Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Browse by Category: Main > Engineering
Class Information
Number: 438/406
Name: Semiconductor device manufacturing: process > Formation of electrically isolated lateral semiconductive structure > Total dielectric isolation > Bonding of plural semiconductive substrates
Description: Process for making a total dielectric isolation semiconductor structure including a step of joining plural semiconductive substrates together into a coherent monolith, such as by thermal treatment.










Patents under this class:
1 2 3 4 5 6 7 8 9 10 11

Patent Number Title Of Patent Date Issued
5710057 SOI fabrication method Jan. 20, 1998
5693574 Process for the laminar joining of silicon semiconductor slices Dec. 2, 1997
5691231 Method of manufacturing silicon on insulating substrate Nov. 25, 1997
5688702 Process of making a semiconductor device using a silicon-on-insulator substrate Nov. 18, 1997
5686364 Method for producing substrate to achieve semiconductor integrated circuits Nov. 11, 1997
5681775 Soi fabrication process Oct. 28, 1997
5670387 Process for forming semiconductor-on-insulator device Sep. 23, 1997
5654220 Method of making a stacked 3D integrated circuit structure Aug. 5, 1997
5650354 Method for producing semiconductor device Jul. 22, 1997
5643821 Method for making ohmic contact to lightly doped islands from a silicide buried layer and applications Jul. 1, 1997
5616512 Power semiconductor devices Apr. 1, 1997
5607875 Method of separating a semiconductor wafer with dielectrics Mar. 4, 1997
5602052 Method of forming dummy island capacitor Feb. 11, 1997
5599722 SOI semiconductor device and method of producing same wherein warpage is reduced in the semiconductor device Feb. 4, 1997
5597739 MOS transistor and method for making the same Jan. 28, 1997
5593915 Method of manufacturing semiconductor device Jan. 14, 1997
5589419 Process for fabricating semiconductor device having a multilevel interconnection Dec. 31, 1996
5585661 Sub-micron bonded SOI by trench planarization Dec. 17, 1996
5585304 Method of making semiconductor device with multiple transparent layers Dec. 17, 1996
5576241 Method of separating semiconductor wafer with dielectrics Nov. 19, 1996
5573972 Method for manufacturing a silicon bonded wafer Nov. 12, 1996
5569621 Integrated circuit chip supported by a handle wafer and provided with means to maintain the handle wafer potential at a desired level Oct. 29, 1996
5569620 Bonded wafer processing with metal silicidation Oct. 29, 1996
5561077 Dielectric element isolated semiconductor device and a method of manufacturing the same Oct. 1, 1996
5549762 Photovoltaic generator with dielectric isolation and bonded, insulated wafer layers Aug. 27, 1996
5547886 Method of producing a semiconductor device Aug. 20, 1996
5529947 Semiconductor device with clad substrate and fabrication process therefor Jun. 25, 1996
5504033 Method for forming recessed oxide isolation containing deep and shallow trenches Apr. 2, 1996
5496764 Process for forming a semiconductor region adjacent to an insulating layer Mar. 5, 1996
5496760 Method for manufacturing dielectrics dividing wafer with isolated regions Mar. 5, 1996
5494846 Method of manufacturing semiconductor device Feb. 27, 1996
5484738 Method of forming silicon on oxide semiconductor device structure for BiCMOS integrated circuits Jan. 16, 1996
5478758 Method of making a getterer for multi-layer wafers Dec. 26, 1995
5476809 Semiconductor device and method of manufacturing the same Dec. 19, 1995
5474652 Method of dry etching InAlAs and InGaAs lattice matched to InP Dec. 12, 1995
5474952 Process for producing a semiconductor device Dec. 12, 1995
5468674 Method for forming low and high minority carrier lifetime layers in a single semiconductor structure Nov. 21, 1995
5466631 Method for producing semiconductor articles Nov. 14, 1995
5466631 Method for producing semiconductor articles Nov. 14, 1995
5461001 Method for making semiconductor structures having environmentally isolated elements Oct. 24, 1995
5459104 Process for production of semiconductor substrate Oct. 17, 1995
5449638 Process on thickness control for silicon-on-insulator technology Sep. 12, 1995
5443661 SOI (silicon on insulator) substrate with enhanced gettering effects Aug. 22, 1995
5444014 Method for fabricating semiconductor device Aug. 22, 1995
5437762 Method and apparatus for semiconductor memory Aug. 1, 1995
5436173 Method for forming a semiconductor on insulator device Jul. 25, 1995
5420064 Method of manufacturing a dielectric isolation substrate May. 30, 1995
5413952 Direct wafer bonded structure method of making May. 9, 1995
5403769 Process for producing a semiconductor device Apr. 4, 1995
5401670 Technique to manufacture a SOI wafer and its applications in integrated circuits manufacturing Mar. 28, 1995

1 2 3 4 5 6 7 8 9 10 11










 
 
  Recently Added Patents
Method and system for implementing power detection
Method and apparatus for over-the-air activation of neighborhood cordless-type services
Method for conformal plasma immersed ion implantation assisted by atomic layer deposition
Method of controlling mechanical mechanisms of optical storage apparatus for peak power/current reduction, and related optical storage apparatus and machine-readable medium
Display fixture for highlighting products
Optical scanner and image-forming device
Caprazene as a novel compound and derivatives thereof, and caprazol as a novel compound and derivatives thereof
  Randomly Featured Patents
Process for the preparation of ink jet process printing plate
Medical demonstration model
Fuel injection system and timing advance device therefor
Pump jack operated compressor
Method for the manufacture of the extrinsic base of an NPN transistor in a high-frequency bipolar technology
Sheet guide mechanism for use in an imaging device
Method of manufacturing circuit device
Game target
Device for fastening a cartridge case to a projectile
Electric rotating machine and manufacturing method thereof