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Class Information
Number: 438/406
Name: Semiconductor device manufacturing: process > Formation of electrically isolated lateral semiconductive structure > Total dielectric isolation > Bonding of plural semiconductive substrates
Description: Process for making a total dielectric isolation semiconductor structure including a step of joining plural semiconductive substrates together into a coherent monolith, such as by thermal treatment.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 5494846 |
Method of manufacturing semiconductor device |
Feb. 27, 1996 |
| 5484738 |
Method of forming silicon on oxide semiconductor device structure for BiCMOS integrated circuits |
Jan. 16, 1996 |
| 5478758 |
Method of making a getterer for multi-layer wafers |
Dec. 26, 1995 |
| 5476809 |
Semiconductor device and method of manufacturing the same |
Dec. 19, 1995 |
| 5474952 |
Process for producing a semiconductor device |
Dec. 12, 1995 |
| 5474652 |
Method of dry etching InAlAs and InGaAs lattice matched to InP |
Dec. 12, 1995 |
| 5468674 |
Method for forming low and high minority carrier lifetime layers in a single semiconductor structure |
Nov. 21, 1995 |
| 5466631 |
Method for producing semiconductor articles |
Nov. 14, 1995 |
| 5466631 |
Method for producing semiconductor articles |
Nov. 14, 1995 |
| 5461001 |
Method for making semiconductor structures having environmentally isolated elements |
Oct. 24, 1995 |
| 5459104 |
Process for production of semiconductor substrate |
Oct. 17, 1995 |
| 5449638 |
Process on thickness control for silicon-on-insulator technology |
Sep. 12, 1995 |
| 5443661 |
SOI (silicon on insulator) substrate with enhanced gettering effects |
Aug. 22, 1995 |
| 5444014 |
Method for fabricating semiconductor device |
Aug. 22, 1995 |
| 5437762 |
Method and apparatus for semiconductor memory |
Aug. 1, 1995 |
| 5436173 |
Method for forming a semiconductor on insulator device |
Jul. 25, 1995 |
| 5420064 |
Method of manufacturing a dielectric isolation substrate |
May. 30, 1995 |
| 5413952 |
Direct wafer bonded structure method of making |
May. 9, 1995 |
| 5403769 |
Process for producing a semiconductor device |
Apr. 4, 1995 |
| 5401670 |
Technique to manufacture a SOI wafer and its applications in integrated circuits manufacturing |
Mar. 28, 1995 |
| 5399231 |
Method of forming crystalline silicon devices on glass |
Mar. 21, 1995 |
| 5387555 |
Bonded wafer processing with metal silicidation |
Feb. 7, 1995 |
| 5369050 |
Method of fabricating semiconductor device |
Nov. 29, 1994 |
| 5366923 |
Bonded wafer structure having a buried insulation layer |
Nov. 22, 1994 |
| 5362659 |
Method for fabricating vertical bipolar junction transistors in silicon bonded to an insulator |
Nov. 8, 1994 |
| 5352625 |
Method of manufacturing semiconductor substrate |
Oct. 4, 1994 |
| 5346848 |
Method of bonding silicon and III-V semiconductor materials |
Sep. 13, 1994 |
| 5336634 |
Dielectrically isolated substrate and a process for producing the same |
Aug. 9, 1994 |
| 5308776 |
Method of manufacturing SOI semiconductor device |
May. 3, 1994 |
| 5298449 |
Semiconductor substrate having a silicon-on-insulator structure and method of fabricating the same |
Mar. 29, 1994 |
| 5290715 |
Method of making dielectrically isolated metal base transistors and permeable base transistors |
Mar. 1, 1994 |
| 5286670 |
Method of manufacturing a semiconductor device having buried elements with electrical characteristic |
Feb. 15, 1994 |
| 5278102 |
SOI device and a fabrication process thereof |
Jan. 11, 1994 |
| 5277748 |
Semiconductor device substrate and process for preparing the same |
Jan. 11, 1994 |
| 5272104 |
Bonded wafer process incorporating diamond insulator |
Dec. 21, 1993 |
| 5268326 |
Method of making dielectric and conductive isolated island |
Dec. 7, 1993 |
| 5266511 |
Process for manufacturing three dimensional IC's |
Nov. 30, 1993 |
| 5262346 |
Nitride polish stop for forming SOI wafers |
Nov. 16, 1993 |
| 5260233 |
Semiconductor device and wafer structure having a planar buried interconnect by wafer bonding |
Nov. 9, 1993 |
| 5258323 |
Single crystal silicon on quartz |
Nov. 2, 1993 |
| 5238865 |
Process for producing laminated semiconductor substrate |
Aug. 24, 1993 |
| 5234535 |
Method of producing a thin silicon-on-insulator layer |
Aug. 10, 1993 |
| 5223450 |
Method of producing semiconductor substrate having dielectric separation region |
Jun. 29, 1993 |
| 5213993 |
Method of manufacturing semiconductor substrate dielectric isolating structure |
May. 25, 1993 |
| 5204282 |
Semiconductor circuit structure and method for making the same |
Apr. 20, 1993 |
| H1137 |
Wafer bonding technique for dielectric isolation processing |
Feb. 2, 1993 |
| 5164218 |
Semiconductor device and a method for producing the same |
Nov. 17, 1992 |
| 5124274 |
Method for production of dielectric-separation substrate |
Jun. 23, 1992 |
| 5098861 |
Method of processing a semiconductor substrate including silicide bonding |
Mar. 24, 1992 |
| 5096854 |
Method for polishing a silicon wafer using a ceramic polishing surface having a maximum surface roughness less than 0.02 microns |
Mar. 17, 1992 |
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