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Class Information
Number: 438/455
Name: Semiconductor device manufacturing: process > Bonding of plural semiconductor substrates
Description: Process in which plural semiconductive substrates are joined together into a coherent body, such as by thermal treatment.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7135383 |
Composite structure with high heat dissipation |
Nov. 14, 2006 |
| 7132309 |
Semiconductor-on-diamond devices and methods of forming |
Nov. 7, 2006 |
| 7129172 |
Bonded wafer processing method |
Oct. 31, 2006 |
| 7122444 |
Manufacturing method of thin film device substrate |
Oct. 17, 2006 |
| 7118990 |
Methods for making large dimension, flexible piezoelectric ceramic tapes |
Oct. 10, 2006 |
| 7118989 |
Method of forming vias on a wafer stack using laser ablation |
Oct. 10, 2006 |
| 7112502 |
Method to fabricate passive components using conductive polymer |
Sep. 26, 2006 |
| 7109071 |
Semiconductor device and manufacturing method thereof |
Sep. 19, 2006 |
| 7105376 |
Self-location method and apparatus |
Sep. 12, 2006 |
| 7105421 |
Silicon on insulator field effect transistor with heterojunction gate |
Sep. 12, 2006 |
| 7105422 |
Thin film circuit device, manufacturing method thereof, electro-optical apparatus, and electronic system |
Sep. 12, 2006 |
| 7105448 |
Method for peeling off semiconductor element and method for manufacturing semiconductor device |
Sep. 12, 2006 |
| 7101772 |
Means for forming SOI |
Sep. 5, 2006 |
| 7102141 |
Flash lamp annealing apparatus to generate electromagnetic radiation having selective wavelengths |
Sep. 5, 2006 |
| 7101773 |
Method of producing a contact system on the rear of a component with stacked substrates |
Sep. 5, 2006 |
| 7098148 |
Method for heat treating a semiconductor wafer |
Aug. 29, 2006 |
| 7098072 |
Fluxless assembly of chip size semiconductor packages |
Aug. 29, 2006 |
| 7094664 |
Method for fabricating semiconductor photodetector |
Aug. 22, 2006 |
| 7094665 |
Exfoliating method, transferring method of thin film device, and thin film device, thin film integrated circuit device, and liquid crystal display device produced by the same |
Aug. 22, 2006 |
| 7094666 |
Method and system for fabricating strained layers for the manufacture of integrated circuits |
Aug. 22, 2006 |
| 7091108 |
Methods and apparatuses for manufacturing ultra thin device layers for integrated circuit devices |
Aug. 15, 2006 |
| 7091070 |
Semiconductor device and method of manufacturing the same |
Aug. 15, 2006 |
| 7091107 |
Method for producing SOI wafer and SOI wafer |
Aug. 15, 2006 |
| 7089635 |
Methods to make piezoelectric ceramic thick film arrays and elements |
Aug. 15, 2006 |
| 7087134 |
System and method for direct-bonding of substrates |
Aug. 8, 2006 |
| 7087502 |
Method for generating chip stacks |
Aug. 8, 2006 |
| 7087510 |
Method of making bondable leads using positive photoresist and structures made therefrom |
Aug. 8, 2006 |
| 7084045 |
Method for manufacturing semiconductor device |
Aug. 1, 2006 |
| 7083997 |
Bonded wafer optical MEMS process |
Aug. 1, 2006 |
| 7078316 |
Substrate joining apparatus |
Jul. 18, 2006 |
| 7078317 |
Method and system for source switching and in-situ plasma bonding |
Jul. 18, 2006 |
| 7074696 |
Semiconductor circuit module and method for fabricating semiconductor circuit modules |
Jul. 11, 2006 |
| 7074694 |
Deposition mask, manufacturing method thereof, display unit, manufacturing method thereof, and electronic apparatus including display unit |
Jul. 11, 2006 |
| 7074644 |
Method of manufacturing thin film element, thin film transistor circuit substrate, active matrix display device, electro-optical device, and electronic apparatus |
Jul. 11, 2006 |
| 7074693 |
Plasma spraying for joining silicon parts |
Jul. 11, 2006 |
| 7071078 |
Methods for securing components of semiconductor device assemblies to each other with hybrid adhesive materials |
Jul. 4, 2006 |
| 7071014 |
Methods for preserving strained semiconductor substrate layers during CMOS processing |
Jul. 4, 2006 |
| 7071029 |
Methods for fabricating final substrates |
Jul. 4, 2006 |
| 7071077 |
Method for preparing a bonding surface of a semiconductor layer of a wafer |
Jul. 4, 2006 |
| 7067430 |
Method of making relaxed silicon-germanium on insulator via layer transfer with stress reduction |
Jun. 27, 2006 |
| 7067338 |
Method of manufacturing a display device including forming electric connections on a substrate, conductor patterns on a second substrate and coupling the connections |
Jun. 27, 2006 |
| 7067393 |
Substrate assembly for stressed systems |
Jun. 27, 2006 |
| 7067345 |
Method of joining components |
Jun. 27, 2006 |
| 7067392 |
Semiconductor apparatus and fabrication method of the same |
Jun. 27, 2006 |
| 7067395 |
Display device and manufacturing method thereof |
Jun. 27, 2006 |
| 7067394 |
Manufacturing of monolithically integrated pin structures |
Jun. 27, 2006 |
| 7059047 |
Sockets for "springed" semiconductor devices |
Jun. 13, 2006 |
| 7060590 |
Layer transfer method |
Jun. 13, 2006 |
| 7060529 |
Multiple chip semiconductor arrangement having electrical components in separating regions |
Jun. 13, 2006 |
| 7056813 |
Methods of forming backside connections on a wafer stack |
Jun. 6, 2006 |
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