| |
 |
|
Class Information
Number: 438/455
Name: Semiconductor device manufacturing: process > Bonding of plural semiconductor substrates
Description: Process in which plural semiconductive substrates are joined together into a coherent body, such as by thermal treatment.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7371661 |
Wafer bonding method |
May. 13, 2008 |
| 7371662 |
Method for forming a 3D interconnect and resulting structures |
May. 13, 2008 |
| 7371660 |
Controlled cleaving process |
May. 13, 2008 |
| 7368062 |
Method and apparatus for a low parasitic capacitance butt-joined passive waveguide connected to an active structure |
May. 6, 2008 |
| 7368310 |
Light generating semiconductor device and method of making the same |
May. 6, 2008 |
| 7368332 |
SOI substrate manufacturing method |
May. 6, 2008 |
| 7364974 |
Double gate FET and fabrication process |
Apr. 29, 2008 |
| 7364984 |
Method for manufacturing SOI substrate |
Apr. 29, 2008 |
| 7364982 |
Process for preparing a bonding type semiconductor substrate |
Apr. 29, 2008 |
| 7364958 |
CMOS on hybrid substrate with different crystal orientations using silicon-to-silicon direct wafer bonding |
Apr. 29, 2008 |
| 7361573 |
Method of peeling off and method of manufacturing semiconductor device |
Apr. 22, 2008 |
| 7358164 |
Crystal imprinting methods for fabricating substrates with thin active silicon layers |
Apr. 15, 2008 |
| 7358147 |
Process for producing SOI wafer |
Apr. 15, 2008 |
| 7358152 |
Wafer bonding of thinned electronic materials and circuits to high performance substrate |
Apr. 15, 2008 |
| 7358161 |
Methods of forming transistor devices associated with semiconductor-on-insulator constructions |
Apr. 15, 2008 |
| 7355226 |
Power semiconductor and method of fabrication |
Apr. 8, 2008 |
| 7354844 |
Method for manufacturing SOI substrate |
Apr. 8, 2008 |
| 7351644 |
Thin handle substrate method and structure for fabricating devices using one or more films provided by a layer transfer process |
Apr. 1, 2008 |
| 7348252 |
Method of forming silicon-on-insulator wafer having reentrant shape dielectric trenches |
Mar. 25, 2008 |
| 7348258 |
Method and device for controlled cleaving process |
Mar. 25, 2008 |
| 7348260 |
Method for forming a relaxed or pseudo-relaxed useful layer on a substrate |
Mar. 25, 2008 |
| 7348535 |
Metal line structure of optical scanner and method of fabricating the same |
Mar. 25, 2008 |
| 7349140 |
Triple alignment substrate method and structure for packaging devices |
Mar. 25, 2008 |
| 7344958 |
Method for wafer bonding (A1, In, Ga)N and Zn(S, Se) for optoelectronic applications |
Mar. 18, 2008 |
| 7344957 |
SOI wafer with cooling channels and a method of manufacture thereof |
Mar. 18, 2008 |
| 7341923 |
Substrate, manufacturing method therefor, and semiconductor device |
Mar. 11, 2008 |
| 7341924 |
Method for manufacturing semiconductor device |
Mar. 11, 2008 |
| 7338839 |
Method for producing an electrical component |
Mar. 4, 2008 |
| 7338884 |
Interconnecting substrate for carrying semiconductor device, method of producing thereof and package of semiconductor device |
Mar. 4, 2008 |
| 7335573 |
Vehicle, display device and manufacturing method for a semiconductor device |
Feb. 26, 2008 |
| 7335572 |
Method for low temperature bonding and bonded structure |
Feb. 26, 2008 |
| 7335533 |
Methods for assembling semiconductor devices in superimposed relation with adhesive material defining the distance adjacent semiconductor devices are spaced apart from one another |
Feb. 26, 2008 |
| 7332381 |
Semiconductor device and method of manufacturing the same |
Feb. 19, 2008 |
| 7332410 |
Method of epitaxial-like wafer bonding at low temperature and bonded structure |
Feb. 19, 2008 |
| 7332413 |
Semiconductor wafers including one or more reinforcement structures and methods of forming the same |
Feb. 19, 2008 |
| 7332417 |
Semiconductor structures with structural homogeneity |
Feb. 19, 2008 |
| 7323395 |
Manufacture of solid state electronic components |
Jan. 29, 2008 |
| 7323396 |
Signal and/or ground planes with double buried insulator layers and fabrication process |
Jan. 29, 2008 |
| 7320928 |
Method of forming a stacked device filler |
Jan. 22, 2008 |
| 7312487 |
Three dimensional integrated circuit |
Dec. 25, 2007 |
| 7306970 |
Method and apparatus for manufacturing an optoelectronic device |
Dec. 11, 2007 |
| 7307003 |
Method of forming a multi-layer semiconductor structure incorporating a processing handle member |
Dec. 11, 2007 |
| 7307004 |
Method with mechanically strained silicon for enhancing speed of integrated circuits or devices |
Dec. 11, 2007 |
| 7307005 |
Wafer bonding with highly compliant plate having filler material enclosed hollow core |
Dec. 11, 2007 |
| 7303976 |
Wafer bonding method |
Dec. 4, 2007 |
| 7300853 |
Thin layer semi-conductor structure comprising a heat distribution layer |
Nov. 27, 2007 |
| 7300820 |
Adhesive assembly for a circuit board |
Nov. 27, 2007 |
| 7297562 |
Circuit-on-foil process for manufacturing a laminated semiconductor package substrate having embedded conductive patterns |
Nov. 20, 2007 |
| 7297610 |
Method of segmenting a wafer |
Nov. 20, 2007 |
| 7297611 |
Method for producing thin layers of semiconductor material from a donor wafer |
Nov. 20, 2007 |
|
|
|
