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Class Information
Number: 438/455
Name: Semiconductor device manufacturing: process > Bonding of plural semiconductor substrates
Description: Process in which plural semiconductive substrates are joined together into a coherent body, such as by thermal treatment.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 6013563 |
Controlled cleaning process |
Jan. 11, 2000 |
| 6013562 |
Process for connecting electric contact points using anodic bonding |
Jan. 11, 2000 |
| 6013534 |
Method of thinning integrated circuits received in die form |
Jan. 11, 2000 |
| 6010591 |
Method for the releasable bonding and subsequent separation of reversibly bonded and polished wafers and also a wafer structure and wafer |
Jan. 4, 2000 |
| 6010950 |
Method of manufacturing semiconductor bonded substrate |
Jan. 4, 2000 |
| 6008113 |
Process for wafer bonding in a vacuum |
Dec. 28, 1999 |
| 6004860 |
SOI substrate and a method for fabricating the same |
Dec. 21, 1999 |
| 6001666 |
Manufacturing process of strain gauge sensor using the piezoresistive effect |
Dec. 14, 1999 |
| 6001667 |
Method of manufacturing a semiconductor detector for detecting light and radiation |
Dec. 14, 1999 |
| 6001711 |
Process of fabricating semiconductor device having gettering site layer between insulating layer and active semiconductor layer |
Dec. 14, 1999 |
| 5998291 |
Attachment method for assembly of high density multiple interconnect structures |
Dec. 7, 1999 |
| 5998281 |
SOI wafer and method for the preparation thereof |
Dec. 7, 1999 |
| 5994166 |
Method of constructing stacked packages |
Nov. 30, 1999 |
| 5994188 |
Method of fabricating a vertical power device with integrated control circuitry |
Nov. 30, 1999 |
| 5994207 |
Controlled cleavage process using pressurized fluid |
Nov. 30, 1999 |
| 5994204 |
Silicon-glass bonded wafers |
Nov. 30, 1999 |
| 5989974 |
Method of manufacturing a semiconductor device |
Nov. 23, 1999 |
| 5985687 |
Method for making cleaved facets for lasers fabricated with gallium nitride and other noncubic materials |
Nov. 16, 1999 |
| 5985739 |
Semiconductor structures having advantageous high-frequency characteristics and processes for producing such semiconductor structures |
Nov. 16, 1999 |
| 5981360 |
Assembly procedure for two structures and apparatus produced by the procedure applications to microlasers |
Nov. 9, 1999 |
| 5976953 |
Three dimensional processor using transferred thin film circuits |
Nov. 2, 1999 |
| 5976910 |
Electronic device assembly and a manufacturing method of the same |
Nov. 2, 1999 |
| 5972780 |
Thin film forming apparatus and method |
Oct. 26, 1999 |
| 5966620 |
Process for producing semiconductor article |
Oct. 12, 1999 |
| 5956577 |
Method of manufacturing serrated gate-type or joined structure |
Sep. 21, 1999 |
| 5956575 |
Microconnectors |
Sep. 21, 1999 |
| 5956563 |
Method for reducing a transient thermal mismatch |
Sep. 21, 1999 |
| 5953620 |
Method for fabricating a bonded SOI wafer |
Sep. 14, 1999 |
| 5950075 |
Semiconductor device having recessed gate regions and method of manufacturing the same |
Sep. 7, 1999 |
| 5943563 |
Method for producing a three-dimensional circuit arrangement |
Aug. 24, 1999 |
| 5937312 |
Single-etch stop process for the manufacture of silicon-on-insulator wafers |
Aug. 10, 1999 |
| 5933750 |
Method of fabricating a semiconductor device with a thinned substrate |
Aug. 3, 1999 |
| 5932048 |
Method of fabricating direct-bonded semiconductor wafers |
Aug. 3, 1999 |
| 5927993 |
Backside processing method |
Jul. 27, 1999 |
| 5930652 |
Semiconductor encapsulation method |
Jul. 27, 1999 |
| 5926692 |
Method of manufacturing a support structure for a semiconductor pressure transducer |
Jul. 20, 1999 |
| 5920766 |
Red and blue stacked laser diode array by wafer fusion |
Jul. 6, 1999 |
| 5918113 |
Process for producing a semiconductor device using anisotropic conductive adhesive |
Jun. 29, 1999 |
| 5918139 |
Method of manufacturing a bonding substrate |
Jun. 29, 1999 |
| 5915167 |
Three dimensional structure memory |
Jun. 22, 1999 |
| 5915193 |
Method for the cleaning and direct bonding of solids |
Jun. 22, 1999 |
| 5904545 |
Apparatus for fabricating self-assembling microstructures |
May. 18, 1999 |
| 5902118 |
Method for production of a three-dimensional circuit arrangement |
May. 11, 1999 |
| 5897333 |
Method for forming integrated composite semiconductor devices |
Apr. 27, 1999 |
| 5897362 |
Bonding silicon wafers |
Apr. 27, 1999 |
| 5893746 |
Semiconductor device and method for making same |
Apr. 13, 1999 |
| 5894037 |
Silicon semiconductor substrate and method of fabricating the same |
Apr. 13, 1999 |
| 5891761 |
Method for forming vertical interconnect process for silicon segments with thermally conductive epoxy preform |
Apr. 6, 1999 |
| 5882986 |
Semiconductor chips having a mesa structure provided by sawing |
Mar. 16, 1999 |
| 5882987 |
Smart-cut process for the production of thin semiconductor material films |
Mar. 16, 1999 |
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