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Class Information
Number: 438/401
Name: Semiconductor device manufacturing: process > Formation of electrically isolated lateral semiconductive structure > Having substrate registration feature (e.g., alignment mark)
Description: Process wherein the process of forming electrical isolation utilizes an alignment feature formed on the semiconductive substrate or forms an alignment feature for subsequent use.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7432605 |
Overlay mark, method for forming the same and application thereof |
Oct. 7, 2008 |
| 7433038 |
Alignment of substrates for bonding |
Oct. 7, 2008 |
| 7429522 |
Dicing die-bonding film |
Sep. 30, 2008 |
| 7422955 |
Method for manufacturing a semiconductor device, as well as a semiconductor substrate |
Sep. 9, 2008 |
| 7419882 |
Alignment mark and alignment method for the fabrication of trench-capacitor dram devices |
Sep. 2, 2008 |
| 7419899 |
Method for manufacturing semiconductor device |
Sep. 2, 2008 |
| 7415319 |
Lithographic apparatus and device manufacturing method |
Aug. 19, 2008 |
| 7410880 |
Method for measuring bonding quality of bonded substrates, metrology apparatus, and method of producing a device from a bonded substrate |
Aug. 12, 2008 |
| 7408265 |
Use of a dual-tone resist to form photomasks including alignment mark protection, intermediate semiconductor device structures and bulk semiconductor device substrates |
Aug. 5, 2008 |
| 7405134 |
Method of manufacturing a semiconductor device and electronic equipment |
Jul. 29, 2008 |
| 7393754 |
Tape carrier type semiconductor device and method of producing the same |
Jul. 1, 2008 |
| 7390722 |
System and method for using an oxidation process to create a stepper alignment structure on semiconductor wafers |
Jun. 24, 2008 |
| 7390723 |
Alignment method of using alignment marks on wafer edge |
Jun. 24, 2008 |
| 7379184 |
Overlay measurement target |
May. 27, 2008 |
| 7371655 |
Method of fabricating low-power CMOS device |
May. 13, 2008 |
| 7371652 |
Alignment using fiducial features |
May. 13, 2008 |
| 7368362 |
Methods for increasing photo alignment margins |
May. 6, 2008 |
| 7361569 |
Methods for increasing photo-alignment margins |
Apr. 22, 2008 |
| 7359054 |
Overlay target and measurement method using reference and sub-grids |
Apr. 15, 2008 |
| 7349140 |
Triple alignment substrate method and structure for packaging devices |
Mar. 25, 2008 |
| 7348246 |
Methods of fabricating non-volatile memory devices including divided charge storage structures |
Mar. 25, 2008 |
| 7348109 |
Reticle, semiconductor die and method of manufacturing semiconductor device |
Mar. 25, 2008 |
| 7344955 |
Cut-and-paste imprint lithographic mold and method therefor |
Mar. 18, 2008 |
| 7346415 |
Semiconductor wafer positioning method, and apparatus using the same |
Mar. 18, 2008 |
| 7338885 |
Alignment mark and method for manufacturing a semiconductor device having the same |
Mar. 4, 2008 |
| 7335571 |
Method of making a semiconductor device having an opening in a solder mask |
Feb. 26, 2008 |
| 7332405 |
Method of forming alignment marks for semiconductor device fabrication |
Feb. 19, 2008 |
| 7330261 |
Marker structure for optical alignment of a substrate, a substrate including such a marker structure, an alignment method for aligning to such a marker structure, and a lithographic projection |
Feb. 12, 2008 |
| 7323393 |
Method of reducing film stress on overlay mark |
Jan. 29, 2008 |
| 7319073 |
Method of reducing silicon damage around laser marking region of wafers in STI CMP process |
Jan. 15, 2008 |
| 7316963 |
Method for manufacturing semiconductor device |
Jan. 8, 2008 |
| 7313873 |
Surface position measuring method, exposure apparatus, and device manufacturing method |
Jan. 1, 2008 |
| 7307001 |
Wafer repair method using direct-writing |
Dec. 11, 2007 |
| 7304713 |
Liquid crystal display panel with marks for checking cutting precision by visual inspection |
Dec. 4, 2007 |
| 7294937 |
Apparatus and method for manufacturing a semiconductor wafer with reduced delamination and peeling |
Nov. 13, 2007 |
| 7291931 |
Semiconductor device, semiconductor substrate and fabrication process of a semiconductor device |
Nov. 6, 2007 |
| 7288461 |
Method of forming interconnect having stacked alignment mark |
Oct. 30, 2007 |
| 7289213 |
Apparatus and methods for detecting overlay errors using scatterometry |
Oct. 30, 2007 |
| 7289868 |
System and method for calculating a shift value between pattern instances |
Oct. 30, 2007 |
| 7283236 |
Alignment system and lithographic apparatus equipped with such an alignment system |
Oct. 16, 2007 |
| 7282422 |
Overlay key, method of manufacturing the same and method of measuring an overlay degree using the same |
Oct. 16, 2007 |
| 7282421 |
Methods for reducing a thickness variation of a nitride layer formed in a shallow trench isolation CMP process and for forming a device isolation film of a semiconductor device |
Oct. 16, 2007 |
| 7276423 |
III-nitride device and method with variable epitaxial growth direction |
Oct. 2, 2007 |
| 7271073 |
Marker for alignment of non-transparent gate layer, method for manufacturing such a marker, and use of such a marker in a lithographic apparatus |
Sep. 18, 2007 |
| 7268053 |
Semiconductor wafer and a method for manufacturing a semiconductor wafer |
Sep. 11, 2007 |
| 7268054 |
Methods for increasing photo-alignment margins |
Sep. 11, 2007 |
| 7268440 |
Fabrication of semiconductor integrated circuit chips |
Sep. 11, 2007 |
| 7265021 |
Alignment method, method for manufacturing a semiconductor device, substrate for a semiconductor device, electronic equipment |
Sep. 4, 2007 |
| 7253077 |
Substrate, method of preparing a substrate, method of measurement, lithographic apparatus, device manufacturing method and device manufactured thereby, and machine-readable storage medium |
Aug. 7, 2007 |
| 7247952 |
Optical targets |
Jul. 24, 2007 |
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