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Class Information
Number: 438/455
Name: Semiconductor device manufacturing: process > Bonding of plural semiconductor substrates
Description: Process in which plural semiconductive substrates are joined together into a coherent body, such as by thermal treatment.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 6844244 |
Dual sided lithographic substrate imaging |
Jan. 18, 2005 |
| 6844242 |
Method of manufacturing SOI wafer |
Jan. 18, 2005 |
| 6844243 |
Methods of forming semiconductor constructions |
Jan. 18, 2005 |
| 6841453 |
Process for manufacturing integrated devices having connections on a separate wafer, and integrated device thus obtained |
Jan. 11, 2005 |
| 6841450 |
Annealed wafer manufacturing method and annealed wafer |
Jan. 11, 2005 |
| 6841848 |
Composite semiconductor wafer and a method for forming the composite semiconductor wafer |
Jan. 11, 2005 |
| 6830958 |
Method of making chip scale package |
Dec. 14, 2004 |
| 6828214 |
Semiconductor member manufacturing method and semiconductor device manufacturing method |
Dec. 7, 2004 |
| 6828215 |
Device and method for core buildup using a separator |
Dec. 7, 2004 |
| 6825532 |
Bonded substrate for an integrated circuit containing a planar intrinsic gettering zone |
Nov. 30, 2004 |
| 6821803 |
Method of manufacturing an electroluminescence display device |
Nov. 23, 2004 |
| 6821826 |
Three dimensional CMOS integrated circuits having device layers built on different crystal oriented wafers |
Nov. 23, 2004 |
| 6818529 |
Apparatus and method for forming a silicon film across the surface of a glass substrate |
Nov. 16, 2004 |
| 6817073 |
Method of manufacturing a thin film piezoelectric element |
Nov. 16, 2004 |
| 6818530 |
Exfoliating method, transferring method of thin film device, and thin film device, thin film integrated circuit device, and liquid crystal display device produced by the same |
Nov. 16, 2004 |
| 6818470 |
Process for producing a thermoelectric converter |
Nov. 16, 2004 |
| 6818531 |
Method for manufacturing vertical GaN light emitting diodes |
Nov. 16, 2004 |
| 6815739 |
Radio frequency microelectromechanical systems (MEMS) devices on low-temperature co-fired ceramic (LTCC) substrates |
Nov. 9, 2004 |
| 6815309 |
Support-integrated donor wafers for repeated thin donor layer separation |
Nov. 9, 2004 |
| 6815312 |
Bonding type semiconductor substrate, semiconductor light emitting element, and preparation process thereof |
Nov. 9, 2004 |
| 6815278 |
Ultra-thin silicon-on-insulator and strained-silicon-direct-on-insulator with hybrid crystal orientations |
Nov. 9, 2004 |
| 6815252 |
Method of forming flip chip interconnection structure |
Nov. 9, 2004 |
| 6814832 |
Method for transferring element, method for producing element, integrated circuit, circuit board, electro-optical device, IC card, and electronic appliance |
Nov. 9, 2004 |
| 6812116 |
Method of fabricating a wafer with strained channel layers for increased electron and hole mobility for improving device performance |
Nov. 2, 2004 |
| 6812074 |
SOI field effect transistor element having a recombination region and method of forming same |
Nov. 2, 2004 |
| 6809007 |
Method and a carrier for treating end facets in photonic devices |
Oct. 26, 2004 |
| 6809008 |
Integrated photosensor for CMOS imagers |
Oct. 26, 2004 |
| 6806538 |
SOI semiconductor device |
Oct. 19, 2004 |
| 6803264 |
Method of fabricating a semiconductor device |
Oct. 12, 2004 |
| 6802926 |
Method of producing semiconductor thin film and method of producing solar cell using same |
Oct. 12, 2004 |
| 6800500 |
III-nitride light emitting devices fabricated by substrate removal |
Oct. 5, 2004 |
| 6800537 |
Methods of making anisotropic conductive elements for use in microelectronic packaging |
Oct. 5, 2004 |
| 6797604 |
Method for manufacturing device substrate with metal back-gate and structure formed thereby |
Sep. 28, 2004 |
| 6797591 |
Method for forming a semiconductor device and a semiconductor device formed by the method |
Sep. 28, 2004 |
| 6794276 |
Methods for fabricating a substrate |
Sep. 21, 2004 |
| 6793829 |
Bonding for a micro-electro-mechanical system (MEMS) and MEMS based devices |
Sep. 21, 2004 |
| 6794221 |
Method of placing elements into receptors in a substrate |
Sep. 21, 2004 |
| 6794271 |
Method for fabricating a microelectromechanical system (MEMS) device using a pre-patterned bridge |
Sep. 21, 2004 |
| 6790690 |
Method of manufacturing a display device |
Sep. 14, 2004 |
| 6787383 |
Light-emitting device and method for manufacturing the same |
Sep. 7, 2004 |
| 6784021 |
Semiconductor device, method of fabricating the same and semiconductor device fabricating apparatus |
Aug. 31, 2004 |
| 6780733 |
Thinned semiconductor wafer and die and corresponding method |
Aug. 24, 2004 |
| 6781222 |
Semiconductor package having vertically mounted passive devices under a chip and a fabricating method thereof |
Aug. 24, 2004 |
| 6777263 |
Film deposition to enhance sealing yield of microcap wafer-level package with vias |
Aug. 17, 2004 |
| 6774327 |
Hermetic seals for electronic components |
Aug. 10, 2004 |
| 6774010 |
Transferable device-containing layer for silicon-on-insulator applications |
Aug. 10, 2004 |
| 6774009 |
Silicon target assembly |
Aug. 10, 2004 |
| 6773951 |
Method of manufacture of a semiconductor structure |
Aug. 10, 2004 |
| 6774477 |
Structure and method of stacking multiple semiconductor substrates of a composite semiconductor device |
Aug. 10, 2004 |
| 6770542 |
Method for fabricating semiconductor layers |
Aug. 3, 2004 |
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