| |
 |
|
Class Information
Number: 438/455
Name: Semiconductor device manufacturing: process > Bonding of plural semiconductor substrates
Description: Process in which plural semiconductive substrates are joined together into a coherent body, such as by thermal treatment.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 5569620 |
Bonded wafer processing with metal silicidation |
Oct. 29, 1996 |
| 5567649 |
Method of forming a conductive diffusion barrier |
Oct. 22, 1996 |
| 5561077 |
Dielectric element isolated semiconductor device and a method of manufacturing the same |
Oct. 1, 1996 |
| 5541122 |
Method of fabricating an insulated-gate bipolar transistor |
Jul. 30, 1996 |
| 5539245 |
Semiconductor substrate having a gettering layer |
Jul. 23, 1996 |
| 5538904 |
Method of estimating quantity of boron at bonding interface in bonded wafer |
Jul. 23, 1996 |
| 5538904 |
Method of estimating quantity of boron at bonding interface in bonded wafer |
Jul. 23, 1996 |
| 5514235 |
Method of making bonded wafers |
May. 7, 1996 |
| 5496436 |
Comb drive micromechanical tuning fork gyro fabrication method |
Mar. 5, 1996 |
| 5489554 |
Method of making a 3-dimensional circuit assembly having electrical contacts that extend through the IC layer |
Feb. 6, 1996 |
| 5478782 |
Method bonding for production of SOI transistor device |
Dec. 26, 1995 |
| 5466303 |
Semiconductor device and manufacturing method therefor |
Nov. 14, 1995 |
| 5453394 |
Process for preparing semiconductor substrate by bringing first and second substrates in contact |
Sep. 26, 1995 |
| 5451547 |
Method of manufacturing semiconductor substrate |
Sep. 19, 1995 |
| 5441591 |
Silicon to sapphire bond |
Aug. 15, 1995 |
| 5441911 |
Silicon carbide wafer bonded to a silicon wafer |
Aug. 15, 1995 |
| 5416044 |
Method for producing a surface-emitting laser |
May. 16, 1995 |
| 5407856 |
Direct substrate bonding |
Apr. 18, 1995 |
| 5403916 |
Method for producing a light emitting diode having transparent substrate |
Apr. 4, 1995 |
| 5403783 |
Integrated circuit substrate with cooling accelerator substrate |
Apr. 4, 1995 |
| 5387555 |
Bonded wafer processing with metal silicidation |
Feb. 7, 1995 |
| 5387551 |
Method of manufacturing flat inductance element |
Feb. 7, 1995 |
| 5380681 |
Three-dimensional multichip package and methods of fabricating |
Jan. 10, 1995 |
| 5376580 |
Wafer bonding of light emitting diode layers |
Dec. 27, 1994 |
| 5374564 |
Process for the production of thin semiconductor material films |
Dec. 20, 1994 |
| 5366923 |
Bonded wafer structure having a buried insulation layer |
Nov. 22, 1994 |
| 5362667 |
Bonded wafer processing |
Nov. 8, 1994 |
| 5360748 |
Method of manufacturing a semiconductor device |
Nov. 1, 1994 |
| 5349207 |
Silicon carbide wafer bonded to a silicon wafer |
Sep. 20, 1994 |
| 5334273 |
Wafer bonding using trapped oxidizing vapor |
Aug. 2, 1994 |
| 5327007 |
Semiconductor substrate having a gettering layer |
Jul. 5, 1994 |
| 5286335 |
Processes for lift-off and deposition of thin film materials |
Feb. 15, 1994 |
| 5273616 |
Method of producing sheets of crystalline material and devices made therefrom |
Dec. 28, 1993 |
| 5273205 |
Method and apparatus for silicon fusion bonding of silicon substrates using wet oxygen atmosphere |
Dec. 28, 1993 |
| 5272104 |
Bonded wafer process incorporating diamond insulator |
Dec. 21, 1993 |
| 5266135 |
Wafer bonding process employing liquid oxidant |
Nov. 30, 1993 |
| 5262347 |
Palladium welding of a semiconductor body |
Nov. 16, 1993 |
| 5258318 |
Method of forming a BiCMOS SOI wafer having thin and thick SOI regions of silicon |
Nov. 2, 1993 |
| 5236118 |
Aligned wafer bonding |
Aug. 17, 1993 |
| 5232870 |
Method for production of bonded wafer |
Aug. 3, 1993 |
| 5207864 |
Low-temperature fusion of dissimilar semiconductors |
May. 4, 1993 |
| 5196375 |
Method for manufacturing bonded semiconductor body |
Mar. 23, 1993 |
| 5194395 |
Method of producing a substrate having semiconductor-on-insulator structure with gettering sites |
Mar. 16, 1993 |
| 5183769 |
Vertical current flow semiconductor device utilizing wafer bonding |
Feb. 2, 1993 |
| 5168078 |
Method of making high density semiconductor structure |
Dec. 1, 1992 |
| 5141148 |
Method of anodic bonding a semiconductor wafer to an insulator |
Aug. 25, 1992 |
| 5141887 |
Low voltage, deep junction device and method |
Aug. 25, 1992 |
| 5131968 |
Gradient chuck method for wafer bonding employing a convex pressure |
Jul. 21, 1992 |
| 5089431 |
Method of manufacturing a semiconductor device including a static induction transistor |
Feb. 18, 1992 |
| 5087585 |
Method of stacking semiconductor substrates for fabrication of three-dimensional integrated circuit |
Feb. 11, 1992 |
|
|
|
