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Class Information
Number: 438/26
Name: Semiconductor device manufacturing: process > Making device or circuit emissive of nonelectrical signal > Packaging (e.g., with mounting, encapsulating, etc.) or treatment of packaged semiconductor
Description: Process including (a) multiple

Sub-classes under this class:

Class Number Class Name Patents
438/27 Having additional optical element (e.g., optical fiber, etc.) 636
438/28 Plural emissive devices 546

Patents under this class:

Patent Number Title Of Patent Date Issued
8106516 Wafer-level chip scale package Jan. 31, 2012
8106502 Integrated circuit packaging system with plated pad and method of manufacture thereof Jan. 31, 2012
8105871 Semiconductor device and manufacturing method of the same Jan. 31, 2012
8105854 LED package Jan. 31, 2012
8101962 Carrying structure of semiconductor Jan. 24, 2012
8101955 PLCC package with a reflector cup surrounded by an encapsulant Jan. 24, 2012
8101460 Semiconductor device and method of shielding semiconductor die from inter-device interference Jan. 24, 2012
8101457 Mounting method, mounted structure, manufacturing method for electronic equipment, electronic equipment, manufacturing method for light-emitting diode display, and light-emitting diode display Jan. 24, 2012
8101434 Method for LED-module assembly Jan. 24, 2012
RE43112 Stackable ball grid array package Jan. 17, 2012
8097898 Light-emitting diode Jan. 17, 2012
8097894 LED with molded reflective sidewall coating Jan. 17, 2012
8097477 Method for forming a light-emitting case and related light-emitting module Jan. 17, 2012
8097476 Light emitting diode and wafer level package method, wafer level bonding method thereof, and circuit structure for wafer level package Jan. 17, 2012
8093804 Organic electroluminescent display device having a novel concept for luminous efficiency Jan. 10, 2012
8093619 Light emitting device Jan. 10, 2012
8093616 Electronic component, manufacturing method of the electronic component, electronic component assembly body, and electronic device Jan. 10, 2012
8093076 Organic light emitting apparatus and method of producing the same Jan. 10, 2012
8090229 Method and device for providing electronic circuitry on a backplate Jan. 3, 2012
8089091 Semiconductor light emitting device with a contact formed on a textured surface Jan. 3, 2012
8089074 Light emitting device having vertically stacked light emitting diodes Jan. 3, 2012
8088647 Bumping free flip chip process Jan. 3, 2012
8088635 Vertical geometry light emitting diode package aggregate and production method of light emitting device using the same Jan. 3, 2012
8084778 Light emitting diode package Dec. 27, 2011
8084777 Light emitting diode source with protective barrier Dec. 27, 2011
8084283 Top contact LED thermal management Dec. 27, 2011
8080827 Top contact LED thermal management Dec. 20, 2011
8080435 Organic electroluminescence element and manufacturing method thereof Dec. 20, 2011
8076182 Method of making a semiconductor chip assembly with a post/base heat spreader and a cavity over the post Dec. 13, 2011
8071987 Housing for an optoelectronic component, optoelectronic component, and method for producing a housing for an optoelectronic component Dec. 6, 2011
8067270 Method of making a semiconductor chip assembly with a post/base heat spreader and a substrate Nov. 29, 2011
8067255 Nitride semiconductor light emitting device, method of manufacturing nitride semiconductor light emitting device, and nitride semiconductor transistor device Nov. 29, 2011
8067253 Electrical device and method of manufacturing electrical devices using film embossing techniques to embed integrated circuits into film Nov. 29, 2011
8062925 Process for preparing a semiconductor light-emitting device for mounting Nov. 22, 2011
8062914 Method for fabricating flat panel display device Nov. 22, 2011
8062912 Method of making a semiconductor chip assembly with a post/base heat spreader and horizontal signal routing Nov. 22, 2011
8058667 Leadframe package for light emitting diode device Nov. 15, 2011
8058662 Light emitting diode and method of fabricating the same Nov. 15, 2011
8053282 Mounting structure of component of lighting device and method thereof Nov. 8, 2011
8048694 Package base structure and associated manufacturing method Nov. 1, 2011
8044427 Light emitting diode submount with high thermal conductivity for high power operation Oct. 25, 2011
8043876 Light emitting diode package and manufacturing method thereof Oct. 25, 2011
8043875 LED packaging method Oct. 25, 2011
8039866 Mount for a semiconductor light emitting device Oct. 18, 2011
8039864 Semiconductor light emitting device and fabrication method for the same Oct. 18, 2011
8035125 Light-emitting apparatus and method of manufacturing the same Oct. 11, 2011
8034645 Method of making a semiconductor chip assembly with a copper/aluminum post/base heat spreader Oct. 11, 2011
8030175 Method of bonding selected integrated circuit to adhesive substrate Oct. 4, 2011
8030132 Manufacturing method of semiconductor device including peeling step Oct. 4, 2011
8026533 Light emitting device and method of manufacturing the same Sep. 27, 2011

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