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Class Information
Number: 438/455
Name: Semiconductor device manufacturing: process > Bonding of plural semiconductor substrates
Description: Process in which plural semiconductive substrates are joined together into a coherent body, such as by thermal treatment.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7335572 |
Method for low temperature bonding and bonded structure |
Feb. 26, 2008 |
| 7335573 |
Vehicle, display device and manufacturing method for a semiconductor device |
Feb. 26, 2008 |
| 7332417 |
Semiconductor structures with structural homogeneity |
Feb. 19, 2008 |
| 7332413 |
Semiconductor wafers including one or more reinforcement structures and methods of forming the same |
Feb. 19, 2008 |
| 7332410 |
Method of epitaxial-like wafer bonding at low temperature and bonded structure |
Feb. 19, 2008 |
| 7332381 |
Semiconductor device and method of manufacturing the same |
Feb. 19, 2008 |
| 7323395 |
Manufacture of solid state electronic components |
Jan. 29, 2008 |
| 7323396 |
Signal and/or ground planes with double buried insulator layers and fabrication process |
Jan. 29, 2008 |
| 7320928 |
Method of forming a stacked device filler |
Jan. 22, 2008 |
| 7312487 |
Three dimensional integrated circuit |
Dec. 25, 2007 |
| 7307005 |
Wafer bonding with highly compliant plate having filler material enclosed hollow core |
Dec. 11, 2007 |
| 7307004 |
Method with mechanically strained silicon for enhancing speed of integrated circuits or devices |
Dec. 11, 2007 |
| 7307003 |
Method of forming a multi-layer semiconductor structure incorporating a processing handle member |
Dec. 11, 2007 |
| 7306970 |
Method and apparatus for manufacturing an optoelectronic device |
Dec. 11, 2007 |
| 7303976 |
Wafer bonding method |
Dec. 4, 2007 |
| 7300820 |
Adhesive assembly for a circuit board |
Nov. 27, 2007 |
| 7300853 |
Thin layer semi-conductor structure comprising a heat distribution layer |
Nov. 27, 2007 |
| 7297613 |
Method of fabricating and integrating high quality decoupling capacitors |
Nov. 20, 2007 |
| 7297612 |
Methods for forming strained-semiconductor-on-insulator device structures by use of cleave planes |
Nov. 20, 2007 |
| 7297611 |
Method for producing thin layers of semiconductor material from a donor wafer |
Nov. 20, 2007 |
| 7297610 |
Method of segmenting a wafer |
Nov. 20, 2007 |
| 7297562 |
Circuit-on-foil process for manufacturing a laminated semiconductor package substrate having embedded conductive patterns |
Nov. 20, 2007 |
| 7294557 |
Method of increasing the area of a useful layer of material transferred onto a support |
Nov. 13, 2007 |
| 7291542 |
Semiconductor wafer and manufacturing method thereof |
Nov. 6, 2007 |
| 7291543 |
Thin flip-chip method |
Nov. 6, 2007 |
| 7288489 |
Process for thinning a semiconductor workpiece |
Oct. 30, 2007 |
| 7288465 |
Semiconductor wafer front side protection |
Oct. 30, 2007 |
| 7288464 |
MEMS packaging structure and methods |
Oct. 30, 2007 |
| 7285844 |
Multiple internal seal right micro-electro-mechanical system vacuum package |
Oct. 23, 2007 |
| 7285825 |
Element formation substrate for forming semiconductor device |
Oct. 23, 2007 |
| 7285478 |
Method for micro-electromechanical system package |
Oct. 23, 2007 |
| 7285477 |
Dual wired integrated circuit chips |
Oct. 23, 2007 |
| 7285476 |
Exfoliating method, transferring method of thin film device, and thin film device, thin film integrated circuit device, and liquid crystal display device produced by the same |
Oct. 23, 2007 |
| 7285475 |
Integrated circuit having a device wafer with a diffused doped backside layer |
Oct. 23, 2007 |
| 7282425 |
Structure and method of integrating compound and elemental semiconductors for high-performance CMOS |
Oct. 16, 2007 |
| 7282424 |
Method of manufacturing a plurality of assemblies |
Oct. 16, 2007 |
| 7282104 |
Method of fixing a sealing object to a base object |
Oct. 16, 2007 |
| 7279751 |
Semiconductor laser device and manufacturing method thereof |
Oct. 9, 2007 |
| 7279369 |
Germanium on insulator fabrication via epitaxial germanium bonding |
Oct. 9, 2007 |
| 7276424 |
Fabrication of aligned nanowire lattices |
Oct. 2, 2007 |
| 7276427 |
Method for manufacturing SOI wafer |
Oct. 2, 2007 |
| 7276428 |
Methods for forming a semiconductor structure |
Oct. 2, 2007 |
| 7276429 |
Method and apparatus for producing ultra-thin semiconductor chip and method and apparatus for producing ultra-thin back-illuminated solid-state image pickup device |
Oct. 2, 2007 |
| 7273798 |
Gallium nitride device substrate containing a lattice parameter altering element |
Sep. 25, 2007 |
| 7273797 |
Methods of forming semiconductor-on-insulator constructions |
Sep. 25, 2007 |
| 7271075 |
Method and a device for bonding two plate-shaped objects |
Sep. 18, 2007 |
| 7268051 |
Semiconductor on glass insulator with deposited barrier layer |
Sep. 11, 2007 |
| 7268059 |
Methods for securing components of semiconductor device assemblies to each other with adhesive materials that include pressure-sensitive and curable components |
Sep. 11, 2007 |
| 7268060 |
Method for fabricating a substrate with useful layer on high resistivity support |
Sep. 11, 2007 |
| 7268081 |
Wafer-level transfer of membranes with gas-phase etching and wet etching methods |
Sep. 11, 2007 |
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