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Class Information
Number: 438/25
Name: Semiconductor device manufacturing: process > Making device or circuit emissive of nonelectrical signal > Having diverse electrical device > Including device responsive to nonelectrical signal > Packaging (e.g., with mounting, encapsulating, etc.) or treatment of packaged semiconductor
Description: Process including (a) multiple
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7592636 |
Radiation-emitting semiconductor component and method for the production thereof |
Sep. 22, 2009 |
| 7588951 |
Method of packaging a semiconductor device and a prefabricated connector |
Sep. 15, 2009 |
| 7579198 |
Method for making backlight module |
Aug. 25, 2009 |
| 7575944 |
Method of manufacturing nitride-based semiconductor light emitting diode |
Aug. 18, 2009 |
| 7572654 |
Method for making light emitting diode |
Aug. 11, 2009 |
| 7573074 |
LED electrode |
Aug. 11, 2009 |
| 7569420 |
Flip-chip packaging method for light emitting diode with eutectic layer not overlapping insulating layer |
Aug. 4, 2009 |
| 7566588 |
Semiconductor device with a resin-sealed optical semiconductor element |
Jul. 28, 2009 |
| 7547564 |
Method of manufacturing device having flexible substrate and device having flexible substrate manufactured using the same |
Jun. 16, 2009 |
| 7538340 |
Low side emitting light source and method of making the same |
May. 26, 2009 |
| 7534635 |
Getter precursors for hermetically sealed packaging |
May. 19, 2009 |
| 7527990 |
Solid state imaging device and producing method thereof |
May. 5, 2009 |
| 7521271 |
Method of manufacturing a transponder |
Apr. 21, 2009 |
| 7518159 |
Packaging technique for the fabrication of polarized light emitting diodes |
Apr. 14, 2009 |
| 7510886 |
Method of manufacturing semiconductor photodetector |
Mar. 31, 2009 |
| 7507592 |
Bonding pad structure for a display device and fabrication method thereof |
Mar. 24, 2009 |
| 7504271 |
Integrated circuit package substrate having a thin film capacitor structure |
Mar. 17, 2009 |
| 7504669 |
Light emitting devices |
Mar. 17, 2009 |
| 7498678 |
Electronic assemblies and systems with filled no-flow underfill |
Mar. 3, 2009 |
| 7495322 |
Light-emitting device |
Feb. 24, 2009 |
| 7485479 |
Nitride-based light emitting device and method of manufacturing the same |
Feb. 3, 2009 |
| 7485489 |
Electronics circuit manufacture |
Feb. 3, 2009 |
| 7482666 |
Apparatus and method for optical isolation |
Jan. 27, 2009 |
| 7479397 |
Optoelectronics processing module and method for manufacturing thereof |
Jan. 20, 2009 |
| 7479659 |
Process for manufacturing encapsulated optical sensors, and an encapsulated optical sensor manufactured using this process |
Jan. 20, 2009 |
| 7476606 |
Eutectic bonding of ultrathin semiconductors |
Jan. 13, 2009 |
| 7468288 |
Die-level opto-electronic device and method of making same |
Dec. 23, 2008 |
| 7462502 |
Color control by alteration of wavelength converting element |
Dec. 9, 2008 |
| 7456035 |
Flip chip light emitting diode devices having thinned or removed substrates |
Nov. 25, 2008 |
| 7449362 |
One-component hot-setting epoxy resin composition and semiconductor mounting underfill material |
Nov. 11, 2008 |
| 7445959 |
Sensor module and method of manufacturing same |
Nov. 4, 2008 |
| 7442565 |
Method for manufacturing vertical structure light emitting diode |
Oct. 28, 2008 |
| 7422929 |
Wafer-level packaging of optoelectronic devices |
Sep. 9, 2008 |
| 7419839 |
Bonding an optical element to a light emitting device |
Sep. 2, 2008 |
| 7416910 |
Pyramid socket suspension |
Aug. 26, 2008 |
| 7405414 |
Method and apparatus for patterning a workpiece |
Jul. 29, 2008 |
| 7402446 |
Method of manufacturing an electroluminescence device |
Jul. 22, 2008 |
| 7394109 |
LED lighting device |
Jul. 1, 2008 |
| 7391119 |
Temperature sustaining flip chip assembly process |
Jun. 24, 2008 |
| 7384805 |
Transfer mold semiconductor packaging processes |
Jun. 10, 2008 |
| 7371606 |
Manufacturing method of a semiconductor device |
May. 13, 2008 |
| 7365407 |
Light emitting diode package with direct leadframe heat dissipation |
Apr. 29, 2008 |
| 7354782 |
Group III nitride based flip-chip integrated circuit and method for fabricating |
Apr. 8, 2008 |
| 7348193 |
Hermetic seals for micro-electromechanical system devices |
Mar. 25, 2008 |
| 7338820 |
Laser patterning of encapsulated organic light emitting diodes |
Mar. 4, 2008 |
| 7335522 |
Package structure for light emitting diode and method thereof |
Feb. 26, 2008 |
| 7319044 |
Nitride semiconductor light emitting device and method for manufacturing the same |
Jan. 15, 2008 |
| 7312479 |
Side-emission type semiconductor light-emitting device and manufacturing method thereof |
Dec. 25, 2007 |
| RE39957 |
Method of making semiconductor package with heat spreader |
Dec. 25, 2007 |
| 7306960 |
High radiance LED chip and a method for producing same |
Dec. 11, 2007 |
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