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Class Information
Number: 438/456
Name: Semiconductor device manufacturing: process > Bonding of plural semiconductor substrates > Having enclosed cavity
Description: Process for joining plural semiconductive substrates into an integral body resulting in a partially or wholly enclosed void structure therein.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 6930021 |
Mask and method of manufacturing the same, electro-luminescence device and method of manufacturing the same, and electronic instrument |
Aug. 16, 2005 |
| 6908828 |
Support-integrated donor wafers for repeated thin donor layer separation |
Jun. 21, 2005 |
| 6905945 |
Microwave bonding of MEMS component |
Jun. 14, 2005 |
| 6900113 |
Method for producing bonded wafer and bonded wafer |
May. 31, 2005 |
| 6893936 |
Method of Forming strained SI/SIGE on insulator with silicon germanium buffer |
May. 17, 2005 |
| 6890778 |
Vertical cavity surface emitting laser and a method of fabrication thereof |
May. 10, 2005 |
| 6890834 |
Electronic device and method for manufacturing the same |
May. 10, 2005 |
| 6881648 |
Semiconductor wafer having a thin die and tethers and methods of making the same |
Apr. 19, 2005 |
| 6879035 |
Vacuum package fabrication of integrated circuit components |
Apr. 12, 2005 |
| 6878638 |
Multi-level integrated circuit for wide-gap substrate bonding |
Apr. 12, 2005 |
| 6878566 |
Method of reinforcing a mechanical microstructure |
Apr. 12, 2005 |
| 6875671 |
Method of fabricating vertical integrated circuits |
Apr. 5, 2005 |
| 6875633 |
Process for production of SOI substrate and process for production of semiconductor device |
Apr. 5, 2005 |
| 6872902 |
MEMS device with integral packaging |
Mar. 29, 2005 |
| 6872650 |
Ball electrode forming method |
Mar. 29, 2005 |
| 6867073 |
Single mask via method and device |
Mar. 15, 2005 |
| 6852570 |
Method of manufacturing a stacked semiconductor device |
Feb. 8, 2005 |
| 6852926 |
Packaging microelectromechanical structures |
Feb. 8, 2005 |
| 6852574 |
Method of forming a leadframe for a semiconductor package |
Feb. 8, 2005 |
| 6846725 |
Wafer-level package for micro-electro-mechanical systems |
Jan. 25, 2005 |
| 6846724 |
Method for fabricating a microelectromechanical system (MEMS) device using a pre-patterned bridge |
Jan. 25, 2005 |
| 6844241 |
Fabrication of semiconductor structures having multiple conductive layers in an opening |
Jan. 18, 2005 |
| 6838362 |
Process for manufacturing a through insulated interconnection in a body of semiconductor material |
Jan. 4, 2005 |
| 6825055 |
Method for assembling integral type electronic component and integral type electronic component |
Nov. 30, 2004 |
| 6825098 |
Method for fabricating microstructures and arrangement of microstructures |
Nov. 30, 2004 |
| 6818530 |
Exfoliating method, transferring method of thin film device, and thin film device, thin film integrated circuit device, and liquid crystal display device produced by the same |
Nov. 16, 2004 |
| 6815739 |
Radio frequency microelectromechanical systems (MEMS) devices on low-temperature co-fired ceramic (LTCC) substrates |
Nov. 9, 2004 |
| 6815278 |
Ultra-thin silicon-on-insulator and strained-silicon-direct-on-insulator with hybrid crystal orientations |
Nov. 9, 2004 |
| 6815309 |
Support-integrated donor wafers for repeated thin donor layer separation |
Nov. 9, 2004 |
| 6808955 |
Method of fabricating an integrated circuit that seals a MEMS device within a cavity |
Oct. 26, 2004 |
| 6797591 |
Method for forming a semiconductor device and a semiconductor device formed by the method |
Sep. 28, 2004 |
| 6794271 |
Method for fabricating a microelectromechanical system (MEMS) device using a pre-patterned bridge |
Sep. 21, 2004 |
| 6790775 |
Method of forming a through-substrate interconnect |
Sep. 14, 2004 |
| 6767757 |
High-vacuum packaged microgyroscope and method for manufacturing the same |
Jul. 27, 2004 |
| 6753205 |
Method for manufacturing a structure comprising a substrate with a cavity and a semiconductor integrated circuit bonded to a contact pad located in the cavity |
Jun. 22, 2004 |
| 6736983 |
Method for producing microcomponents |
May. 18, 2004 |
| 6737338 |
Pattern forming method for a display device |
May. 18, 2004 |
| 6730990 |
Mountable microstructure and optical transmission apparatus |
May. 4, 2004 |
| 6727549 |
Method of delaminating a pre-fabricated transistor layer from a substrate for placement on another wafer |
Apr. 27, 2004 |
| 6723579 |
Semiconductor wafer comprising micro-machined components and a method for fabricating the semiconductor wafer |
Apr. 20, 2004 |
| 6716666 |
Wafer scale molding of protective caps |
Apr. 6, 2004 |
| 6716661 |
Process to fabricate an integrated micro-fluidic system on a single wafer |
Apr. 6, 2004 |
| 6713314 |
Hermetically packaging a microelectromechanical switch and a film bulk acoustic resonator |
Mar. 30, 2004 |
| 6696369 |
Method of creating shielded structures to protect semiconductor devices |
Feb. 24, 2004 |
| 6689627 |
Process for manufacturing micromechanical components in a semiconductor material wafer with reduction in the starting wafer thickness |
Feb. 10, 2004 |
| 6686642 |
Multi-level integrated circuit for wide-gap substrate bonding |
Feb. 3, 2004 |
| 6677219 |
Method of forming a ball grid array package |
Jan. 13, 2004 |
| 6673189 |
Method for producing a stable bond between two wafers |
Jan. 6, 2004 |
| 6673697 |
Packaging microelectromechanical structures |
Jan. 6, 2004 |
| 6673694 |
Method for microfabricating structures using silicon-on-insulator material |
Jan. 6, 2004 |
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