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Class Information
Number: 438/33
Name: Semiconductor device manufacturing: process > Making device or circuit emissive of nonelectrical signal > Substrate dicing
Description: Process having a step of dividing the semiconductor substrate into plural separate bodies.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7608471 |
Method and apparatus for integrating III-V semiconductor devices into silicon processes |
Oct. 27, 2009 |
| 7598154 |
Manufacturing method of semiconductor device |
Oct. 6, 2009 |
| 7585689 |
Method for manufacturing semiconductor laser device and method for inspecting semiconductor laser bar |
Sep. 8, 2009 |
| 7579202 |
Method for fabricating light emitting diode element |
Aug. 25, 2009 |
| 7579205 |
Method of fabricating light emitting device and thus-fabricated light emitting device |
Aug. 25, 2009 |
| 7572657 |
Method for fabrication of semiconductor light-emitting device and the device fabricated by the method |
Aug. 11, 2009 |
| 7571538 |
Vacuum fixing jig for semiconductor device |
Aug. 11, 2009 |
| 7569409 |
Isolation structures for CMOS image sensor chip scale packages |
Aug. 4, 2009 |
| 7556975 |
Method for manufacturing backside-illuminated optical sensor |
Jul. 7, 2009 |
| 7547572 |
Method of protecting semiconductor chips from mechanical and ESD damage during handling |
Jun. 16, 2009 |
| 7544265 |
Method of fabricating a release substrate |
Jun. 9, 2009 |
| 7514280 |
Method for packaging organic light emitting display with frit seal and reinforcing structure |
Apr. 7, 2009 |
| 7510898 |
Method of manufacturing image display device and method of dividing device |
Mar. 31, 2009 |
| 7491580 |
Method of manufacturing electro-optical device |
Feb. 17, 2009 |
| 7485548 |
Die loss estimation using universal in-line metric (UILM) |
Feb. 3, 2009 |
| 7479399 |
System and method for providing automated sample preparation for plan view transmission electron microscopy |
Jan. 20, 2009 |
| 7456437 |
LED package and method for producing the same |
Nov. 25, 2008 |
| 7456035 |
Flip chip light emitting diode devices having thinned or removed substrates |
Nov. 25, 2008 |
| 7451539 |
Method of making a conformal electromagnetic interference shield |
Nov. 18, 2008 |
| 7452739 |
Method of separating semiconductor dies |
Nov. 18, 2008 |
| 7443096 |
Organic electroluminescent device, method of manufacturing the same, and electronic apparatus |
Oct. 28, 2008 |
| 7439162 |
Method of dividing wafer into individual devices after forming a recessed portion of the wafer and making thickness of wafer uniform |
Oct. 21, 2008 |
| 7435607 |
Method of wafer laser processing using a gas permeable protective tape |
Oct. 14, 2008 |
| 7432119 |
Light emitting diode with conducting metal substrate |
Oct. 7, 2008 |
| 7427526 |
Deposited thin films and their use in separation and sacrificial layer applications |
Sep. 23, 2008 |
| 7413965 |
Method of manufacturing a thin-film circuit substrate having penetrating structure, and protecting adhesive tape |
Aug. 19, 2008 |
| 7405095 |
Method for producing color-wheel segments |
Jul. 29, 2008 |
| 7405138 |
Manufacturing method of stack-type semiconductor device |
Jul. 29, 2008 |
| 7399682 |
Wafer processing method |
Jul. 15, 2008 |
| 7399996 |
LED package and method for producing the same |
Jul. 15, 2008 |
| 7396780 |
Method for laser processing of wafer |
Jul. 8, 2008 |
| 7393708 |
Method of manufacturing light emitting device |
Jul. 1, 2008 |
| 7393770 |
Backside method for fabricating semiconductor components with conductive interconnects |
Jul. 1, 2008 |
| 7387951 |
Method of dicing semiconductor wafer into chips, and apparatus using this method |
Jun. 17, 2008 |
| 7384811 |
Method of separating semiconductor wafer, and separating apparatus using the same |
Jun. 10, 2008 |
| 7364930 |
Method for producing micromechanical and micro-optic components consisting of glass-type materials |
Apr. 29, 2008 |
| 7358156 |
Compound semiconductor device and method of manufacturing the same |
Apr. 15, 2008 |
| 7348193 |
Hermetic seals for micro-electromechanical system devices |
Mar. 25, 2008 |
| 7348199 |
Wafer dividing method |
Mar. 25, 2008 |
| 7326590 |
Method for manufacturing ball grid array package |
Feb. 5, 2008 |
| 7316937 |
Method for manufacturing a solid-state image sensing device, such as a CCD |
Jan. 8, 2008 |
| 7303932 |
Support body for semiconductor element, method for manufacturing the same and semiconductor device |
Dec. 4, 2007 |
| 7297566 |
Method for producing a display unit |
Nov. 20, 2007 |
| 7297950 |
Transmission electron microscope specimen and method of manufacturing the same |
Nov. 20, 2007 |
| 7291510 |
Method for manufacturing semiconductor device |
Nov. 6, 2007 |
| 7291509 |
Method for fabricating a plurality of semiconductor chips |
Nov. 6, 2007 |
| 7285811 |
MRAM device for preventing electrical shorts during fabrication |
Oct. 23, 2007 |
| 7285431 |
Method for manufacturing a GaN based LED of a black hole structure |
Oct. 23, 2007 |
| 7285436 |
Method of manufacturing a semiconductor light-emitting device |
Oct. 23, 2007 |
| 7280715 |
Formation of cleaved grooves in a passivation layer formed over a surface of a wafer prior to wafer singulation |
Oct. 9, 2007 |
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