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Class Information
Number: 438/455
Name: Semiconductor device manufacturing: process > Bonding of plural semiconductor substrates
Description: Process in which plural semiconductive substrates are joined together into a coherent body, such as by thermal treatment.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 6765287 |
Three-dimensional stacked semiconductor package |
Jul. 20, 2004 |
| 6764936 |
Mechanical landing pad formed on the underside of a MEMS device |
Jul. 20, 2004 |
| 6764923 |
Method for manufacturing components of an SOI wafer |
Jul. 20, 2004 |
| 6764924 |
Process for producing a tool insert for injection molding a part with single-stage microstructures |
Jul. 20, 2004 |
| 6762076 |
Process of vertically stacking multiple wafers supporting different active integrated circuit (IC) devices |
Jul. 13, 2004 |
| 6762069 |
Method for manufacturing light-emitting element on non-transparent substrate |
Jul. 13, 2004 |
| 6759308 |
Silicon on insulator field effect transistor with heterojunction gate |
Jul. 6, 2004 |
| 6759309 |
Micromachined structures including glass vias with internal conductive layers anodically bonded to silicon-containing substrates |
Jul. 6, 2004 |
| 6759307 |
Method to prevent die attach adhesive contamination in stacked chips |
Jul. 6, 2004 |
| 6756285 |
Multilayer structure with controlled internal stresses and making same |
Jun. 29, 2004 |
| 6753239 |
Bond and back side etchback transistor fabrication process |
Jun. 22, 2004 |
| 6753205 |
Method for manufacturing a structure comprising a substrate with a cavity and a semiconductor integrated circuit bonded to a contact pad located in the cavity |
Jun. 22, 2004 |
| 6750476 |
Substrate device manufacturing method and substrate device, electrooptical device manufacturing method and electrooptical device and electronic unit |
Jun. 15, 2004 |
| 6746937 |
PD-SOI substrate with suppressed floating body effect and method for its fabrication |
Jun. 8, 2004 |
| 6746938 |
Manufacturing method for semiconductor device using photo sensitive polyimide etching mask to form viaholes |
Jun. 8, 2004 |
| 6743697 |
Thin silicon circuits and method for making the same |
Jun. 1, 2004 |
| 6743662 |
Silicon-on-insulator wafer for RF integrated circuit |
Jun. 1, 2004 |
| 6736986 |
Chemical synthesis of layers, coatings or films using surfactants |
May. 18, 2004 |
| 6737337 |
Method of preventing dopant depletion in surface semiconductor layer of semiconductor-on-insulator (SOI) device |
May. 18, 2004 |
| 6736983 |
Method for producing microcomponents |
May. 18, 2004 |
| 6734538 |
Article comprising a multi-layer electronic package and method therefor |
May. 11, 2004 |
| 6734040 |
Method of manufacturing semiconductor devices |
May. 11, 2004 |
| 6731353 |
Method and apparatus for transferring blocks |
May. 4, 2004 |
| 6730526 |
Multi-chip module system and method of fabrication |
May. 4, 2004 |
| 6727422 |
Heat sink/heat spreader structures and methods of manufacture |
Apr. 27, 2004 |
| 6723576 |
Disposing method for semiconductor elements |
Apr. 20, 2004 |
| 6720640 |
Method for reclaiming delaminated wafer and reclaimed delaminated wafer |
Apr. 13, 2004 |
| 6720236 |
Mask and method of manufacturing the same, electro-luminescence device and method of manufacturing the same, and electronic instrument |
Apr. 13, 2004 |
| 6716721 |
Method for manufacturing a silicon wafer |
Apr. 6, 2004 |
| 6716722 |
Method of producing a bonded wafer and the bonded wafer |
Apr. 6, 2004 |
| 6713314 |
Hermetically packaging a microelectromechanical switch and a film bulk acoustic resonator |
Mar. 30, 2004 |
| 6707160 |
Semiconductor device using substrate having cubic structure and method of manufacturing the same |
Mar. 16, 2004 |
| 6706618 |
Substrate processing apparatus, substrate support apparatus, substrate processing method, and substrate fabrication method |
Mar. 16, 2004 |
| 6703697 |
Electronic package design with improved power delivery performance |
Mar. 9, 2004 |
| 6699770 |
Method of making a hybride substrate having a thin silicon carbide membrane layer |
Mar. 2, 2004 |
| 6696371 |
Method for fabricating positionally exact surface-wide membrane masks |
Feb. 24, 2004 |
| 6696353 |
Integrated circuit chip having anti-moisture-absorption film at edge thereof and method of forming anti-moisture-absorption film |
Feb. 24, 2004 |
| 6696347 |
Production process for semiconductor device |
Feb. 24, 2004 |
| 6689635 |
Apparatus and method for face-to-face connection of a die to a substrate with polymer electrodes |
Feb. 10, 2004 |
| 6686256 |
Method of manufacturing chip type electronic parts including forming a photo-sensitive film on the chips and irradiating the end surfaces with light |
Feb. 3, 2004 |
| 6682990 |
Separation method of semiconductor layer and production method of solar cell |
Jan. 27, 2004 |
| 6680240 |
Silicon-on-insulator device with strained device film and method for making the same with partial replacement of isolation oxide |
Jan. 20, 2004 |
| 6677219 |
Method of forming a ball grid array package |
Jan. 13, 2004 |
| 6673697 |
Packaging microelectromechanical structures |
Jan. 6, 2004 |
| 6673651 |
Method of manufacturing semiconductor device including semiconductor elements mounted on base plate |
Jan. 6, 2004 |
| 6670269 |
Method of forming through-hole or recess in silicon substrate |
Dec. 30, 2003 |
| 6667225 |
Wafer-bonding using solder and method of making the same |
Dec. 23, 2003 |
| 6664193 |
Device isolation process flow for ARS system |
Dec. 16, 2003 |
| 6664126 |
Process for fabrication of 3-dimensional micromechanisms |
Dec. 16, 2003 |
| 6660614 |
Method for anodically bonding glass and semiconducting material together |
Dec. 9, 2003 |
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