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Class Information
Number: 438/26
Name: Semiconductor device manufacturing: process > Making device or circuit emissive of nonelectrical signal > Packaging (e.g., with mounting, encapsulating, etc.) or treatment of packaged semiconductor
Description: Process including (a) multiple










Sub-classes under this class:

Class Number Class Name Patents
438/27 Having additional optical element (e.g., optical fiber, etc.) 636
438/28 Plural emissive devices 546


Patents under this class:
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Patent Number Title Of Patent Date Issued
7714333 Solid-state element and solid-state element device May. 11, 2010
7709282 Method for producing a light emitting device May. 4, 2010
7696527 Light source, manufacturing method of light source, lighting apparatus, and display apparatus Apr. 13, 2010
7696003 Microelectronic component assemblies with recessed wire bonds and methods of making same Apr. 13, 2010
7696001 Method for mounting semiconductor chips on a substrate and corresponding assembly Apr. 13, 2010
7695990 Fabricating surface mountable semiconductor components with leadframe strips Apr. 13, 2010
7691652 Calorimetric flow meter Apr. 6, 2010
7687292 Light emitting diode package with metal reflective layer and method of manufacturing the same Mar. 30, 2010
7682853 Transparent member, optical device using transparent member and method of manufacturing optical device Mar. 23, 2010
7682852 Method of manufacturing semiconductor laser device including light shield plate Mar. 23, 2010
7682851 Organic light emitting display and manufacturing method thereof Mar. 23, 2010
7682850 White LED for backlight with phosphor plates Mar. 23, 2010
7678667 Method of bonding MEMS integrated circuits Mar. 16, 2010
7678592 LED housing and fabrication method thereof Mar. 16, 2010
7675145 Apparatus, system and method for use in mounting electronic elements Mar. 9, 2010
7674640 Stacked die package system Mar. 9, 2010
7669320 Coreless cavity substrates for chip packaging and their fabrication Mar. 2, 2010
7663150 Optoelectronic chip Feb. 16, 2010
7662661 Method of manufacturing a substrate structure for increasing cutting precision and strength thereof Feb. 16, 2010
7655956 Semiconductor device and method for manufacturing the same Feb. 2, 2010
7655553 Microstructure sealing tool and methods of using the same Feb. 2, 2010
7655486 Method of making light emitting device with multilayer silicon-containing encapsulant Feb. 2, 2010
7651878 Wafer-level chip-scale package of image sensor and method of manufacturing the same Jan. 26, 2010
7642137 Manufacturing method of chip package Jan. 5, 2010
7639719 Thermal shunt for active devices on silicon-on-insulator wafers Dec. 29, 2009
7638864 Chip package, method of making same and digital camera module using the package Dec. 29, 2009
7638813 Methods of fabrication for flip-chip image sensor packages Dec. 29, 2009
7638812 Soldering method for semiconductor optical device, and semiconductor optical device Dec. 29, 2009
7632707 Electronic device package and method of manufacturing the same Dec. 15, 2009
7629185 Semiconductor laser device manufacturing method and semiconductor laser device Dec. 8, 2009
7625780 Fluidic heterogeneous microsystems assembly and packaging Dec. 1, 2009
7625778 Method of manufacturing a substrate-free flip chip light emitting diode Dec. 1, 2009
7622314 Carbon nanotube structures and methods of manufacture and use Nov. 24, 2009
7622311 Inspection of underfill in integrated circuit package Nov. 24, 2009
7619312 Method and apparatus for precisely aligning integrated circuit chips Nov. 17, 2009
7615398 Pyramidal photonic crystal light emitting device Nov. 10, 2009
7612383 Reflector packages and semiconductor light emitting devices including the same Nov. 3, 2009
7598101 LED of side view type and the method for manufacturing the same Oct. 6, 2009
7595515 Method of making light emitting device having a molded encapsulant Sep. 29, 2009
7592631 LED package frame and LED package having the same Sep. 22, 2009
7588952 Method of fabricating vertical structure LEDs Sep. 15, 2009
7588951 Method of packaging a semiconductor device and a prefabricated connector Sep. 15, 2009
7583871 Substrates for optical die structures Sep. 1, 2009
7583862 Packaged microelectronic imagers and methods of packaging microelectronic imagers Sep. 1, 2009
7582496 LED package using Si substrate and fabricating method thereof Sep. 1, 2009
7579628 Backlight device for liquid crystal display including a plurality of light emitting diodes within their own concaves aligned in a straight line within a larger concave Aug. 25, 2009
7579198 Method for making backlight module Aug. 25, 2009
7572654 Method for making light emitting diode Aug. 11, 2009
7569420 Flip-chip packaging method for light emitting diode with eutectic layer not overlapping insulating layer Aug. 4, 2009
7569406 Method for coating semiconductor device using droplet deposition Aug. 4, 2009

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