Resources Contact Us Home
Browse by Category: Main > Engineering
Class Information
Number: 438/406
Name: Semiconductor device manufacturing: process > Formation of electrically isolated lateral semiconductive structure > Total dielectric isolation > Bonding of plural semiconductive substrates
Description: Process for making a total dielectric isolation semiconductor structure including a step of joining plural semiconductive substrates together into a coherent monolith, such as by thermal treatment.

Patents under this class:
1 2 3 4 5 6 7 8 9 10 11

Patent Number Title Of Patent Date Issued
5650354 Method for producing semiconductor device Jul. 22, 1997
5643821 Method for making ohmic contact to lightly doped islands from a silicide buried layer and applications Jul. 1, 1997
5616512 Power semiconductor devices Apr. 1, 1997
5607875 Method of separating a semiconductor wafer with dielectrics Mar. 4, 1997
5602052 Method of forming dummy island capacitor Feb. 11, 1997
5599722 SOI semiconductor device and method of producing same wherein warpage is reduced in the semiconductor device Feb. 4, 1997
5597739 MOS transistor and method for making the same Jan. 28, 1997
5593915 Method of manufacturing semiconductor device Jan. 14, 1997
5589419 Process for fabricating semiconductor device having a multilevel interconnection Dec. 31, 1996
5585304 Method of making semiconductor device with multiple transparent layers Dec. 17, 1996
5585661 Sub-micron bonded SOI by trench planarization Dec. 17, 1996
5576241 Method of separating semiconductor wafer with dielectrics Nov. 19, 1996
5573972 Method for manufacturing a silicon bonded wafer Nov. 12, 1996
5569620 Bonded wafer processing with metal silicidation Oct. 29, 1996
5569621 Integrated circuit chip supported by a handle wafer and provided with means to maintain the handle wafer potential at a desired level Oct. 29, 1996
5561077 Dielectric element isolated semiconductor device and a method of manufacturing the same Oct. 1, 1996
5549762 Photovoltaic generator with dielectric isolation and bonded, insulated wafer layers Aug. 27, 1996
5547886 Method of producing a semiconductor device Aug. 20, 1996
5529947 Semiconductor device with clad substrate and fabrication process therefor Jun. 25, 1996
5504033 Method for forming recessed oxide isolation containing deep and shallow trenches Apr. 2, 1996
5496760 Method for manufacturing dielectrics dividing wafer with isolated regions Mar. 5, 1996
5496764 Process for forming a semiconductor region adjacent to an insulating layer Mar. 5, 1996
5494846 Method of manufacturing semiconductor device Feb. 27, 1996
5484738 Method of forming silicon on oxide semiconductor device structure for BiCMOS integrated circuits Jan. 16, 1996
5478758 Method of making a getterer for multi-layer wafers Dec. 26, 1995
5476809 Semiconductor device and method of manufacturing the same Dec. 19, 1995
5474652 Method of dry etching InAlAs and InGaAs lattice matched to InP Dec. 12, 1995
5474952 Process for producing a semiconductor device Dec. 12, 1995
5468674 Method for forming low and high minority carrier lifetime layers in a single semiconductor structure Nov. 21, 1995
5466631 Method for producing semiconductor articles Nov. 14, 1995
5466631 Method for producing semiconductor articles Nov. 14, 1995
5461001 Method for making semiconductor structures having environmentally isolated elements Oct. 24, 1995
5459104 Process for production of semiconductor substrate Oct. 17, 1995
5449638 Process on thickness control for silicon-on-insulator technology Sep. 12, 1995
5443661 SOI (silicon on insulator) substrate with enhanced gettering effects Aug. 22, 1995
5444014 Method for fabricating semiconductor device Aug. 22, 1995
5437762 Method and apparatus for semiconductor memory Aug. 1, 1995
5436173 Method for forming a semiconductor on insulator device Jul. 25, 1995
5420064 Method of manufacturing a dielectric isolation substrate May. 30, 1995
5413952 Direct wafer bonded structure method of making May. 9, 1995
5403769 Process for producing a semiconductor device Apr. 4, 1995
5401670 Technique to manufacture a SOI wafer and its applications in integrated circuits manufacturing Mar. 28, 1995
5399231 Method of forming crystalline silicon devices on glass Mar. 21, 1995
5387555 Bonded wafer processing with metal silicidation Feb. 7, 1995
5369050 Method of fabricating semiconductor device Nov. 29, 1994
5366923 Bonded wafer structure having a buried insulation layer Nov. 22, 1994
5362659 Method for fabricating vertical bipolar junction transistors in silicon bonded to an insulator Nov. 8, 1994
5352625 Method of manufacturing semiconductor substrate Oct. 4, 1994
5346848 Method of bonding silicon and III-V semiconductor materials Sep. 13, 1994
5336634 Dielectrically isolated substrate and a process for producing the same Aug. 9, 1994

1 2 3 4 5 6 7 8 9 10 11

  Recently Added Patents
Sliding tool for insertion of a locking strip into a channel for sealing the edge of a film
Light emitting device having a plurality of light emitting cells and package mounting the same
System and method for automatic disabling and enabling of an acoustic beamformer
Ink jet recording method and recorded matter
Power adaptor detection system
Copolymers including biobased monomers and methods of making and using same
Thin film forming method, thin film forming apparatus, and program
  Randomly Featured Patents
Emergency call services for wireless network roaming
Controlled speed coverless air conveyor
Log yarding skyline carriage
Cleaning implements
Pipelined multi-thread processor selecting thread instruction in inter-stage buffer based on count information
Difunctional polymers with terminal hydrazide groups
Nine speed automatic transmission
Method and intelligent digital beam forming system with improved signal quality communications
Method for creating 3-D single gate inverter
Process for hydroformylation using a catalyst based on cobalt and/or rhodium employed in a two-phase medium