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Class Information
Number: 438/456
Name: Semiconductor device manufacturing: process > Bonding of plural semiconductor substrates > Having enclosed cavity
Description: Process for joining plural semiconductive substrates into an integral body resulting in a partially or wholly enclosed void structure therein.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7354799 |
Methods for anchoring a seal ring to a substrate using vias and assemblies including an anchored seal ring |
Apr. 8, 2008 |
| 7351641 |
Structure and method of forming capped chips |
Apr. 1, 2008 |
| 7351603 |
Process of making a microtube and microfluidic devices formed therewith |
Apr. 1, 2008 |
| 7348257 |
Process for manufacturing wafers of semiconductor material by layer transfer |
Mar. 25, 2008 |
| 7341924 |
Method for manufacturing semiconductor device |
Mar. 11, 2008 |
| 7338896 |
Formation of deep via airgaps for three dimensional wafer to wafer interconnect |
Mar. 4, 2008 |
| 7332411 |
Systems and methods for wafer bonding by localized induction heating |
Feb. 19, 2008 |
| 7332413 |
Semiconductor wafers including one or more reinforcement structures and methods of forming the same |
Feb. 19, 2008 |
| 7320928 |
Method of forming a stacked device filler |
Jan. 22, 2008 |
| 7307005 |
Wafer bonding with highly compliant plate having filler material enclosed hollow core |
Dec. 11, 2007 |
| 7303976 |
Wafer bonding method |
Dec. 4, 2007 |
| 7300813 |
Method for manufacturing micro-machined switch using pull-up type contact pad |
Nov. 27, 2007 |
| 7300823 |
Apparatus for housing a micromechanical structure and method for producing the same |
Nov. 27, 2007 |
| 7297562 |
Circuit-on-foil process for manufacturing a laminated semiconductor package substrate having embedded conductive patterns |
Nov. 20, 2007 |
| 7291513 |
Hermetic wafer-level packaging for MEMS devices with low-temperature metallurgy |
Nov. 6, 2007 |
| 7288464 |
MEMS packaging structure and methods |
Oct. 30, 2007 |
| 7285844 |
Multiple internal seal right micro-electro-mechanical system vacuum package |
Oct. 23, 2007 |
| 7265027 |
Bond method and structure using selective application of spin on glass |
Sep. 4, 2007 |
| 7259080 |
Glass-type planar substrate, use thereof, and method for the production thereof |
Aug. 21, 2007 |
| 7244663 |
Wafer reinforcement structure and methods of fabrication |
Jul. 17, 2007 |
| 7214324 |
Technique for manufacturing micro-electro mechanical structures |
May. 8, 2007 |
| 7205211 |
Method for handling semiconductor layers in such a way as to thin same |
Apr. 17, 2007 |
| 7192841 |
Method of wafer/substrate bonding |
Mar. 20, 2007 |
| 7192842 |
Method for bonding wafers |
Mar. 20, 2007 |
| 7176106 |
Wafer bonding using reactive foils for massively parallel micro-electromechanical systems packaging |
Feb. 13, 2007 |
| 7176107 |
Hybrid substrate and method for fabricating the same |
Feb. 13, 2007 |
| 7176072 |
Strained silicon devices transfer to glass for display applications |
Feb. 13, 2007 |
| 7163872 |
Tunable-wavelength optical filter and method of manufacturing the same |
Jan. 16, 2007 |
| 7160478 |
Method for producing electronic componets |
Jan. 9, 2007 |
| 7160476 |
Method of manufacturing an electronic device |
Jan. 9, 2007 |
| 7153718 |
Micromechanical component as well as a method for producing a micromechanical component |
Dec. 26, 2006 |
| 7141176 |
Methods and apparatuses for assembling elements onto a substrate |
Nov. 28, 2006 |
| 7135383 |
Composite structure with high heat dissipation |
Nov. 14, 2006 |
| 7118991 |
Encapsulation wafer process |
Oct. 10, 2006 |
| 7105421 |
Silicon on insulator field effect transistor with heterojunction gate |
Sep. 12, 2006 |
| 7098117 |
Method of fabricating a package with substantially vertical feedthroughs for micromachined or MEMS devices |
Aug. 29, 2006 |
| 7094665 |
Exfoliating method, transferring method of thin film device, and thin film device, thin film integrated circuit device, and liquid crystal display device produced by the same |
Aug. 22, 2006 |
| 7090325 |
Liquid drop discharge head and manufacture method thereof, micro device ink-jet head ink cartridge and ink-jet printing device |
Aug. 15, 2006 |
| 7084045 |
Method for manufacturing semiconductor device |
Aug. 1, 2006 |
| 7078317 |
Method and system for source switching and in-situ plasma bonding |
Jul. 18, 2006 |
| 7078318 |
Method for depositing III-V semiconductor layers on a non-III-V substrate |
Jul. 18, 2006 |
| 7078320 |
Partial wafer bonding and dicing |
Jul. 18, 2006 |
| 7071012 |
Methods relating to the reconstruction of semiconductor wafers for wafer-level processing |
Jul. 4, 2006 |
| 7069652 |
Method for producing laminated smart cards |
Jul. 4, 2006 |
| 7067344 |
Method of manufacturing an external force detection sensor |
Jun. 27, 2006 |
| RE39143 |
Method for making a wafer-pair having sealed chambers |
Jun. 27, 2006 |
| 7064004 |
Induction-based heating for chip attach |
Jun. 20, 2006 |
| 7056807 |
Barrier structure against corrosion and contamination in three-dimensional (3-D) wafer-to-wafer vertical stack |
Jun. 6, 2006 |
| 7052948 |
Film or layer made of semi-conductive material and method for producing said film or layer |
May. 30, 2006 |
| 7049624 |
Member and member manufacturing method |
May. 23, 2006 |
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