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Class Information
Number: 438/455
Name: Semiconductor device manufacturing: process > Bonding of plural semiconductor substrates
Description: Process in which plural semiconductive substrates are joined together into a coherent body, such as by thermal treatment.










Sub-classes under this class:

Class Number Class Name Patents
438/456 Having enclosed cavity 494
438/458 Subsequent separation into plural bodies (e.g., delaminating, dicing, etc.) 1,893
438/459 Thinning of semiconductor substrate 1,508
438/457 Warping of semiconductor substrate 203


Patents under this class:

Patent Number Title Of Patent Date Issued
8711897 Split-ring resonator creating a photonic metamaterial Apr. 29, 2014
8709938 3D IC method and device Apr. 29, 2014
8709915 Method of manufacturing semiconductor device Apr. 29, 2014
8709913 Simultaneous wafer bonding and interconnect joining Apr. 29, 2014
8709912 Semiconductor device manufacturing method and device for same Apr. 29, 2014
8709911 Method for producing SOI substrate and SOI substrate Apr. 29, 2014
8709868 Sensor packages and method of packaging dies of differing sizes Apr. 29, 2014
8704238 Method and structure of monolithically integrated IC-MEMS oscillator using IC foundry-compatible processes Apr. 22, 2014
8703579 Method of manufacturing semiconductor device Apr. 22, 2014
8703541 Electronic system with expansion feature Apr. 22, 2014
8695186 Method for manufacturing piezoelectric vibrator Apr. 15, 2014
8692257 Display apparatus and method of manufacturing the display apparatus Apr. 8, 2014
8691670 Methods of forming a semiconductor device Apr. 8, 2014
8691666 Method for producing chip with adhesive applied Apr. 8, 2014
8691665 Method for producing bonded wafer Apr. 8, 2014
8691662 Process for fabricating a silicon-on-insulator structure employing two rapid thermal annealing processes, and related structures Apr. 8, 2014
8691604 Semiconductor device and manufacturing method thereof, delamination method, and transferring method Apr. 8, 2014
8689152 Double-sided integrated circuit chips Apr. 1, 2014
8685844 Sub-10 nm graphene nanoribbon lattices Apr. 1, 2014
8685834 Fabrication method of package structure with simplified encapsulation structure and simplified wiring Apr. 1, 2014
8685806 Silicon-on-insulator substrate with built-in substrate junction Apr. 1, 2014
8685790 Semiconductor device package having backside contact and method for manufacturing Apr. 1, 2014
8683674 Method for stacking microelectronic devices Apr. 1, 2014
8679944 Progressive trimming method Mar. 25, 2014
8674481 Active device on a cleaved silicon substrate Mar. 18, 2014
8669140 Method of forming stacked die package using redistributed chip packaging Mar. 11, 2014
8664085 Method of manufacturing composite substrate Mar. 4, 2014
8664083 Vertical outgassing channels Mar. 4, 2014
8664082 Combination of a substrate and a wafer Mar. 4, 2014
8664081 Method for fabricating 3D integrated circuit device using interface wafer as permanent carrier Mar. 4, 2014
8664078 Manufacturing method of semiconductor device on cavities Mar. 4, 2014
8656740 Manufacturing method of glass-sealed package, and glass substrate Feb. 25, 2014
8652936 Vertical cavity surface emitting devices incorporating wafer fused reflectors Feb. 18, 2014
8652935 Void-free wafer bonding using channels Feb. 18, 2014
8651363 Joining method and device produced by this method and joining unit Feb. 18, 2014
8647964 Temporary wafer bonding method for semiconductor processing Feb. 11, 2014
8647962 Wafer level packaging bond Feb. 11, 2014
8642444 Method of manufacturing bonded substrate, bonded substrate, method of manufacturing solid-state imaging apparatus, solid-state imaging apparatus, and camera Feb. 4, 2014
8642416 Method of forming three dimensional integrated circuit devices using layer transfer technique Feb. 4, 2014
8642393 Package on package devices and methods of forming same Feb. 4, 2014
8638000 Micromechanical method and corresponding assembly for bonding semiconductor substrates and correspondingly bonded semiconductor chip Jan. 28, 2014
8637381 High-k dielectric and silicon nitride box region Jan. 28, 2014
8637379 Device including a semiconductor chip and a carrier and fabrication method Jan. 28, 2014
8637345 Methods of fabricating devices by low pressure cold welding Jan. 28, 2014
8633088 Glass frit wafer bond protective structure Jan. 21, 2014
8633087 Method of manufacturing GaN-based semiconductor device Jan. 21, 2014
8633086 Power devices having reduced on-resistance and methods of their manufacture Jan. 21, 2014
8629553 3D integrated circuit device fabrication with precisely controllable substrate removal Jan. 14, 2014
8629542 Three dimensional structure memory Jan. 14, 2014
8624402 Mock bump system for flip chip integrated circuits Jan. 7, 2014











 
 
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