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Class Information
Number: 438/26
Name: Semiconductor device manufacturing: process > Making device or circuit emissive of nonelectrical signal > Packaging (e.g., with mounting, encapsulating, etc.) or treatment of packaged semiconductor
Description: Process including (a) multiple

Sub-classes under this class:

Class Number Class Name Patents
438/27 Having additional optical element (e.g., optical fiber, etc.) 636
438/28 Plural emissive devices 546

Patents under this class:

Patent Number Title Of Patent Date Issued
8372664 Method for manufacturing display device Feb. 12, 2013
8368098 Light emitting device and manufacturing method thereof Feb. 5, 2013
8368088 Light-emitting device and method manufacturing the same Feb. 5, 2013
8367441 Nitride semiconductor light emitting device, method of manufacturing nitride semiconductor light emitting device, and nitride semiconductor transistor device Feb. 5, 2013
8367438 Method for producing an optoelectronic semiconductor component and optoelectronic semiconductor component Feb. 5, 2013
8367437 Method of manufacturing light-emitting device Feb. 5, 2013
8367436 Organic light emitting diode display and manufacturing method therefor Feb. 5, 2013
8361899 Microelectronic flip chip packages with solder wetting pads and associated methods of manufacturing Jan. 29, 2013
8357552 Light emitting diode chip, and methods for manufacturing and packaging the same Jan. 22, 2013
8354687 Efficient thermal management and packaging for group III nitride based UV devices Jan. 15, 2013
8354283 Method of making a semiconductor chip assembly with a bump/base/ledge heat spreader, dual adhesives and a cavity in the bump Jan. 15, 2013
8351794 Parallel optical transceiver module having a heat dissipation system that dissipates heat and protects components of the module from particulates and handling Jan. 8, 2013
8349627 Method for fabricating a light emitting diode package structure Jan. 8, 2013
8344408 Light emitting diode package having improved wire bonding structure Jan. 1, 2013
8338844 Semiconductor light emitting apparatus having stacked reflective dielectric films Dec. 25, 2012
8338198 Method of peeling thin film device and method of manufacturing semiconductor device using peeled thin film device Dec. 25, 2012
8338197 LED chip-based lighting products and methods of building Dec. 25, 2012
8334152 Method of manufacturing transferable elements incorporating radiation enabled lift off for allowing transfer from host substrate Dec. 18, 2012
8330178 Package structure and package process of light emitting diode Dec. 11, 2012
8329505 Method for deposition of cathodes for polymer optoelectronic devices Dec. 11, 2012
8329487 Fabricating method of light emitting diode chip Dec. 11, 2012
8324001 Light-emitting device, light-emitting system including the same, and fabricating method thereof Dec. 4, 2012
8323997 Method of manufacturing color printed circuit board Dec. 4, 2012
8323996 Semiconductor device Dec. 4, 2012
8319345 Semiconductor packaging substrate and semiconductor device Nov. 27, 2012
8319248 Slim LED package Nov. 27, 2012
8318514 LED package, and mold and method of manufacturing the same Nov. 27, 2012
8318513 Method of encapsulating light-emitting diode devices using bent frames Nov. 27, 2012
8316534 Method for packaging airtight multi-layer array type LED Nov. 27, 2012
8314481 Substrate structure for an image sensor package and method for manufacturing the same Nov. 20, 2012
8314443 Semiconductor light emitting device with a contact formed on a textured surface Nov. 20, 2012
8314430 Optoelectronic component and method for the manufacture of a plurality of optoelectronic components Nov. 20, 2012
8314008 Method of mounting MEMS integrated circuits directly from wafer film frame Nov. 20, 2012
8313962 Method for attaching optical components onto silicon-based integrated circuits Nov. 20, 2012
8309376 Process and materials for making contained layers and devices made with same Nov. 13, 2012
8304785 LED structure, manufacturing method thereof and LED module Nov. 6, 2012
8304292 Method of making a semiconductor chip assembly with a ceramic/metal substrate Nov. 6, 2012
8298868 Method of making a semiconductor chip assembly with a post/base heat spreader and a plated through-hole Oct. 30, 2012
8293572 Injection molding system and method of chip package Oct. 23, 2012
8288792 Semiconductor chip assembly with post/base/post heat spreader Oct. 16, 2012
8288789 LED package Oct. 16, 2012
8288200 Semiconductor devices with conductive clips Oct. 16, 2012
8288186 Substrate for growing a III-V light emitting device Oct. 16, 2012
8288181 Light emitting diode and fabricating method thereof Oct. 16, 2012
8288177 SER testing for an IC chip using hot underfill Oct. 16, 2012
8283689 Surface mounted LED package Oct. 9, 2012
8283676 Manufacturing process for solid state lighting device on a conductive substrate Oct. 9, 2012
8283211 Method of making a semiconductor chip assembly with a bump/base heat spreader and a dual-angle cavity in the bump Oct. 9, 2012
8283189 Method for manufacturing semiconductor devices having gallium nitride epilayers on diamond substrates Oct. 9, 2012
8278126 Method for manufacturing organic electroluminescence device Oct. 2, 2012

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