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Class Information
Number: 438/26
Name: Semiconductor device manufacturing: process > Making device or circuit emissive of nonelectrical signal > Packaging (e.g., with mounting, encapsulating, etc.) or treatment of packaged semiconductor
Description: Process including (a) multiple
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7625778 |
Method of manufacturing a substrate-free flip chip light emitting diode |
Dec. 1, 2009 |
| 7625780 |
Fluidic heterogeneous microsystems assembly and packaging |
Dec. 1, 2009 |
| 7622311 |
Inspection of underfill in integrated circuit package |
Nov. 24, 2009 |
| 7622314 |
Carbon nanotube structures and methods of manufacture and use |
Nov. 24, 2009 |
| 7619312 |
Method and apparatus for precisely aligning integrated circuit chips |
Nov. 17, 2009 |
| 7615398 |
Pyramidal photonic crystal light emitting device |
Nov. 10, 2009 |
| 7612383 |
Reflector packages and semiconductor light emitting devices including the same |
Nov. 3, 2009 |
| 7598101 |
LED of side view type and the method for manufacturing the same |
Oct. 6, 2009 |
| 7595515 |
Method of making light emitting device having a molded encapsulant |
Sep. 29, 2009 |
| 7592631 |
LED package frame and LED package having the same |
Sep. 22, 2009 |
| 7588951 |
Method of packaging a semiconductor device and a prefabricated connector |
Sep. 15, 2009 |
| 7588952 |
Method of fabricating vertical structure LEDs |
Sep. 15, 2009 |
| 7583871 |
Substrates for optical die structures |
Sep. 1, 2009 |
| 7583862 |
Packaged microelectronic imagers and methods of packaging microelectronic imagers |
Sep. 1, 2009 |
| 7582496 |
LED package using Si substrate and fabricating method thereof |
Sep. 1, 2009 |
| 7579198 |
Method for making backlight module |
Aug. 25, 2009 |
| 7579628 |
Backlight device for liquid crystal display including a plurality of light emitting diodes within their own concaves aligned in a straight line within a larger concave |
Aug. 25, 2009 |
| 7572654 |
Method for making light emitting diode |
Aug. 11, 2009 |
| 7569420 |
Flip-chip packaging method for light emitting diode with eutectic layer not overlapping insulating layer |
Aug. 4, 2009 |
| 7569406 |
Method for coating semiconductor device using droplet deposition |
Aug. 4, 2009 |
| 7563652 |
Method for encapsulating sensor chips |
Jul. 21, 2009 |
| 7563644 |
Optical device and method for fabricating the same |
Jul. 21, 2009 |
| 7560803 |
Method for fabricating semiconductor device and apparatus for fabricating the same |
Jul. 14, 2009 |
| 7560303 |
Method and apparatus for linear die transfer |
Jul. 14, 2009 |
| 7556975 |
Method for manufacturing backside-illuminated optical sensor |
Jul. 7, 2009 |
| 7547564 |
Method of manufacturing device having flexible substrate and device having flexible substrate manufactured using the same |
Jun. 16, 2009 |
| 7547566 |
Organic electroluminescent device and method of manufacturing the same |
Jun. 16, 2009 |
| 7534635 |
Getter precursors for hermetically sealed packaging |
May. 19, 2009 |
| 7536236 |
Component mounting apparatus, service providing device and servicing method |
May. 19, 2009 |
| 7528000 |
Method of fabricating optical device caps |
May. 5, 2009 |
| 7528416 |
Vertical structure LED and fabricating method thereof |
May. 5, 2009 |
| 7521271 |
Method of manufacturing a transponder |
Apr. 21, 2009 |
| 7521272 |
Display device producing method and display device producing device |
Apr. 21, 2009 |
| 7521273 |
Light emitting device methods |
Apr. 21, 2009 |
| 7521790 |
Semiconductor device module and manufacturing method of semiconductor device module |
Apr. 21, 2009 |
| 7518159 |
Packaging technique for the fabrication of polarized light emitting diodes |
Apr. 14, 2009 |
| 7510889 |
Light emitting chip package and manufacturing method thereof |
Mar. 31, 2009 |
| 7510902 |
Image sensor chip package and method of fabricating the same |
Mar. 31, 2009 |
| 7510888 |
LED arrangement |
Mar. 31, 2009 |
| 7507592 |
Bonding pad structure for a display device and fabrication method thereof |
Mar. 24, 2009 |
| 7504271 |
Integrated circuit package substrate having a thin film capacitor structure |
Mar. 17, 2009 |
| 7498678 |
Electronic assemblies and systems with filled no-flow underfill |
Mar. 3, 2009 |
| 7498185 |
Light emitting diode and method making the same |
Mar. 3, 2009 |
| 7485489 |
Electronics circuit manufacture |
Feb. 3, 2009 |
| 7485480 |
Method of manufacturing high power light-emitting device package and structure thereof |
Feb. 3, 2009 |
| 7485479 |
Nitride-based light emitting device and method of manufacturing the same |
Feb. 3, 2009 |
| 7485478 |
Light emitting device and method of manufacturing the same |
Feb. 3, 2009 |
| 7479397 |
Optoelectronics processing module and method for manufacturing thereof |
Jan. 20, 2009 |
| 7479398 |
Methods and apparatus for packaging integrated circuit devices |
Jan. 20, 2009 |
| 7479662 |
Coated LED with improved efficiency |
Jan. 20, 2009 |
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