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Class Information
Number: 438/26
Name: Semiconductor device manufacturing: process > Making device or circuit emissive of nonelectrical signal > Packaging (e.g., with mounting, encapsulating, etc.) or treatment of packaged semiconductor
Description: Process including (a) multiple










Sub-classes under this class:

Class Number Class Name Patents
438/27 Having additional optical element (e.g., optical fiber, etc.) 636
438/28 Plural emissive devices 546


Patents under this class:
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Patent Number Title Of Patent Date Issued
6927424 Light emitting diode and method for producing it Aug. 9, 2005
6927425 Luminescent diode chip that is flip-chip mounted on a carrier, and method for production thereof Aug. 9, 2005
6921674 Method for manufacturing a light emitting diode device Jul. 26, 2005
6921675 Device transfer method and panel Jul. 26, 2005
6919216 Method for manufacturing semiconductor laser apparatus Jul. 19, 2005
6919218 Manufacturing method for sealing a semiconductor device Jul. 19, 2005
6911667 Encapsulation for organic electronic devices Jun. 28, 2005
6902656 Fabrication of microstructures with vacuum-sealed cavity Jun. 7, 2005
6890782 Manufacturing method of electroluminescence display apparatus May. 10, 2005
6890834 Electronic device and method for manufacturing the same May. 10, 2005
6888172 Apparatus and method for encapsulating an OLED formed on a flexible substrate May. 3, 2005
6878563 Radiation-emitting semiconductor element and method for producing the same Apr. 12, 2005
6872584 Solid state image sensor and method for fabricating the same Mar. 29, 2005
6872585 LED device and manufacturing method thereof Mar. 29, 2005
6873034 Solid-state imaging device, method for producing same, and mask Mar. 29, 2005
6869811 Methods for transfer molding encapsulation of a semiconductor die with attached heat sink Mar. 22, 2005
6869813 Chip-type LED and process of manufacturing the same Mar. 22, 2005
6864944 Electro-optic device Mar. 8, 2005
6861272 Optical device free from stress due to difference in thermal expansion coefficient between parts and process for fabrication thereof Mar. 1, 2005
6861750 Ball grid array package with multiple interposers Mar. 1, 2005
6858456 Method for manufacturing a light emitting device Feb. 22, 2005
6852564 Semiconductor device and method of fabricating the same Feb. 8, 2005
6846687 Process of packaging organic electroluminescent panel Jan. 25, 2005
6844214 Microelectromechanical system based sensors, sensor arrays, sensing systems, sensing methods and methods of fabrication Jan. 18, 2005
6841801 Mask for correcting optical proximity effect Jan. 11, 2005
6838317 Techniques for joining an opto-electronic module to a semiconductor package Jan. 4, 2005
6830946 Device transfer method and panel Dec. 14, 2004
6830960 Stress-relieving heatsink structure and method of attachment to an electronic package Dec. 14, 2004
6831302 Light emitting devices with improved extraction efficiency Dec. 14, 2004
6831306 Extended length light emitting diode Dec. 14, 2004
6828674 Hermetically sealed microstructure package Dec. 7, 2004
6825055 Method for assembling integral type electronic component and integral type electronic component Nov. 30, 2004
6821822 Method of manufacturing semiconductor device, molding device for semiconductor device, and semiconductor device Nov. 23, 2004
6818963 Surface mount package for linear array sensors Nov. 16, 2004
6819813 Optical land grid array interposer Nov. 16, 2004
6818479 Highly moisture-sensitive electronic device element and method for fabrication Nov. 16, 2004
6818559 Method of fabrication to sharpen corners of Y-branches in integrated optical components and other micro-devices Nov. 16, 2004
6815239 Photolithographic methods for making liquid-crystal-on-silicon displays with alignment posts and optical interference layers Nov. 9, 2004
6815262 Apparatus and method for attaching an integrated circuit sensor to a substrate Nov. 9, 2004
6812057 Method of producing an optical module Nov. 2, 2004
6812060 Multilayer flexible wiring boards and processes for manufacturing multilayer flexible wiring boards Nov. 2, 2004
6803245 Procedure for encapsulation of electronic devices Oct. 12, 2004
6800503 MEMS encapsulated structure and method of making same Oct. 5, 2004
6800946 Selective underfill for flip chips and flip-chip assemblies Oct. 5, 2004
6797530 Semiconductor device-manufacturing method for manufacturing semiconductor devices with improved heat radiating efficiency and similar in size to semiconductor elements Sep. 28, 2004
6797603 Semiconductor device and method of production of same Sep. 28, 2004
6790690 Method of manufacturing a display device Sep. 14, 2004
6790708 Encapsulation process using a partial slot cover and a package formed by the process Sep. 14, 2004
6790758 Method for fabricating conductive bumps and substrate with metal bumps for flip chip packaging Sep. 14, 2004
6784027 Light-emitting semiconductor component Aug. 31, 2004

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