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Class Information
Number: 438/455
Name: Semiconductor device manufacturing: process > Bonding of plural semiconductor substrates
Description: Process in which plural semiconductive substrates are joined together into a coherent body, such as by thermal treatment.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 6908828 |
Support-integrated donor wafers for repeated thin donor layer separation |
Jun. 21, 2005 |
| 6908845 |
Integrated circuit die and an electronic assembly having a three-dimensional interconnection scheme |
Jun. 21, 2005 |
| 6905946 |
Thin flip-chip method |
Jun. 14, 2005 |
| 6905945 |
Microwave bonding of MEMS component |
Jun. 14, 2005 |
| 6903420 |
Silicon-on-insulator comprising integrated circuitry |
Jun. 7, 2005 |
| 6902987 |
Method for low temperature bonding and bonded structure |
Jun. 7, 2005 |
| 6900113 |
Method for producing bonded wafer and bonded wafer |
May. 31, 2005 |
| 6900114 |
Separating apparatus, separating method, and method of manufacturing semiconductor substrate |
May. 31, 2005 |
| 6897125 |
Methods of forming backside connections on a wafer stack |
May. 24, 2005 |
| 6897123 |
Bonding of parts with dissimilar thermal expansion coefficients |
May. 24, 2005 |
| 6893896 |
Method for making multilayer thin-film electronics |
May. 17, 2005 |
| 6893941 |
Semiconductor device and its manufacture method |
May. 17, 2005 |
| 6893932 |
Heterojunction bipolar transistor containing at least one silicon carbide layer |
May. 17, 2005 |
| 6890793 |
Method for producing a semiconductor die package using leadframe with locating holes |
May. 10, 2005 |
| 6890834 |
Electronic device and method for manufacturing the same |
May. 10, 2005 |
| 6887342 |
Field-assisted fusion bonding |
May. 3, 2005 |
| 6887770 |
Method for fabricating semiconductor device |
May. 3, 2005 |
| 6887769 |
Dielectric recess for wafer-to-wafer and die-to-die metal bonding and method of fabricating the same |
May. 3, 2005 |
| 6884694 |
Method of fabricating nano SOI wafer and nano SOI wafer fabricated by the same |
Apr. 26, 2005 |
| 6881632 |
Method of fabricating CMOS inverter and integrated circuits utilizing strained surface channel MOSFETS |
Apr. 19, 2005 |
| 6881647 |
Synthesis of layers, coatings or films using templates |
Apr. 19, 2005 |
| 6881648 |
Semiconductor wafer having a thin die and tethers and methods of making the same |
Apr. 19, 2005 |
| 6878608 |
Method of manufacture of silicon based package |
Apr. 12, 2005 |
| 6878607 |
Thin film device transfer method, thin film device, thin film integrated circuit device, active matrix board, liquid crystal display, and electronic apparatus |
Apr. 12, 2005 |
| 6875671 |
Method of fabricating vertical integrated circuits |
Apr. 5, 2005 |
| 6875636 |
Wafer applied thermally conductive interposer |
Apr. 5, 2005 |
| 6875633 |
Process for production of SOI substrate and process for production of semiconductor device |
Apr. 5, 2005 |
| 6867508 |
Method and apparatus for fabricating semiconductor laser device |
Mar. 15, 2005 |
| 6867110 |
Separating apparatus and processing method for plate member |
Mar. 15, 2005 |
| 6867073 |
Single mask via method and device |
Mar. 15, 2005 |
| 6867067 |
Methods for fabricating final substrates |
Mar. 15, 2005 |
| 6866741 |
Method for joining large substrates |
Mar. 15, 2005 |
| 6865798 |
Method for shaping air bearing surface of magnetic head slider |
Mar. 15, 2005 |
| 6864155 |
Methods of forming silicon-on-insulator comprising integrated circuitry, and wafer bonding methods of forming silicon-on-insulator comprising integrated circuitry |
Mar. 8, 2005 |
| 6864153 |
Methods employing hybrid adhesive materials to secure components of semiconductor device assemblies and packages to one another |
Mar. 8, 2005 |
| 6858518 |
Method for manufacturing semiconductor integrated circuit |
Feb. 22, 2005 |
| 6858468 |
Techniques for joining an opto-electronic module to a semiconductor package |
Feb. 22, 2005 |
| 6858517 |
Methods of producing a heterogeneous semiconductor structure |
Feb. 22, 2005 |
| 6852187 |
Method and apparatus for separating member |
Feb. 8, 2005 |
| 6852653 |
Method of manufacturing semiconductor substrate, semiconductor substrate, electro-optical apparatus and electronic equipment |
Feb. 8, 2005 |
| 6852570 |
Method of manufacturing a stacked semiconductor device |
Feb. 8, 2005 |
| 6849522 |
Method of press-working inorganic substrate and press machine therefor |
Feb. 1, 2005 |
| 6849950 |
Semiconductor device and method of manufacturing same |
Feb. 1, 2005 |
| 6846690 |
Integrated circuit comprising an auxiliary component, for example a passive component or a microelectromechanical system, placed above an electronic chip, and the corresponding fabrication pro |
Jan. 25, 2005 |
| 6846703 |
Three-dimensional device |
Jan. 25, 2005 |
| 6846723 |
Semiconductor substrate, semiconductor device, and processes of production of same |
Jan. 25, 2005 |
| 6846724 |
Method for fabricating a microelectromechanical system (MEMS) device using a pre-patterned bridge |
Jan. 25, 2005 |
| 6846697 |
Integrated circuit packages and the method for making the same |
Jan. 25, 2005 |
| 6844243 |
Methods of forming semiconductor constructions |
Jan. 18, 2005 |
| 6844244 |
Dual sided lithographic substrate imaging |
Jan. 18, 2005 |
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