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Class Information
Number: 438/33
Name: Semiconductor device manufacturing: process > Making device or circuit emissive of nonelectrical signal > Substrate dicing
Description: Process having a step of dividing the semiconductor substrate into plural separate bodies.










Patents under this class:
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Patent Number Title Of Patent Date Issued
8703513 Method for manufacturing light emitting apparatus, light emitting apparatus, and mounting base thereof Apr. 22, 2014
8703582 Laser processing method Apr. 22, 2014
8705901 Method for making polarization rotator and the polarization rotator made thereby Apr. 22, 2014
8692275 Optoelectronic component and method for producing an optoelectronic component and a compound structure Apr. 8, 2014
8685769 Microchip charge patterning Apr. 1, 2014
8679877 Nitride semiconductor light emitting device and method for manufacturing the same Mar. 25, 2014
8674379 Light-emitting device package and method of manufacturing the same Mar. 18, 2014
8674377 Optoelectronic device package, array and method of fabrication Mar. 18, 2014
8673743 Wafer dividing method Mar. 18, 2014
8673662 Light-emitting diode cutting method and product thereof Mar. 18, 2014
8664025 Substrate dicing technique for separating semiconductor dies with reduced area consumption Mar. 4, 2014
8664089 Semiconductor die singulation method Mar. 4, 2014
8659099 Method for manufacturing a micromechanical structure, and micromechanical structure Feb. 25, 2014
8659167 Sensor packaging method and sensor packages Feb. 25, 2014
8653629 Semiconductor device and wafer Feb. 18, 2014
8647966 Method and apparatus for dicing die attach film on a semiconductor wafer Feb. 11, 2014
8648448 Semiconductor device and method of shielding semiconductor die from inter-device interference Feb. 11, 2014
8642366 Method for fabricating group-III nitride semiconductor laser device Feb. 4, 2014
8642388 Method for manufacturing light emitting diodes including forming circuit structures with a connecting section Feb. 4, 2014
8642447 Semiconductor wafer and manufacturing method of semiconductor device Feb. 4, 2014
8637382 Layer transfer of films utilizing thermal flux regime for energy controlled cleaving Jan. 28, 2014
8633089 Die bonding method utilizing rotary wafer table Jan. 21, 2014
8628983 Light emitting diode and method of fabricating the same Jan. 14, 2014
8623512 Adhesive composition for stealth dicing of semiconductor, adhesive film, and semiconductor device including the adhesive film Jan. 7, 2014
8623682 Method for manufacturing high efficiency light-emitting diodes Jan. 7, 2014
8617928 Dicing/die bonding film Dec. 31, 2013
8609467 Lead frame and method for manufacturing circuit device using the same Dec. 17, 2013
8609512 Method for laser singulation of chip scale packages on glass substrates Dec. 17, 2013
8602832 Light emitting device and method of forming the same Dec. 10, 2013
8597963 Manufacture of light emitting devices with phosphor wavelength conversion Dec. 3, 2013
8597967 Method and system for dicing substrates containing gallium and nitrogen material Dec. 3, 2013
8592853 Semiconductor light emitting element Nov. 26, 2013
8586391 Method of manufacturing light-emitting device Nov. 19, 2013
8580589 Wafer-level process for fabricating photoelectric modules Nov. 12, 2013
8581263 Laser-induced flaw formation in nitride semiconductors Nov. 12, 2013
8575004 Lift-off structure for substrate of a photoelectric device and the method thereof Nov. 5, 2013
8574938 Using isolated epitaxial structures in glue bonding for multiple group-III nitride LEDS on a single substrate Nov. 5, 2013
8569086 Semiconductor device and method of dicing semiconductor devices Oct. 29, 2013
8563339 System for and method for closed loop electrophoretic deposition of phosphor materials on semiconductor devices Oct. 22, 2013
8563343 Method of manufacturing laser diode device Oct. 22, 2013
8558243 Micro device array for transfer to a receiving substrate Oct. 15, 2013
8558216 Nitride semiconductor light emitting device and method for manufacturing the same Oct. 15, 2013
8557619 Light emitting diode display and method of manufacturing the same Oct. 15, 2013
8552436 Light emitting diode structure Oct. 8, 2013
8554355 System and method for cutting substrate into workpieces Oct. 8, 2013
8546163 Group-III nitride semiconductor laser device, and method for fabricating group-III nitride semiconductor laser device Oct. 1, 2013
8541251 Method for manufacturing light-emitting device Sep. 24, 2013
8541290 Optoelectronic substrate and methods of making same Sep. 24, 2013
8541869 Cleaved facet (Ga,Al,In)N edge-emitting laser diodes grown on semipolar bulk gallium nitride substrates Sep. 24, 2013
8536603 Optoelectronic semiconductor chip and method of producing an optoelectronic semiconductor chip Sep. 17, 2013

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