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Class Information
Number: 438/455
Name: Semiconductor device manufacturing: process > Bonding of plural semiconductor substrates
Description: Process in which plural semiconductive substrates are joined together into a coherent body, such as by thermal treatment.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7615468 |
Methods for making substrates and substrates formed therefrom |
Nov. 10, 2009 |
| 7615464 |
Transfer method with a treatment of a surface to be bonded |
Nov. 10, 2009 |
| 7615462 |
Etch stop layer for silicon (Si) via etch in three-dimensional (3-D) wafer-to-wafer vertical stack |
Nov. 10, 2009 |
| 7614137 |
Method of manufacturing a magnetic slider head |
Nov. 10, 2009 |
| 7608522 |
Method for fabricating a hybrid orientation substrate |
Oct. 27, 2009 |
| 7608521 |
Producing SOI structure using high-purity ion shower |
Oct. 27, 2009 |
| 7608520 |
Method for bonding substrate, bonded substrate, and direct bonded substrate |
Oct. 27, 2009 |
| 7605058 |
Wafer dividing method |
Oct. 20, 2009 |
| 7605054 |
Method of forming a device wafer with recyclable support |
Oct. 20, 2009 |
| 7605053 |
Glass-based SOI structures |
Oct. 20, 2009 |
| 7605052 |
Method of forming an integrated circuit having a device wafer with a diffused doped backside layer |
Oct. 20, 2009 |
| 7605051 |
Method for forming internal electrode pattern and method for manufacturing multilayer ceramic electronic component using same |
Oct. 20, 2009 |
| 7605050 |
Method of bonding a polymer surface to a conducting or semiconducting surface and application of the same |
Oct. 20, 2009 |
| 7605022 |
Methods of manufacturing a three-dimensional semiconductor device and semiconductor devices fabricated thereby |
Oct. 20, 2009 |
| 7602046 |
Recycling by mechanical means of a wafer comprising a multilayer structure after taking-off a thin layer thereof |
Oct. 13, 2009 |
| 7601613 |
Manufacturing method of bonded wafer |
Oct. 13, 2009 |
| 7601612 |
Method for forming solder joints for a flip chip assembly |
Oct. 13, 2009 |
| 7601611 |
Method of fabricating a semiconductor hetero-structure |
Oct. 13, 2009 |
| 7601236 |
Method of manufacturing display device |
Oct. 13, 2009 |
| 7598153 |
Method and structure for fabricating bonded substrate structures using thermal processing to remove oxygen species |
Oct. 6, 2009 |
| 7598152 |
Device and method for bonding wafers |
Oct. 6, 2009 |
| 7598145 |
Method for producing Si.sub.1-yGe.sub.y based zones with different contents in Ge on a same substrate by condensation of germanium |
Oct. 6, 2009 |
| 7598099 |
Method of controlling a fabrication process using an iso-dense bias |
Oct. 6, 2009 |
| 7595545 |
Anodic bonding apparatus, anodic bonding method, and method of producing acceleration sensor |
Sep. 29, 2009 |
| 7595223 |
Process for bonding and electrically connecting microsystems integrated in several distinct substrates |
Sep. 29, 2009 |
| 7592239 |
Flexible single-crystal film and method of manufacturing the same |
Sep. 22, 2009 |
| 7588998 |
Method for producing a semiconductor element |
Sep. 15, 2009 |
| 7588997 |
Method of fabricating a thin film |
Sep. 15, 2009 |
| 7586154 |
Method for fabricating a substrate with useful layer on high resistivity support |
Sep. 8, 2009 |
| 7585748 |
Process for manufacturing a multilayer structure made from semiconducting materials |
Sep. 8, 2009 |
| 7585747 |
Low temperature hermetic bonding at water level and method of bonding for micro display application |
Sep. 8, 2009 |
| 7582540 |
Method for manufacturing SOI wafer |
Sep. 1, 2009 |
| 7582513 |
Electronic device and method for producing electronic devices |
Sep. 1, 2009 |
| 7579621 |
Integrated BST microwave tunable devices using buffer layer transfer method |
Aug. 25, 2009 |
| 7579268 |
Method of manufacturing an integrated circuit |
Aug. 25, 2009 |
| 7579259 |
Simplified method of producing an epitaxially grown structure |
Aug. 25, 2009 |
| 7579258 |
Semiconductor interconnect having adjacent reservoir for bonding and method for formation |
Aug. 25, 2009 |
| 7579257 |
Sample separating apparatus and method, and substrate manufacturing method |
Aug. 25, 2009 |
| 7579229 |
Semiconductor device and semiconductor substrate |
Aug. 25, 2009 |
| 7578891 |
Adhesive bonding sheet, semiconductor device using the same, and method for manufacturing such semiconductor device |
Aug. 25, 2009 |
| 7575988 |
Method of fabricating a hybrid substrate |
Aug. 18, 2009 |
| 7572739 |
Tape removal in semiconductor structure fabrication |
Aug. 11, 2009 |
| 7572649 |
Device transferring system, device transferring method, and display manufacturing method |
Aug. 11, 2009 |
| 7566632 |
Lock and key structure for three-dimensional chip connection and process thereof |
Jul. 28, 2009 |
| 7566631 |
Low temperature fusion bonding with high surface energy using a wet chemical treatment |
Jul. 28, 2009 |
| 7566585 |
Semiconductor component and method for production of a semiconductor component |
Jul. 28, 2009 |
| 7563693 |
Method for manufacturing semiconductor substrate and semiconductor substrate |
Jul. 21, 2009 |
| 7563692 |
Microelectromechanical system pressure sensor and method for making and using |
Jul. 21, 2009 |
| 7563691 |
Method for plasma enhanced bonding and bonded structures formed by plasma enhanced bonding |
Jul. 21, 2009 |
| 7563681 |
Double-gated non-volatile memory and methods for forming thereof |
Jul. 21, 2009 |
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