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Class Information
Number: 438/455
Name: Semiconductor device manufacturing: process > Bonding of plural semiconductor substrates
Description: Process in which plural semiconductive substrates are joined together into a coherent body, such as by thermal treatment.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 5883012 |
Method of etching a trench into a semiconductor substrate |
Mar. 16, 1999 |
| 5882987 |
Smart-cut process for the production of thin semiconductor material films |
Mar. 16, 1999 |
| 5882986 |
Semiconductor chips having a mesa structure provided by sawing |
Mar. 16, 1999 |
| 5880010 |
Ultrathin electronics |
Mar. 9, 1999 |
| 5877046 |
Methods of forming semiconductor-on-insulator substrates |
Mar. 2, 1999 |
| 5869386 |
Method of fabricating a composite silicon-on-insulator substrate |
Feb. 9, 1999 |
| 5866469 |
Method of anodic wafer bonding |
Feb. 2, 1999 |
| 5866468 |
Method for fabricating an SOI substrate |
Feb. 2, 1999 |
| 5863832 |
Capping layer in interconnect system and method for bonding the capping layer onto the interconnect system |
Jan. 26, 1999 |
| 5855693 |
Wafer of semiconductor material for fabricating integrated devices, and process for its fabrication |
Jan. 5, 1999 |
| 5854122 |
Epitaxial layer for dissolved wafer micromachining process |
Dec. 29, 1998 |
| 5849627 |
Bonded wafer processing with oxidative bonding |
Dec. 15, 1998 |
| 5846638 |
Composite optical and electro-optical devices |
Dec. 8, 1998 |
| 5840614 |
Method of producing a semiconductor wafer using ultraviolet sensitive tape |
Nov. 24, 1998 |
| 5831309 |
Semiconductor element for an electronic or opto-electronic semiconductor component |
Nov. 3, 1998 |
| 5827755 |
Liquid crystal image display unit and method for fabricating semiconductor optical member |
Oct. 27, 1998 |
| 5824561 |
Thermoelectric device and a method of manufacturing thereof |
Oct. 20, 1998 |
| 5824571 |
Multi-layered contacting for securing integrated circuits |
Oct. 20, 1998 |
| 5821154 |
Semiconductor device |
Oct. 13, 1998 |
| 5817530 |
Use of conductive lines on the back side of wafers and dice for semiconductor interconnects |
Oct. 6, 1998 |
| 5811348 |
Method for separating a device-forming layer from a base body |
Sep. 22, 1998 |
| 5804494 |
Method of fabricating bonded wafer |
Sep. 8, 1998 |
| 5804463 |
Noble metal diffusion doping of mercury cadmium telluride for use in infrared detectors |
Sep. 8, 1998 |
| 5801084 |
Bonded wafer processing |
Sep. 1, 1998 |
| 5798294 |
Semiconductor substrate having a serious effect of gettering heavy metal and method of manufacturing the same |
Aug. 25, 1998 |
| 5798297 |
Method for producing a semiconductor component with electrical connection terminals for high integration density |
Aug. 25, 1998 |
| 5783477 |
Method for bonding compounds semiconductor wafers to create an ohmic interface |
Jul. 21, 1998 |
| 5780354 |
Method of manufacturing semiconductor devices with semiconductor elements formed in a layer of semiconductor material glued on a support wafer |
Jul. 14, 1998 |
| 5780311 |
bonded wafer processing |
Jul. 14, 1998 |
| 5773330 |
Semiconductor device and method for fabricating the same |
Jun. 30, 1998 |
| 5769991 |
Method and apparatus for wafer bonding |
Jun. 23, 1998 |
| 5770511 |
Silicon-on-insulator substrate and a method for fabricating the same |
Jun. 23, 1998 |
| 5767001 |
Process for producing semiconductor components between which contact is made vertically |
Jun. 16, 1998 |
| 5763318 |
Method of making a machine structures fabricated of mutiple microstructure layers |
Jun. 9, 1998 |
| 5763288 |
Method for producing semiconductor substrate by wafer bonding |
Jun. 9, 1998 |
| 5755914 |
Method for bonding semiconductor substrates |
May. 26, 1998 |
| 5736452 |
Method of manufacturing a hybrid integrated circuit |
Apr. 7, 1998 |
| 5728623 |
Method of bonding a III-V group compound semiconductor layer on a silicon substrate |
Mar. 17, 1998 |
| 5706577 |
No fixture method to cure die attach for bonding IC dies to substrates |
Jan. 13, 1998 |
| 5688714 |
Method of fabricating a semiconductor device having a top layer and base layer joined by wafer bonding |
Nov. 18, 1997 |
| 5657537 |
Method for fabricating a stack of two dimensional circuit modules |
Aug. 19, 1997 |
| 5656512 |
Method of manufacturing a semiconductor accelerometer |
Aug. 12, 1997 |
| 5656548 |
Method for forming three dimensional processor using transferred thin film circuits |
Aug. 12, 1997 |
| 5654221 |
Method for forming semiconductor chip and electronic module with integrated surface interconnects/components |
Aug. 5, 1997 |
| 5643821 |
Method for making ohmic contact to lightly doped islands from a silicide buried layer and applications |
Jul. 1, 1997 |
| 5641381 |
Preferentially etched epitaxial liftoff of InP material |
Jun. 24, 1997 |
| 5632854 |
Pressure sensor method of fabrication |
May. 27, 1997 |
| 5605598 |
Monolithic micromechanical vibrating beam accelerometer with trimmable resonant frequency |
Feb. 25, 1997 |
| 5603779 |
Bonded wafer and method of fabrication thereof |
Feb. 18, 1997 |
| 5580407 |
Method of bonding two objects, at least one of which comprises organic materials |
Dec. 3, 1996 |
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