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Class Information
Number: 438/422
Name: Semiconductor device manufacturing: process > Formation of electrically isolated lateral semiconductive structure > Having air-gap dielectric (e.g., groove, etc.) > Enclosed cavity
Description: Process wherein the air-gap dielectric is in the form of an enclosed cavity or void between the laterally spaced semiconductive regions.










Patents under this class:
1 2 3 4 5 6

Patent Number Title Of Patent Date Issued
8711897 Split-ring resonator creating a photonic metamaterial Apr. 29, 2014
8703576 Gap-fill keyhole repair using printable dielectric material Apr. 22, 2014
8692318 Trench MOS structure and method for making the same Apr. 8, 2014
8674472 Low harmonic RF switch in SOI Mar. 18, 2014
8674474 Biosensors integrated with a microfluidic structure Mar. 18, 2014
8659115 Airgap-containing interconnect structure with improved patternable low-K material and method of fabricating Feb. 25, 2014
8629035 Method of manufacturing semiconductor device Jan. 14, 2014
8629036 Integrated semiconductor devices with amorphous silicon beam, methods of manufacture and design structure Jan. 14, 2014
8623741 Homogeneous porous low dielectric constant materials Jan. 7, 2014
8609508 Method of fabricating an integrated circuit having a strain inducing hollow trench isolation region Dec. 17, 2013
8609507 Semiconductor device and method of manufacturing the same Dec. 17, 2013
8603889 Integrated circuit structure having air-gap trench isolation and related design structure Dec. 10, 2013
8587095 Method for establishing and closing a trench of a semiconductor component Nov. 19, 2013
8563446 Technique to create a buried plate in embedded dynamic random access memory device Oct. 22, 2013
8557691 Method of fabricating semiconductor device having buried wiring and related device Oct. 15, 2013
8551859 Biosensors integrated with a microfluidic structure Oct. 8, 2013
8546240 Methods of manufacturing integrated semiconductor devices with single crystalline beam Oct. 1, 2013
8546909 Nonvolatile semiconductor memory device having air gap proximate to element isolation region and method of manufacturing the same Oct. 1, 2013
8518794 Semiconductor devices and methods of forming thereof Aug. 27, 2013
8513063 Method for encapsulating microelectronic devices Aug. 20, 2013
8501578 Semiconductor structure formed without requiring thermal oxidation Aug. 6, 2013
8497183 Devices having a cavity structure and related methods Jul. 30, 2013
8492239 Homogeneous porous low dielectric constant materials Jul. 23, 2013
8481354 Methods of creating a micro electro-mechanical systems accelerometer using a single double silicon-on-insulator wafer Jul. 9, 2013
8481400 Semiconductor manufacturing and semiconductor device with semiconductor structure Jul. 9, 2013
8476118 Semiconductor device and fabrication mehtod of the semiconductor device Jul. 2, 2013
8476734 Semiconductor component and methods for producing a semiconductor component Jul. 2, 2013
8461015 STI structure and method of forming bottom void in same Jun. 11, 2013
8420428 Method for forming buried cavities within a semiconductor body, and semiconductor body thus made Apr. 16, 2013
8395217 Isolation in CMOSFET devices utilizing buried air bags Mar. 12, 2013
8349697 Field effect transistor with air gap dielectric Jan. 8, 2013
8344474 Microstructure device including a metallization structure with self-aligned air gaps and refilled air gap exclusion zones Jan. 1, 2013
8334188 Process for manufacturing a wafer by annealing of buried channels Dec. 18, 2012
8318581 Micro-electromechanical system devices Nov. 27, 2012
8314005 Homogeneous porous low dielectric constant materials Nov. 20, 2012
8309424 Methods of forming electrically insulative materials, methods of forming low k dielectric regions, and methods of forming semiconductor constructions Nov. 13, 2012
8304845 Method for sealing an opening Nov. 6, 2012
8298910 Method of fabricating semiconductor device Oct. 30, 2012
8293617 Gap processing Oct. 23, 2012
8241989 Integrated circuit with stacked devices Aug. 14, 2012
8241992 Method for air gap interconnect integration using photo-patternable low k material Aug. 14, 2012
8236710 Technique to create a buried plate in embedded dynamic random access memory device Aug. 7, 2012
8211777 Method of manufacturing nonvolatile semiconductor device Jul. 3, 2012
8178409 Semiconductor device with alternately arranged P-type and N-type thin semiconductor layers and method for manufacturing the same May. 15, 2012
8173513 Method for manufacturing a semiconductor pressure sensor May. 8, 2012
8148235 Methods of manufacturing semiconductor devices Apr. 3, 2012
8133794 Semiconductor structure and method of manufacture Mar. 13, 2012
8101448 Manufacturing method of a gas sensor integrated on a semiconductor substrate Jan. 24, 2012
8058138 Gap processing Nov. 15, 2011
8048760 Semiconductor structure and method of manufacture Nov. 1, 2011

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