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Class Information
Number: 438/26
Name: Semiconductor device manufacturing: process > Making device or circuit emissive of nonelectrical signal > Packaging (e.g., with mounting, encapsulating, etc.) or treatment of packaged semiconductor
Description: Process including (a) multiple










Sub-classes under this class:

Class Number Class Name Patents
438/27 Having additional optical element (e.g., optical fiber, etc.) 636
438/28 Plural emissive devices 546


Patents under this class:
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Patent Number Title Of Patent Date Issued
7143381 Resonance reduction arrangements Nov. 28, 2006
7142939 Component mounter, service supplier, and service supplying method Nov. 28, 2006
7141442 Method for manufacturing a light emitting device Nov. 28, 2006
7126216 Two part mold for wafer scale caps Oct. 24, 2006
7125734 Increased light extraction from a nitride LED Oct. 24, 2006
7122390 Methods of fabrication for flip-chip image sensor packages Oct. 17, 2006
7115428 Method for fabricating light-emitting devices utilizing a photo-curable epoxy Oct. 3, 2006
7113661 Semiconductor device and method for manufacturing the same Sep. 26, 2006
7109057 Sealing apparatus for semiconductor wafer and method of manufacturing semiconductor device by using sealing apparatus Sep. 19, 2006
7109055 Methods and apparatus having wafer level chip scale package for sensing elements Sep. 19, 2006
7098097 Mass-production packaging means and mass-production packaging method Aug. 29, 2006
7094618 Methods for marking a packaged semiconductor die including applying tape and subsequently marking the tape Aug. 22, 2006
7087445 Light emitting device, display apparatus with an array of light emitting devices, and display apparatus method of manufacture Aug. 8, 2006
7083993 Methods of making multi-layer light emitting devices Aug. 1, 2006
7084511 Semiconductor device having resin-sealed area on circuit board thereof Aug. 1, 2006
7078254 LED package die having a small footprint Jul. 18, 2006
7071014 Methods for preserving strained semiconductor substrate layers during CMOS processing Jul. 4, 2006
7071034 Method of making semiconductor device Jul. 4, 2006
7067338 Method of manufacturing a display device including forming electric connections on a substrate, conductor patterns on a second substrate and coupling the connections Jun. 27, 2006
7063996 Method for manufacturing a light emitting diode device Jun. 20, 2006
7061025 Optoelectronic device packaging assemblies and methods of making the same Jun. 13, 2006
7057212 Flip chip nitride semiconductor light emitting diode Jun. 6, 2006
7049746 Light-emitting unit and illuminator utilizing the same May. 23, 2006
7033849 Method of adjusting or locally modifying a magnetization in a layer of a magnetoresistive layer system, heat stamp for heating the magnetoresistive layer system, and use of same Apr. 25, 2006
7033850 Roll-to-sheet manufacture of OLED materials Apr. 25, 2006
7026176 Mold making method for wafer scale caps Apr. 11, 2006
7026180 Screen-printing metal mask plate and method of resin-sealing vibrating part Apr. 11, 2006
7022550 Methods for forming aluminum-containing p-contacts for group III-nitride light emitting diodes Apr. 4, 2006
7018870 Laser diode and heatsink quick connect/disconnect assembly Mar. 28, 2006
7015054 Semiconductor light emitting device and method Mar. 21, 2006
7015558 Optical device free from stress due to difference in thermal expansion coefficient between parts and process for fabrication thereof Mar. 21, 2006
7005311 Two-pole SMT miniature housing for semiconductor components and method for the manufacture thereof Feb. 28, 2006
6998279 Method of mounting light emitting element Feb. 14, 2006
6998280 Wafer packaging process of packaging light emitting diode Feb. 14, 2006
6995029 Fabricating surface mountable semiconductor components with leadframe strips Feb. 7, 2006
6991952 Method of manufacturing semiconductor device Jan. 31, 2006
6992336 Front substrate of plasma display panel and fabrication method thereof Jan. 31, 2006
6989292 Chips with wafer scale caps formed by molding Jan. 24, 2006
6987028 Method of fabricating a microelectronic die Jan. 17, 2006
6974711 Method of manufacturing a display panel Dec. 13, 2005
6970491 Planar and wafer level packaging of semiconductor lasers and photo detectors for transmitter optical sub-assemblies Nov. 29, 2005
6955934 Wafer-level packaging of optical receivers Oct. 18, 2005
6949389 Encapsulation for organic light emitting diodes devices Sep. 27, 2005
6946308 Method of manufacturing III-V group compound semiconductor Sep. 20, 2005
6946309 III-Phosphide and III-Arsenide flip chip light-emitting devices Sep. 20, 2005
6946405 Polyparaxylylene film, production method therefor and semiconductor device Sep. 20, 2005
6940102 Light-emitting diode and a method for its manufacture Sep. 6, 2005
6933537 Sealing for OLED devices Aug. 23, 2005
6933538 Plasma encapsulation for electronic and microelectronic components such as organic light emitting diodes Aug. 23, 2005
6927086 Method and apparatus for laser diode assembly and array Aug. 9, 2005

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