| |
 |
|
Class Information
Number: 438/456
Name: Semiconductor device manufacturing: process > Bonding of plural semiconductor substrates > Having enclosed cavity
Description: Process for joining plural semiconductive substrates into an integral body resulting in a partially or wholly enclosed void structure therein.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 6613652 |
Method for fabricating SOI devices with option of incorporating air-gap feature for better insulation and performance |
Sep. 2, 2003 |
| 6607934 |
Micro-electromechanical process for fabrication of integrated multi-frequency communication passive components |
Aug. 19, 2003 |
| 6602761 |
Process for production of SOI substrate and process for production of semiconductor device |
Aug. 5, 2003 |
| 6582985 |
SOI/glass process for forming thin silicon micromachined structures |
Jun. 24, 2003 |
| 6566233 |
Method for manufacturing bonded wafer |
May. 20, 2003 |
| 6562127 |
Method of making mosaic array of thin semiconductor material of large substrates |
May. 13, 2003 |
| 6551851 |
Production of diaphragms over a cavity by grinding to reduce wafer thickness |
Apr. 22, 2003 |
| 6548322 |
Micromachined gas-filled chambers and method of microfabrication |
Apr. 15, 2003 |
| 6548391 |
Method of vertically integrating electric components by means of back contacting |
Apr. 15, 2003 |
| 6544863 |
Method of fabricating semiconductor wafers having multiple height subsurface layers |
Apr. 8, 2003 |
| 6537846 |
Substrate bonding using a selenidation reaction |
Mar. 25, 2003 |
| 6531376 |
Method of making a semiconductor device with a low permittivity region |
Mar. 11, 2003 |
| 6527964 |
Methods and apparatuses for improved flow in performing fluidic self assembly |
Mar. 4, 2003 |
| 6524878 |
Microactuator, method for making the same, and magnetic head unit and magnetic recording apparatus using the same |
Feb. 25, 2003 |
| 6524888 |
Method of attaching a conformal chip carrier to a flip chip |
Feb. 25, 2003 |
| 6511866 |
Use of diverse materials in air-cavity packaging of electronic devices |
Jan. 28, 2003 |
| 6495388 |
Surface micro-machined sensor with pedestal |
Dec. 17, 2002 |
| 6479366 |
Method of manufacturing a semiconductor device with air gaps formed between metal leads |
Nov. 12, 2002 |
| 6475880 |
Cassette invertor method |
Nov. 5, 2002 |
| 6458618 |
Robust substrate-based micromachining techniques and their application to micromachined sensors and actuators |
Oct. 1, 2002 |
| 6451668 |
Method of producing calibration structures in semiconductor substrates |
Sep. 17, 2002 |
| 6426287 |
Method for forming a semiconductor connection with a top surface having an enlarged recess |
Jul. 30, 2002 |
| 6417075 |
Method for producing thin substrate layers |
Jul. 9, 2002 |
| 6395374 |
Method of making microwave, multifunction modules using fluoropolymer composite substrates |
May. 28, 2002 |
| 6391742 |
Small size electronic part and a method for manufacturing the same, and a method for forming a via hole for use in the same |
May. 21, 2002 |
| 6380048 |
Die paddle enhancement for exposed pad in semiconductor packaging |
Apr. 30, 2002 |
| 6372608 |
Separating method, method for transferring thin film device, thin film device, thin film integrated circuit device, and liquid crystal display device manufactured by using the transferring met |
Apr. 16, 2002 |
| 6372609 |
Method of Fabricating SOI wafer by hydrogen ION delamination method and SOI wafer fabricated by the method |
Apr. 16, 2002 |
| 6362075 |
Method for making a diffused back-side layer on a bonded-wafer with a thick bond oxide |
Mar. 26, 2002 |
| 6352875 |
Photoelectric conversion apparatus and method of manufacturing the same |
Mar. 5, 2002 |
| 6348358 |
Emitter array with individually addressable laser diodes |
Feb. 19, 2002 |
| 6335226 |
Digital signal processor/known good die packaging using rerouted existing package for test and burn-in carriers |
Jan. 1, 2002 |
| 6306680 |
Power overlay chip scale packages for discrete power devices |
Oct. 23, 2001 |
| 6297072 |
Method of fabrication of a microstructure having an internal cavity |
Oct. 2, 2001 |
| 6277666 |
Precisely defined microelectromechanical structures and associated fabrication methods |
Aug. 21, 2001 |
| 6261871 |
Method and structure for temperature stabilization in flip chip technology |
Jul. 17, 2001 |
| 6248646 |
Discrete wafer array process |
Jun. 19, 2001 |
| 6242319 |
Method for fabricating an integrated circuit configuration |
Jun. 5, 2001 |
| 6235611 |
Method for making silicon-on-sapphire transducers |
May. 22, 2001 |
| 6235612 |
Edge bond pads on integrated circuits |
May. 22, 2001 |
| 6232150 |
Process for making microstructures and microstructures made thereby |
May. 15, 2001 |
| 6232140 |
Semiconductor integrated capacitive acceleration sensor and relative fabrication method |
May. 15, 2001 |
| 6229158 |
Stacked die integrated circuit device |
May. 8, 2001 |
| 6210989 |
Ultra thin surface mount wafer sensor structures and methods for fabricating same |
Apr. 3, 2001 |
| 6150188 |
Integrated circuits using optical fiber interconnects formed through a semiconductor wafer and methods for forming same |
Nov. 21, 2000 |
| 6146917 |
Fabrication method for encapsulated micromachined structures |
Nov. 14, 2000 |
| 6143629 |
Process for producing semiconductor substrate |
Nov. 7, 2000 |
| 6143583 |
Dissolved wafer fabrication process and associated microelectromechanical device having a support substrate with spacing mesas |
Nov. 7, 2000 |
| 6130141 |
Flip chip metallization |
Oct. 10, 2000 |
| 6127243 |
Method for bonding two wafers |
Oct. 3, 2000 |
|
|
|
