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Class Information
Number: 438/406
Name: Semiconductor device manufacturing: process > Formation of electrically isolated lateral semiconductive structure > Total dielectric isolation > Bonding of plural semiconductive substrates
Description: Process for making a total dielectric isolation semiconductor structure including a step of joining plural semiconductive substrates together into a coherent monolith, such as by thermal treatment.

Patents under this class:
1 2 3 4 5 6 7 8 9 10 11

Patent Number Title Of Patent Date Issued
8709913 Simultaneous wafer bonding and interconnect joining Apr. 29, 2014
8709951 Implementing state-of-the-art gate transistor, sidewall profile/angle control by tuning gate etch process recipe parameters Apr. 29, 2014
8679944 Progressive trimming method Mar. 25, 2014
8673740 Method for formation of an electrically conducting through via Mar. 18, 2014
8673733 Methods of transferring layers of material in 3D integration processes and related structures and devices Mar. 18, 2014
8664083 Vertical outgassing channels Mar. 4, 2014
8664078 Manufacturing method of semiconductor device on cavities Mar. 4, 2014
8647962 Wafer level packaging bond Feb. 11, 2014
8623740 Method of detaching semi-conductor layers at low temperature Jan. 7, 2014
8624402 Mock bump system for flip chip integrated circuits Jan. 7, 2014
8618639 Semiconductor structure, semiconductor device having a semiconductor structure, and method for manufacturing a semiconductor structure Dec. 31, 2013
8609511 Semiconductor device manufacturing method, semiconductor device, and camera module Dec. 17, 2013
8598013 Method for manufacturing SOI substrate and semiconductor device Dec. 3, 2013
8575741 Method of manufacturing a semiconductor device Nov. 5, 2013
8564085 CMOS image sensor structure Oct. 22, 2013
8557676 Method of manufacturing SOI substrate and method of manufacturing semiconductor device Oct. 15, 2013
8551860 Semiconductor devices having through electrodes and methods of fabricating the same Oct. 8, 2013
8546237 Transferring and resizing of epitaxial film arrays and method thereof Oct. 1, 2013
8546170 MEMS process and device Oct. 1, 2013
8536044 Protecting bond pad for subsequent processing Sep. 17, 2013
8530336 Method for manufacturing semiconductor substrate Sep. 10, 2013
8507913 Method of bonding wafers Aug. 13, 2013
8501515 Methods of forming micro-electromechanical resonators using passive compensation techniques Aug. 6, 2013
8501588 Method for making a semiconductor structure with a buried ground plane Aug. 6, 2013
8497187 Method for manufacturing SOI wafer and SOI wafer Jul. 30, 2013
8486771 Methods of forming relaxed layers of semiconductor materials, semiconductor structures, devices and engineered substrates including same Jul. 16, 2013
8486817 Method for forming an integrated circuit level by sequential tridimensional integration Jul. 16, 2013
8476146 Reducing wafer distortion through a low CTE layer Jul. 2, 2013
8461013 Semiconductor device and method for manufacturing the same Jun. 11, 2013
8461014 Methods of fabricating semiconductor structures and devices with strained semiconductor material Jun. 11, 2013
8425715 Apparatus for high throughput wafer bonding Apr. 23, 2013
8415208 Semiconductor device and peeling off method and method of manufacturing semiconductor device Apr. 9, 2013
8404557 Method for forming a semiconductor device and a semiconductor device Mar. 26, 2013
8394703 Manufacturing method of SOI substrate and manufacturing method of semiconductor device Mar. 12, 2013
8383487 Method for manufacturing SOI substrate Feb. 26, 2013
8363995 Sub-micron planar lightwave devices formed on an SOI optical platform Jan. 29, 2013
8361881 Method for alternately contacting two wafers Jan. 29, 2013
8354330 Method of fabricating SOI super-junction LDMOS structure capable of completely eliminating substrate-assisted depletion effects Jan. 15, 2013
8343847 Manufacturing method of SOI semiconductor device Jan. 1, 2013
8324075 Methods for recycling substrates and fabricating laminated wafers Dec. 4, 2012
8313989 SOI substrate and method for manufacturing the same Nov. 20, 2012
8314010 Method of manufacturing a semiconductor device including thermal oxidation to form an insulating film Nov. 20, 2012
8309428 Capacitive micromachined ultrasonic transducer Nov. 13, 2012
8309429 Method for manufacturing semiconductor substrate and semiconductor device Nov. 13, 2012
8304324 Low-temperature wafer bonding of semiconductors to metals Nov. 6, 2012
8288248 Method of manufacturing semiconductor device having island-like single crystal semiconductor layer Oct. 16, 2012
8278187 Method for reprocessing semiconductor substrate by stepwise etching with at least two etching treatments Oct. 2, 2012
8278192 Trench formation method for releasing a thin-film substrate from a reusable semiconductor template Oct. 2, 2012
8279615 Encapsulation module method for production and use thereof Oct. 2, 2012
8247307 Manufacturing method of substrate provided with semiconductor films Aug. 21, 2012

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