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Class Information
Number: 438/455
Name: Semiconductor device manufacturing: process > Bonding of plural semiconductor substrates
Description: Process in which plural semiconductive substrates are joined together into a coherent body, such as by thermal treatment.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 6372609 |
Method of Fabricating SOI wafer by hydrogen ION delamination method and SOI wafer fabricated by the method |
Apr. 16, 2002 |
| 6368942 |
Method for fabricating an ultra-low expansion mask blank having a crystalline silicon layer |
Apr. 9, 2002 |
| 6365429 |
Method for nitride based laser diode with growth substrate removed using an intermediate substrate |
Apr. 2, 2002 |
| 6362078 |
Dynamic threshold voltage device and methods for fabricating dynamic threshold voltage devices |
Mar. 26, 2002 |
| 6361831 |
Paste application method for die bonding |
Mar. 26, 2002 |
| 6362075 |
Method for making a diffused back-side layer on a bonded-wafer with a thick bond oxide |
Mar. 26, 2002 |
| 6358354 |
UV and thermally curable adhesive formulation |
Mar. 19, 2002 |
| 6356689 |
Article comprising an optical cavity |
Mar. 12, 2002 |
| 6355501 |
Three-dimensional chip stacking assembly |
Mar. 12, 2002 |
| 6352875 |
Photoelectric conversion apparatus and method of manufacturing the same |
Mar. 5, 2002 |
| 6346435 |
Laminated substrate fabricated from semiconductor wafers bonded to each other without contact between insulating layer and semiconductor layer and process of fabrication thereof |
Feb. 12, 2002 |
| 6344401 |
Method of forming a stacked-die integrated circuit chip package on a water level |
Feb. 5, 2002 |
| 6344375 |
Substrate containing compound semiconductor, method for manufacturing the same and semiconductor device using the same |
Feb. 5, 2002 |
| 6344372 |
Semiconductor device with reliable connection between projective electrode and conductive wire of the substrate |
Feb. 5, 2002 |
| 6342433 |
Composite member its separation method and preparation method of semiconductor substrate by utilization thereof |
Jan. 29, 2002 |
| 6335231 |
Method of fabricating a high reliable SOI substrate |
Jan. 1, 2002 |
| 6335263 |
Method of forming a low temperature metal bond for use in the transfer of bulk and thin film materials |
Jan. 1, 2002 |
| 6333208 |
Robust manufacturing method for making a III-V compound semiconductor device by misaligned wafer bonding |
Dec. 25, 2001 |
| 6331473 |
SOI substrate, method for making the same, semiconductive device and liquid crystal panel using the same |
Dec. 18, 2001 |
| 6329265 |
Method of making a semiconductor device using processing from both sides of a workpiece |
Dec. 11, 2001 |
| 6328796 |
Single-crystal material on non-single-crystalline substrate |
Dec. 11, 2001 |
| 6326279 |
Process for producing semiconductor article |
Dec. 4, 2001 |
| 6326292 |
Semiconductor component and manufacturing method for semiconductor component |
Dec. 4, 2001 |
| 6326247 |
Method of creating selectively thin silicon/oxide for making fully and partially depleted SOI on same waffer |
Dec. 4, 2001 |
| 6326285 |
Simultaneous multiple silicon on insulator (SOI) wafer production |
Dec. 4, 2001 |
| 6323109 |
Laminated SOI substrate and producing method thereof |
Nov. 27, 2001 |
| 6319757 |
Adhesion and/or encapsulation of silicon carbide-based semiconductor devices on ceramic substrates |
Nov. 20, 2001 |
| 6319749 |
Lead frame, semiconductor package having the same and method for manufacturing the same |
Nov. 20, 2001 |
| 6316332 |
Method for joining wafers at a low temperature and low stress |
Nov. 13, 2001 |
| 6316333 |
Method for obtaining a thin film in particular semiconductor, comprising a protected ion zone and involving an ion implantation |
Nov. 13, 2001 |
| 6312797 |
Method for manufacturing bonded wafer and bonded wafer |
Nov. 6, 2001 |
| 6313012 |
Method of fabricating multi-layered structure having single crystalline semiconductor film formed on insulator |
Nov. 6, 2001 |
| 6309950 |
Methods for making silicon-on-insulator structures |
Oct. 30, 2001 |
| 6306730 |
Method of fabricating an SOI wafer and SOI wafer fabricated by the method |
Oct. 23, 2001 |
| 6306719 |
Method for manufacturing a semiconductor device |
Oct. 23, 2001 |
| 6303400 |
Temporary attach article and method for temporary attach of devices to a substrate |
Oct. 16, 2001 |
| 6303468 |
Method for making a thin film of solid material |
Oct. 16, 2001 |
| 6303472 |
Process for cutting trenches in a single crystal substrate |
Oct. 16, 2001 |
| 6300164 |
Structure, materials, and methods for socketable ball grid |
Oct. 9, 2001 |
| 6300149 |
Integrated circuit device manufacture |
Oct. 9, 2001 |
| 6290804 |
Controlled cleavage process using patterning |
Sep. 18, 2001 |
| 6291314 |
Controlled cleavage process and device for patterned films using a release layer |
Sep. 18, 2001 |
| 6291266 |
Method for fabricating large area flexible electronics |
Sep. 18, 2001 |
| 6287940 |
Dual wafer attachment process |
Sep. 11, 2001 |
| 6287891 |
Method for transferring semiconductor device layers to different substrates |
Sep. 11, 2001 |
| 6284627 |
Method for wiring semi-conductor components in order to prevent product piracy and manipulation, semi-conductors component made according to this method and use of said semi-conductor componen |
Sep. 4, 2001 |
| 6281576 |
Method of fabricating structure for chip micro-joining |
Aug. 28, 2001 |
| 6282220 |
Red, infrared, and blue stacked laser diode array by water fusion |
Aug. 28, 2001 |
| 6277670 |
Semiconductor chip package and fabrication method thereof |
Aug. 21, 2001 |
| 6271107 |
Semiconductor with polymeric layer |
Aug. 7, 2001 |
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