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Class Information
Number: 438/26
Name: Semiconductor device manufacturing: process > Making device or circuit emissive of nonelectrical signal > Packaging (e.g., with mounting, encapsulating, etc.) or treatment of packaged semiconductor
Description: Process including (a) multiple










Sub-classes under this class:

Class Number Class Name Patents
438/27 Having additional optical element (e.g., optical fiber, etc.) 636
438/28 Plural emissive devices 546


Patents under this class:

Patent Number Title Of Patent Date Issued
8541249 Method for manufacturing light emitting device package and frame for manufacturing light emitting device package Sep. 24, 2013
8536608 LED with remote phosphor layer and reflective submount Sep. 17, 2013
8535960 Method for packaging light emitting diode having fluorescent material directly coated on LED die thereof Sep. 17, 2013
8535959 Method for producing large lighting with power LED Sep. 17, 2013
8530914 Optoelectronic components with adhesion agent Sep. 10, 2013
8530251 Manufacturing method of high-efficiency LED Sep. 10, 2013
8530250 Light emitting device, resin package, resin-molded body, and methods for manufacturing light emitting device, resin package and resin-molded body Sep. 10, 2013
8526186 Electronic assembly including die on substrate with heat spreader having an open window on the die Sep. 3, 2013
8525204 Semiconductor light emitting element and illuminating apparatus using the same Sep. 3, 2013
8524541 Processes for manufacturing an LED package with top and bottom electrodes Sep. 3, 2013
8524514 Method for producing a non-plane element Sep. 3, 2013
8513693 Miniature leadless surface mount lamp with dome and reflector cup Aug. 20, 2013
8513692 Light emitting devices Aug. 20, 2013
8513040 Method for manufacturing display device Aug. 20, 2013
8507360 Transfer method of functional region, LED array, LED printer head, and LED printer Aug. 13, 2013
8507299 Light emitting diode package and manufacturing method thereof Aug. 13, 2013
8502244 Solid state lighting devices with current routing and associated methods of manufacturing Aug. 6, 2013
8502240 Light-emitting device package and method of manufacturing the same Aug. 6, 2013
8502151 Optical proximity sensor package with lead frame Aug. 6, 2013
8497525 Light emitting device and method of manufacturing the same Jul. 30, 2013
8494020 Semiconductor light emitting device, optical pickup unit and information recording/reproduction apparatus Jul. 23, 2013
8492791 Optical semiconductor device Jul. 23, 2013
8492790 LED package with bounding dam surrounding LED chip and thermoset encapsulation enclosing LED chip and method for manufacturing the same Jul. 23, 2013
8492242 Dry flux bonding device and method Jul. 23, 2013
8492185 Large area nonpolar or semipolar gallium and nitrogen containing substrate and resulting devices Jul. 23, 2013
8492181 Embedded wafer level optical package structure and manufacturing method Jul. 23, 2013
8492180 LED and method for manufacturing the same Jul. 23, 2013
8492179 Method of mounting a LED module to a heat sink Jul. 23, 2013
8486733 Package having light-emitting element and fabrication method thereof Jul. 16, 2013
8486732 Method of manufacturing semiconductor light emitting device including step of performing etching process with respect to conductive support member Jul. 16, 2013
8482023 Leadframe having a heat sink supporting part, fabricating method of a light emitting diode package using the same, and light emitting diode package fabricated by the method Jul. 9, 2013
8481349 Method for manufacturing semiconductor light emitting device Jul. 9, 2013
8481343 Manufacturing method of molded image sensor packaging structure with predetermined focal length and the structure using the same Jul. 9, 2013
8476668 High voltage low current surface emitting LED Jul. 2, 2013
8476667 Optoelectronic component Jul. 2, 2013
8476657 Light-emitting device Jul. 2, 2013
8476644 Optoelectronic component and method for the manufacture of a plurality of optoelectronic components Jul. 2, 2013
8476114 Housing for an optoelectronic component, optoelectronic component, and method for producing a housing for an optoelectronic component Jul. 2, 2013
8476090 Method forming a semiconductor light emitting device with perforations formed within Jul. 2, 2013
8476089 Method for manufacturing light emitting diode package Jul. 2, 2013
8471289 Semiconductor laser device, optical pickup device and semiconductor device Jun. 25, 2013
8471287 LED package and method for making the same Jun. 25, 2013
8471241 Light emitting device, light emitting device package, and lighting system Jun. 25, 2013
8470619 Selective decomposition of nitride semiconductors to enhance LED light extraction Jun. 25, 2013
8466558 Semiconductor package and semiconductor system including the same Jun. 18, 2013
8466476 OLEDs and other electronic devices using desiccants Jun. 18, 2013
8465992 Method of manufacturing flexible display device Jun. 18, 2013
8461674 Thermal plate with planar thermal zones for semiconductor processing Jun. 11, 2013
8460973 Semiconductor light emitting apparatus, method for manufacturing the same, and liquid crystal display apparatus using the same Jun. 11, 2013
8460951 Chip-type LED and method of manufacturing the same Jun. 11, 2013











 
 
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