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Class Information
Number: 438/455
Name: Semiconductor device manufacturing: process > Bonding of plural semiconductor substrates
Description: Process in which plural semiconductive substrates are joined together into a coherent body, such as by thermal treatment.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 6656756 |
Technique for a surface-emitting laser diode with a metal reflector |
Dec. 2, 2003 |
| 6653239 |
Thermal isolation using vertical structures |
Nov. 25, 2003 |
| 6653209 |
Method of producing silicon thin film, method of constructing SOI substrate and semiconductor device |
Nov. 25, 2003 |
| 6653206 |
Method and apparatus for processing composite member |
Nov. 25, 2003 |
| 6653205 |
Composite member separating method, thin film manufacturing method, and composite member separating apparatus |
Nov. 25, 2003 |
| 6645831 |
Thermally stable crystalline defect-free germanium bonded to silicon and silicon dioxide |
Nov. 11, 2003 |
| 6645833 |
Method for producing layered structures on a substrate, substrate and semiconductor components produced according to said method |
Nov. 11, 2003 |
| 6645832 |
Etch stop layer for silicon (Si) via etch in three-dimensional (3-D) wafer-to-wafer vertical stack |
Nov. 11, 2003 |
| 6645830 |
Exfoliating method, transferring method of thin film device, and thin film device, thin film integrated circuit device and liquid crystal display device produced by the same |
Nov. 11, 2003 |
| 6645828 |
In situ plasma wafer bonding method |
Nov. 11, 2003 |
| 6645829 |
Silicon wafer with embedded optoelectronic material for monolithic OEIC |
Nov. 11, 2003 |
| 6638627 |
Method for electrostatic force bonding and a system thereof |
Oct. 28, 2003 |
| 6638834 |
Methods of forming semiconductor constructions |
Oct. 28, 2003 |
| 6638836 |
Process for manufacturing a group comprising at least two elements, one whereof includes an encapsulated micro-integrated structure, and thereby obtained group |
Oct. 28, 2003 |
| 6635553 |
Microelectronic assemblies with multiple leads |
Oct. 21, 2003 |
| 6635552 |
Methods of forming semiconductor constructions |
Oct. 21, 2003 |
| 6632724 |
Controlled cleaving process |
Oct. 14, 2003 |
| 6627517 |
Semiconductor package with improved thermal cycling performance, and method of forming same |
Sep. 30, 2003 |
| 6624046 |
Three dimensional processor using transferred thin film circuits |
Sep. 23, 2003 |
| 6624050 |
Method of manufacturing semiconductor device |
Sep. 23, 2003 |
| 6624047 |
Substrate and method of manufacturing the same |
Sep. 23, 2003 |
| 6620657 |
Method of forming a planar polymer transistor using substrate bonding techniques |
Sep. 16, 2003 |
| 6616854 |
Method of bonding and transferring a material to form a semiconductor device |
Sep. 9, 2003 |
| 6617225 |
Method of machining silicon |
Sep. 9, 2003 |
| 6617195 |
Method of reflowing organic packages using no-clean flux |
Sep. 9, 2003 |
| 6613643 |
Structure, and a method of realizing, for efficient heat removal on SOI |
Sep. 2, 2003 |
| 6613676 |
Process of reclamation of SOI substrate and reproduced substrate |
Sep. 2, 2003 |
| 6613652 |
Method for fabricating SOI devices with option of incorporating air-gap feature for better insulation and performance |
Sep. 2, 2003 |
| 6610582 |
Field-assisted fusion bonding |
Aug. 26, 2003 |
| 6610558 |
Method for mounting a semiconductor chip on a substrate and semiconductor device adapted for mounting on a substrate |
Aug. 26, 2003 |
| 6607968 |
Method for making a silicon substrate comprising a buried thin silicon oxide film |
Aug. 19, 2003 |
| 6605319 |
Use of integrated polygen deposition and RTP for microelectromechanical systems |
Aug. 12, 2003 |
| 6602761 |
Process for production of SOI substrate and process for production of semiconductor device |
Aug. 5, 2003 |
| 6602760 |
Method of producing a semiconductor layer on a substrate |
Aug. 5, 2003 |
| 6602732 |
Method for mounting a semiconductor chip on a substrate and semiconductor device adapted for mounting on a substrate |
Aug. 5, 2003 |
| 6602803 |
Direct attachment semiconductor chip to organic substrate |
Aug. 5, 2003 |
| 6596610 |
Method for reclaiming delaminated wafer and reclaimed delaminated wafer |
Jul. 22, 2003 |
| 6596622 |
Semiconductor device having a multi-layer pad and manufacturing method thereof |
Jul. 22, 2003 |
| 6596640 |
Method of forming a raised contact for a substrate |
Jul. 22, 2003 |
| 6593204 |
Method of fabricating a silicon-on-insulator system with thin semiconductor islets surrounded by an insulative material |
Jul. 15, 2003 |
| 6593211 |
Semiconductor substrate and method for producing the same |
Jul. 15, 2003 |
| 6593213 |
Synthesis of layers, coatings or films using electrostatic fields |
Jul. 15, 2003 |
| 6589811 |
Method for transferring semiconductor device layers to different substrates |
Jul. 8, 2003 |
| 6586338 |
Methods for creating elements of predetermined shape and apparatus using these elements |
Jul. 1, 2003 |
| 6583030 |
Method for producing an integrated circuit processed on both sides |
Jun. 24, 2003 |
| 6583029 |
Production method for silicon wafer and SOI wafer, and SOI wafer |
Jun. 24, 2003 |
| 6573155 |
Contact structure of substrates of touch panel and method of bonding the same |
Jun. 3, 2003 |
| 6569748 |
Substrate and production method thereof |
May. 27, 2003 |
| 6566158 |
Method of preparing a semiconductor using ion implantation in a SiC layer |
May. 20, 2003 |
| 6566149 |
Method for manufacturing substrate for inspecting semiconductor device |
May. 20, 2003 |
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