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Class Information
Number: 438/455
Name: Semiconductor device manufacturing: process > Bonding of plural semiconductor substrates
Description: Process in which plural semiconductive substrates are joined together into a coherent body, such as by thermal treatment.


Sub-classes under this class:

Class Number Class Name Patents
438/456 Having enclosed cavity 278
438/458 Subsequent separation into plural bodies (e.g., delaminating, dicing, etc.) 768
438/459 Thinning of semiconductor substrate 841
438/457 Warping of semiconductor substrate 102


Patents under this class:
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20

Patent Number Title Of Patent Date Issued
7371661 Wafer bonding method May. 13, 2008
7371662 Method for forming a 3D interconnect and resulting structures May. 13, 2008
7371660 Controlled cleaving process May. 13, 2008
7368062 Method and apparatus for a low parasitic capacitance butt-joined passive waveguide connected to an active structure May. 6, 2008
7368310 Light generating semiconductor device and method of making the same May. 6, 2008
7368332 SOI substrate manufacturing method May. 6, 2008
7364974 Double gate FET and fabrication process Apr. 29, 2008
7364984 Method for manufacturing SOI substrate Apr. 29, 2008
7364982 Process for preparing a bonding type semiconductor substrate Apr. 29, 2008
7364958 CMOS on hybrid substrate with different crystal orientations using silicon-to-silicon direct wafer bonding Apr. 29, 2008
7361573 Method of peeling off and method of manufacturing semiconductor device Apr. 22, 2008
7358164 Crystal imprinting methods for fabricating substrates with thin active silicon layers Apr. 15, 2008
7358147 Process for producing SOI wafer Apr. 15, 2008
7358152 Wafer bonding of thinned electronic materials and circuits to high performance substrate Apr. 15, 2008
7358161 Methods of forming transistor devices associated with semiconductor-on-insulator constructions Apr. 15, 2008
7355226 Power semiconductor and method of fabrication Apr. 8, 2008
7354844 Method for manufacturing SOI substrate Apr. 8, 2008
7351644 Thin handle substrate method and structure for fabricating devices using one or more films provided by a layer transfer process Apr. 1, 2008
7348252 Method of forming silicon-on-insulator wafer having reentrant shape dielectric trenches Mar. 25, 2008
7348258 Method and device for controlled cleaving process Mar. 25, 2008
7348260 Method for forming a relaxed or pseudo-relaxed useful layer on a substrate Mar. 25, 2008
7348535 Metal line structure of optical scanner and method of fabricating the same Mar. 25, 2008
7349140 Triple alignment substrate method and structure for packaging devices Mar. 25, 2008
7344958 Method for wafer bonding (A1, In, Ga)N and Zn(S, Se) for optoelectronic applications Mar. 18, 2008
7344957 SOI wafer with cooling channels and a method of manufacture thereof Mar. 18, 2008
7341923 Substrate, manufacturing method therefor, and semiconductor device Mar. 11, 2008
7341924 Method for manufacturing semiconductor device Mar. 11, 2008
7338839 Method for producing an electrical component Mar. 4, 2008
7338884 Interconnecting substrate for carrying semiconductor device, method of producing thereof and package of semiconductor device Mar. 4, 2008
7335573 Vehicle, display device and manufacturing method for a semiconductor device Feb. 26, 2008
7335572 Method for low temperature bonding and bonded structure Feb. 26, 2008
7335533 Methods for assembling semiconductor devices in superimposed relation with adhesive material defining the distance adjacent semiconductor devices are spaced apart from one another Feb. 26, 2008
7332381 Semiconductor device and method of manufacturing the same Feb. 19, 2008
7332410 Method of epitaxial-like wafer bonding at low temperature and bonded structure Feb. 19, 2008
7332413 Semiconductor wafers including one or more reinforcement structures and methods of forming the same Feb. 19, 2008
7332417 Semiconductor structures with structural homogeneity Feb. 19, 2008
7323395 Manufacture of solid state electronic components Jan. 29, 2008
7323396 Signal and/or ground planes with double buried insulator layers and fabrication process Jan. 29, 2008
7320928 Method of forming a stacked device filler Jan. 22, 2008
7312487 Three dimensional integrated circuit Dec. 25, 2007
7306970 Method and apparatus for manufacturing an optoelectronic device Dec. 11, 2007
7307003 Method of forming a multi-layer semiconductor structure incorporating a processing handle member Dec. 11, 2007
7307004 Method with mechanically strained silicon for enhancing speed of integrated circuits or devices Dec. 11, 2007
7307005 Wafer bonding with highly compliant plate having filler material enclosed hollow core Dec. 11, 2007
7303976 Wafer bonding method Dec. 4, 2007
7300853 Thin layer semi-conductor structure comprising a heat distribution layer Nov. 27, 2007
7300820 Adhesive assembly for a circuit board Nov. 27, 2007
7297562 Circuit-on-foil process for manufacturing a laminated semiconductor package substrate having embedded conductive patterns Nov. 20, 2007
7297610 Method of segmenting a wafer Nov. 20, 2007
7297611 Method for producing thin layers of semiconductor material from a donor wafer Nov. 20, 2007

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