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Class Information
Number: 438/456
Name: Semiconductor device manufacturing: process > Bonding of plural semiconductor substrates > Having enclosed cavity
Description: Process for joining plural semiconductive substrates into an integral body resulting in a partially or wholly enclosed void structure therein.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7615462 |
Etch stop layer for silicon (Si) via etch in three-dimensional (3-D) wafer-to-wafer vertical stack |
Nov. 10, 2009 |
| 7605054 |
Method of forming a device wafer with recyclable support |
Oct. 20, 2009 |
| 7598118 |
Method of manufacturing semiconductor sensor |
Oct. 6, 2009 |
| 7595545 |
Anodic bonding apparatus, anodic bonding method, and method of producing acceleration sensor |
Sep. 29, 2009 |
| 7585747 |
Low temperature hermetic bonding at water level and method of bonding for micro display application |
Sep. 8, 2009 |
| 7578891 |
Adhesive bonding sheet, semiconductor device using the same, and method for manufacturing such semiconductor device |
Aug. 25, 2009 |
| 7575955 |
Method for making electronic packages |
Aug. 18, 2009 |
| 7573006 |
Apparatus relating to the reconstruction of semiconductor wafers for wafer-level processing |
Aug. 11, 2009 |
| 7563692 |
Microelectromechanical system pressure sensor and method for making and using |
Jul. 21, 2009 |
| 7563691 |
Method for plasma enhanced bonding and bonded structures formed by plasma enhanced bonding |
Jul. 21, 2009 |
| 7557898 |
Substrate gap adjusting device, substrate gap adjusting method, and method of manufacturing liquid crystal display device, comprising substrate pressing sections that independently transmit fo |
Jul. 7, 2009 |
| 7553695 |
Method of fabricating a package for a micro component |
Jun. 30, 2009 |
| 7550365 |
Bonding structure and method of making |
Jun. 23, 2009 |
| 7547579 |
Underfill process |
Jun. 16, 2009 |
| 7534641 |
Method for manufacturing a micro-electro-mechanical device |
May. 19, 2009 |
| 7528050 |
High performance field effect transistors on SOI substrate with stress-inducing material as buried insulator and methods |
May. 5, 2009 |
| 7528000 |
Method of fabricating optical device caps |
May. 5, 2009 |
| 7518251 |
Stacked electronics for sensors |
Apr. 14, 2009 |
| 7514289 |
Methods and structures for facilitating proximity communication |
Apr. 7, 2009 |
| 7510947 |
Method for wafer level packaging and fabricating cap structures |
Mar. 31, 2009 |
| 7494848 |
Flip-chip packaging of a photo-sensor die on a transparent substrate |
Feb. 24, 2009 |
| 7473618 |
Temporary structure to reduce stress and warpage in a flip chip organic package |
Jan. 6, 2009 |
| 7473607 |
Method of manufacturing a multi-workfunction gates for a CMOS circuit |
Jan. 6, 2009 |
| 7459373 |
Method for fabricating and separating semiconductor devices |
Dec. 2, 2008 |
| 7456051 |
Photoelectric device grinding process and device grinding process |
Nov. 25, 2008 |
| 7449765 |
Semiconductor device and method of fabrication |
Nov. 11, 2008 |
| 7439092 |
Thin film splitting method |
Oct. 21, 2008 |
| 7429495 |
System and method of fabricating micro cavities |
Sep. 30, 2008 |
| 7422928 |
Process for fabricating a micro-electro-mechanical system with movable components |
Sep. 9, 2008 |
| 7422962 |
Method of singulating electronic devices |
Sep. 9, 2008 |
| 7410828 |
Method of creating a predefined internal pressure within a cavity of a semiconductor device |
Aug. 12, 2008 |
| 7410886 |
Method for fabricating protective caps for protecting elements on a wafer surface |
Aug. 12, 2008 |
| 7402799 |
MEMS mass spectrometer |
Jul. 22, 2008 |
| 7402501 |
Method of manufacturing a coaxial trace in a surrounding material, coaxial trace formed thereby, and semiconducting material containing same |
Jul. 22, 2008 |
| 7399652 |
Method for manufacturing a micro-electro-mechanical device, in particular an optical microswitch, and micro-electro-mechanical device thus obtained |
Jul. 15, 2008 |
| 7396476 |
Method for reducing harmonic distortion in comb drive devices |
Jul. 8, 2008 |
| 7396740 |
Method of producing a device with a movable portion |
Jul. 8, 2008 |
| 7396741 |
Method for connecting substrate and composite element |
Jul. 8, 2008 |
| 7396478 |
Multiple internal seal ring micro-electro-mechanical system vacuum packaging method |
Jul. 8, 2008 |
| 7393714 |
Method of manufacturing external force detection sensor |
Jul. 1, 2008 |
| 7381628 |
Process of making a microtube and microfluidic devices formed therewith |
Jun. 3, 2008 |
| 7354799 |
Methods for anchoring a seal ring to a substrate using vias and assemblies including an anchored seal ring |
Apr. 8, 2008 |
| 7351603 |
Process of making a microtube and microfluidic devices formed therewith |
Apr. 1, 2008 |
| 7351641 |
Structure and method of forming capped chips |
Apr. 1, 2008 |
| 7348257 |
Process for manufacturing wafers of semiconductor material by layer transfer |
Mar. 25, 2008 |
| 7341924 |
Method for manufacturing semiconductor device |
Mar. 11, 2008 |
| 7338896 |
Formation of deep via airgaps for three dimensional wafer to wafer interconnect |
Mar. 4, 2008 |
| 7332413 |
Semiconductor wafers including one or more reinforcement structures and methods of forming the same |
Feb. 19, 2008 |
| 7332411 |
Systems and methods for wafer bonding by localized induction heating |
Feb. 19, 2008 |
| 7320928 |
Method of forming a stacked device filler |
Jan. 22, 2008 |
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