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Class Information
Number: 438/456
Name: Semiconductor device manufacturing: process > Bonding of plural semiconductor substrates > Having enclosed cavity
Description: Process for joining plural semiconductive substrates into an integral body resulting in a partially or wholly enclosed void structure therein.










Patents under this class:
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Patent Number Title Of Patent Date Issued
8711897 Split-ring resonator creating a photonic metamaterial Apr. 29, 2014
8691658 Orientation of an electronic CMOS structure with respect to a buried structure in the case of a bonded and thinned-back stack of semiconductor wafers Apr. 8, 2014
8692257 Display apparatus and method of manufacturing the display apparatus Apr. 8, 2014
8685834 Fabrication method of package structure with simplified encapsulation structure and simplified wiring Apr. 1, 2014
8670246 Computers including an undiced semiconductor wafer with Faraday Cages and internal flexibility sipes Mar. 11, 2014
8664083 Vertical outgassing channels Mar. 4, 2014
8664085 Method of manufacturing composite substrate Mar. 4, 2014
8664082 Combination of a substrate and a wafer Mar. 4, 2014
8664028 Semiconductor device production process Mar. 4, 2014
8656740 Manufacturing method of glass-sealed package, and glass substrate Feb. 25, 2014
8647962 Wafer level packaging bond Feb. 11, 2014
8636912 Package for an electronic device Jan. 28, 2014
8633088 Glass frit wafer bond protective structure Jan. 21, 2014
8633048 Method for fabricating package structure having MEMS elements Jan. 21, 2014
8592952 Semiconductor chip and semiconductor package with stack chip structure Nov. 26, 2013
8585910 Process of making a microtube and microfluidic devices formed therewith Nov. 19, 2013
8586450 Process for fabricating semiconductor devices and a semiconductor device comprising a chip with through-vias Nov. 19, 2013
8569090 Wafer level structures and methods for fabricating and packaging MEMS Oct. 29, 2013
8564085 CMOS image sensor structure Oct. 22, 2013
8547278 Sensing device having multi beam antenna array Oct. 1, 2013
8546952 Electrical test structure applying 3D-ICS bonding technology for stacking error measurement Oct. 1, 2013
8546903 Ionic isolation ring Oct. 1, 2013
8536020 Combination of a substrate and a wafer Sep. 17, 2013
8536021 Trap rich layer formation techniques for semiconductor devices Sep. 17, 2013
8530256 Production process for semiconductor device Sep. 10, 2013
8524571 Vacuum wafer level packaging method for micro electro mechanical system device Sep. 3, 2013
8518725 Structure manufacturing method and liquid discharge head substrate manufacturing method Aug. 27, 2013
8513094 Method of manufacturing semiconductor device Aug. 20, 2013
8507360 Transfer method of functional region, LED array, LED printer head, and LED printer Aug. 13, 2013
8507930 Organic light emitting diode display including a sealant auxiliary structure and method of manufacturing the same Aug. 13, 2013
8502399 Resin composition for encapsulating semiconductor and semiconductor device Aug. 6, 2013
8497186 Semiconductor devices and methods for forming patterned radiation blocking on a semiconductor device Jul. 30, 2013
8486744 Multiple bonding in wafer level packaging Jul. 16, 2013
8481405 Trap rich layer with through-silicon-vias in semiconductor devices Jul. 9, 2013
8470631 Method for manufacturing capped MEMS components Jun. 25, 2013
8461614 Packaging substrate device, method for making the packaging substrate device, and packaged light emitting device Jun. 11, 2013
8454851 Manufacturing method of the flexible display device Jun. 4, 2013
8455287 Method for manufacturing semiconductor device including microstructure Jun. 4, 2013
8455365 Self-aligned carbon electronics with embedded gate electrode Jun. 4, 2013
8445323 Semiconductor package with semiconductor core structure and method of forming same May. 21, 2013
8440543 Hybrid circuit structure and partial backfill method for improving thermal cycling reliability of same May. 14, 2013
8435821 Sensor and method for fabricating the same May. 7, 2013
8425715 Apparatus for high throughput wafer bonding Apr. 23, 2013
8426233 Methods of packaging microelectromechanical resonators Apr. 23, 2013
8415230 Method for transferring functional regions, LED array, LED printer head, and LED printer Apr. 9, 2013
8399299 Cavity structure comprising an adhesion interface composed of getter material Mar. 19, 2013
8390111 Wafer bonding method Mar. 5, 2013
8389380 Method for making a substrate of the semiconductor on insulator type with an integrated ground plane Mar. 5, 2013
8389379 Method for making a stressed structure designed to be dissociated Mar. 5, 2013
8378480 Dummy wafers in 3DIC package assemblies Feb. 19, 2013

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