment Jul. 2, 2013
8461614 Packaging substrate device, method for making the packaging substrate device, and packaged light emitting device Jun. 11, 2013
8431467 Laser working method Apr. 30, 2013
8420449 Laser patterning apparatus and laser patterning method Apr. 16, 2013
8409965 Method and structure for LED with nano-patterned substrate Apr. 2, 2013
8389379 Method for making a stressed structure designed to be dissociated Mar. 5, 2013
8389380 Method for making a substrate of the semiconductor on insulator type with an integrated ground plane Mar. 5, 2013
8383492 Method for the production of thin layer of silicon by utilization of mismatch in coefficient of thermal expansion between screen printed metal layer and silicon mother substrate Feb. 26, 2013
8372726 Methods and applications of non-planar imaging arrays Feb. 12, 2013
8367518 Epitaxial lift off stack having a multi-layered handle and methods thereof Feb. 5, 2013
8354328 Semiconductor device manufacturing method and semiconductor device Jan. 15, 2013
8349702 Method for manufacturing semiconductor substrate Jan. 8, 2013
8343848 Semiconductor device, LED print head and image-forming apparatus using same, and method of manufacturing semiconductor device Jan. 1, 2013
8329493 Stretchable circuit configuration Dec. 11, 2012
8314011 Epitaxial lift off stack having a non-uniform handle and methods thereof Nov. 20, 2012
8309433 Method of manufacturing optical sensor Nov. 13, 2012
8298916 Process for fabricating a multilayer structure with post-grinding trimming Oct. 30, 2012
8288215 Semiconductor device and method for manufacturing the same Oct. 16, 2012
8278186 Wafer cleaning method and wafer bonding method using the same Oct. 2, 2012
8241996 Substrate stiffness method and resulting devices for layer transfer process Aug. 14, 2012
8187934 Reverse construction memory cell May. 29, 2012
8173521 Method for manufacturing bonded wafer May. 8, 2012
8163570 Method of initiating molecular bonding Apr. 24, 2012
8153520 Thinning tungsten layer after through silicon via filling Apr. 10, 2012
8133799 Controlling warping in integrated circuit devices Mar. 13, 2012
8119497 Thin embedded active IC circuit integration techniques for flexible and rigid circuits Feb. 21, 2012
8062961 Method for manufacturing a semiconductor device Nov. 22, 2011
8058146 Peeling method Nov. 15, 2011
8053334 Method for forming silicon oxide film of SOI wafer Nov. 8, 2011
8039276 Manufacturing method of semiconductor device Oct. 18, 2011
8039370 Method of transferring a layer onto a liquid material Oct. 18, 2011
8026154 Laser working method Sep. 27, 2011
8017498 Multiple die structure and method of forming a connection between first and second dies in same Sep. 13, 2011
8008165 Nitride semiconductor wafer and method of processing nitride semiconductor wafer Aug. 30, 2011
8003492 Epitaxial lift off stack having a unidirectionally shrunk handle and methods thereof Aug. 23, 2011
7999400 Semiconductor device with recessed registration marks partially covered and partially uncovered Aug. 16, 2011

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