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Class Information
Number: 438/26
Name: Semiconductor device manufacturing: process > Making device or circuit emissive of nonelectrical signal > Packaging (e.g., with mounting, encapsulating, etc.) or treatment of packaged semiconductor
Description: Process including (a) multiple










Sub-classes under this class:

Class Number Class Name Patents
438/27 Having additional optical element (e.g., optical fiber, etc.) 636
438/28 Plural emissive devices 546


Patents under this class:
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Patent Number Title Of Patent Date Issued
6617675 Semiconductor device and semiconductor device assembly Sep. 9, 2003
6613597 Optical chip packaging via through hole Sep. 2, 2003
6613598 Method for making a photovoltaic cell containing a dye Sep. 2, 2003
6611064 Semiconductor device and method for manufacturing the same Aug. 26, 2003
6599769 Process for mounting device and optical transmission apparatus Jul. 29, 2003
6593160 Diffusion barrier for increased mirror reflectivity in reflective solderable contacts on high power led chip Jul. 15, 2003
6576488 Using electrophoresis to produce a conformally coated phosphor-converted light emitting semiconductor Jun. 10, 2003
6569698 Focusing cup on a folded frame for surface mount optoelectric semiconductor package May. 27, 2003
6562643 Packaging types of light-emitting diode May. 13, 2003
6558970 Light irradiating device, manufacturing method thereof, and lighting apparatus using the light irradiating device May. 6, 2003
6548317 Photoelectric conversion element and method for manufacturing the same Apr. 15, 2003
6531328 Packaging of light-emitting diode Mar. 11, 2003
6528407 Process for producing electrical-connections on a semiconductor package, and semiconductor package Mar. 4, 2003
6518600 Dual encapsulation for an LED Feb. 11, 2003
6514787 Opto-electric mounting apparatus Feb. 4, 2003
6485991 System and method for output track unit detection and safe storage tube removal Nov. 26, 2002
6482663 Silicon substrate having a recess for receiving an element, and a method of producing such a recess Nov. 19, 2002
6482664 Method for manufacturing white light-emitting diodes Nov. 19, 2002
6468832 Method to encapsulate bumped integrated circuit to create chip scale package Oct. 22, 2002
6458683 Method for forming aluminum bumps by CVD and wet etch Oct. 1, 2002
6417018 Asymmetrical molding method for multiple part matrixes Jul. 9, 2002
6417034 Manufacturing method for organic EL device Jul. 9, 2002
6417524 Light emitting semiconductor device Jul. 9, 2002
6410904 Multi-beam emitting device Jun. 25, 2002
6403387 Method and apparatus for transfer molding encapsulation of a semiconductor die with attached heat sink Jun. 11, 2002
6379991 Encapsulation methods for semiconductive die packages Apr. 30, 2002
6376268 Optoelectronic assembly and method of making the same Apr. 23, 2002
6355505 Heat sink and method of manufacturing heat sink Mar. 12, 2002
6351027 Chip-mounted enclosure Feb. 26, 2002
6348358 Emitter array with individually addressable laser diodes Feb. 19, 2002
6338973 Semiconductor device and method of fabrication Jan. 15, 2002
6337265 Method for integration of integrated circuit devices Jan. 8, 2002
6335212 Method of fabricating a semiconductor light-emitting element Jan. 1, 2002
6331673 Solar cell module having a surface side covering material with a specific nonwoven glass fiber member Dec. 18, 2001
6331447 High density flip chip BGA Dec. 18, 2001
6319740 Multilayer protective coating for integrated circuits and multichip modules and method of applying same Nov. 20, 2001
6319743 Method of making thin film piezoresistive sensor Nov. 20, 2001
6309902 Method for coating semiconductor element with resin, coating resin, and liquid crystal display device Oct. 30, 2001
6287881 Semiconductor device with low parasitic capacitance Sep. 11, 2001
6271049 Method for producing an optoelectronic component Aug. 7, 2001
6258699 Light emitting diode with a permanent subtrate of transparent glass or quartz and the method for manufacturing the same Jul. 10, 2001
6255129 Light-emitting diode device and method of manufacturing the same Jul. 3, 2001
6251698 Method for making a machined silicon micro-sensor Jun. 26, 2001
6245589 Fabrication of cooling device of a planar light source Jun. 12, 2001
6245595 Techniques for wafer level molding of underfill encapsulant Jun. 12, 2001
6228672 Stable surface passivation process for compound semiconductors May. 8, 2001
6225139 Manufacturing method of an led of a type of round concave cup with a flat bottom May. 1, 2001
6218202 Semiconductor device testing and burn-in methodology Apr. 17, 2001
6218205 Post-process depositing shielding for microelectromechanical systems Apr. 17, 2001
6214644 Flip-chip micromachine package fabrication method Apr. 10, 2001

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