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Class Information
Number: 438/455
Name: Semiconductor device manufacturing: process > Bonding of plural semiconductor substrates
Description: Process in which plural semiconductive substrates are joined together into a coherent body, such as by thermal treatment.


Sub-classes under this class:

Class Number Class Name Patents
438/456 Having enclosed cavity 319
438/458 Subsequent separation into plural bodies (e.g., delaminating, dicing, etc.) 946
438/459 Thinning of semiconductor substrate 967
438/457 Warping of semiconductor substrate 122


Patents under this class:

Patent Number Title Of Patent Date Issued
7615468 Methods for making substrates and substrates formed therefrom Nov. 10, 2009
7615464 Transfer method with a treatment of a surface to be bonded Nov. 10, 2009
7615462 Etch stop layer for silicon (Si) via etch in three-dimensional (3-D) wafer-to-wafer vertical stack Nov. 10, 2009
7614137 Method of manufacturing a magnetic slider head Nov. 10, 2009
7608522 Method for fabricating a hybrid orientation substrate Oct. 27, 2009
7608521 Producing SOI structure using high-purity ion shower Oct. 27, 2009
7608520 Method for bonding substrate, bonded substrate, and direct bonded substrate Oct. 27, 2009
7605058 Wafer dividing method Oct. 20, 2009
7605054 Method of forming a device wafer with recyclable support Oct. 20, 2009
7605053 Glass-based SOI structures Oct. 20, 2009
7605052 Method of forming an integrated circuit having a device wafer with a diffused doped backside layer Oct. 20, 2009
7605051 Method for forming internal electrode pattern and method for manufacturing multilayer ceramic electronic component using same Oct. 20, 2009
7605050 Method of bonding a polymer surface to a conducting or semiconducting surface and application of the same Oct. 20, 2009
7605022 Methods of manufacturing a three-dimensional semiconductor device and semiconductor devices fabricated thereby Oct. 20, 2009
7602046 Recycling by mechanical means of a wafer comprising a multilayer structure after taking-off a thin layer thereof Oct. 13, 2009
7601613 Manufacturing method of bonded wafer Oct. 13, 2009
7601612 Method for forming solder joints for a flip chip assembly Oct. 13, 2009
7601611 Method of fabricating a semiconductor hetero-structure Oct. 13, 2009
7601236 Method of manufacturing display device Oct. 13, 2009
7598153 Method and structure for fabricating bonded substrate structures using thermal processing to remove oxygen species Oct. 6, 2009
7598152 Device and method for bonding wafers Oct. 6, 2009
7598145 Method for producing Si.sub.1-yGe.sub.y based zones with different contents in Ge on a same substrate by condensation of germanium Oct. 6, 2009
7598099 Method of controlling a fabrication process using an iso-dense bias Oct. 6, 2009
7595545 Anodic bonding apparatus, anodic bonding method, and method of producing acceleration sensor Sep. 29, 2009
7595223 Process for bonding and electrically connecting microsystems integrated in several distinct substrates Sep. 29, 2009
7592239 Flexible single-crystal film and method of manufacturing the same Sep. 22, 2009
7588998 Method for producing a semiconductor element Sep. 15, 2009
7588997 Method of fabricating a thin film Sep. 15, 2009
7586154 Method for fabricating a substrate with useful layer on high resistivity support Sep. 8, 2009
7585748 Process for manufacturing a multilayer structure made from semiconducting materials Sep. 8, 2009
7585747 Low temperature hermetic bonding at water level and method of bonding for micro display application Sep. 8, 2009
7582540 Method for manufacturing SOI wafer Sep. 1, 2009
7582513 Electronic device and method for producing electronic devices Sep. 1, 2009
7579621 Integrated BST microwave tunable devices using buffer layer transfer method Aug. 25, 2009
7579268 Method of manufacturing an integrated circuit Aug. 25, 2009
7579259 Simplified method of producing an epitaxially grown structure Aug. 25, 2009
7579258 Semiconductor interconnect having adjacent reservoir for bonding and method for formation Aug. 25, 2009
7579257 Sample separating apparatus and method, and substrate manufacturing method Aug. 25, 2009
7579229 Semiconductor device and semiconductor substrate Aug. 25, 2009
7578891 Adhesive bonding sheet, semiconductor device using the same, and method for manufacturing such semiconductor device Aug. 25, 2009
7575988 Method of fabricating a hybrid substrate Aug. 18, 2009
7572739 Tape removal in semiconductor structure fabrication Aug. 11, 2009
7572649 Device transferring system, device transferring method, and display manufacturing method Aug. 11, 2009
7566632 Lock and key structure for three-dimensional chip connection and process thereof Jul. 28, 2009
7566631 Low temperature fusion bonding with high surface energy using a wet chemical treatment Jul. 28, 2009
7566585 Semiconductor component and method for production of a semiconductor component Jul. 28, 2009
7563693 Method for manufacturing semiconductor substrate and semiconductor substrate Jul. 21, 2009
7563692 Microelectromechanical system pressure sensor and method for making and using Jul. 21, 2009
7563691 Method for plasma enhanced bonding and bonded structures formed by plasma enhanced bonding Jul. 21, 2009
7563681 Double-gated non-volatile memory and methods for forming thereof Jul. 21, 2009



 
 
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