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Class Information
Number: 438/15
Name: Semiconductor device manufacturing: process > With measuring or testing > Packaging (e.g., with mounting, encapsulating, etc.) or treatment of packaged semiconductor
Description: Process provided including (a) multiple


Patents under this class:
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Patent Number Title Of Patent Date Issued
7619312 Method and apparatus for precisely aligning integrated circuit chips Nov. 17, 2009
7615422 Evaluation method of semiconductor device, manufacturing method of the semiconductor device, design management system of device comprising the semiconductor device, dose amount control program Nov. 10, 2009
7608469 Method of fabricating a chip Oct. 27, 2009
7601559 Apparatus and method for identifying proper orientation and electrical conductivity between a semiconductor device and a socket or contactor Oct. 13, 2009
7598100 Manufacturing method of semiconductor integrated circuit device Oct. 6, 2009
7582494 Device structures for reducing device mismatch due to shallow trench isolation induced oxides stresses Sep. 1, 2009
7582542 Die attaching method Sep. 1, 2009
7566575 Mounting circuit and method for producing semiconductor-chip-mounting circuit Jul. 28, 2009
7557597 Stacked chip security Jul. 7, 2009
7556973 Manufacturing method for semiconductor device Jul. 7, 2009
7553679 Method of determining plasma ion density, wafer voltage, etch rate and wafer current from applied bias voltage and current Jun. 30, 2009
7553680 Methods to provide and expose a diagnostic connector on overmolded electronic packages Jun. 30, 2009
7553681 Carbon nanotube-based stress sensor Jun. 30, 2009
7549560 Wafer dividing method Jun. 23, 2009
7524684 Semiconductor device with electrode pad having probe mark Apr. 28, 2009
7514274 Enhanced uniqueness for pattern recognition Apr. 7, 2009
7514276 Aligning stacked chips using resistance assistance Apr. 7, 2009
7507633 Method and structure for improved alignment in MRAM integration Mar. 24, 2009
7498181 Method of preparing an integrated circuit die for imaging Mar. 3, 2009
7498192 Methods of providing a family of related integrated circuits of different sizes Mar. 3, 2009
7498678 Electronic assemblies and systems with filled no-flow underfill Mar. 3, 2009
7494828 Substrate holder and device manufacturing method Feb. 24, 2009
7491556 Efficient method of forming and assembling a microelectronic chip including solder bumps Feb. 17, 2009
7485489 Electronics circuit manufacture Feb. 3, 2009
7482180 Method for determining the impact of layer thicknesses on laminate warpage Jan. 27, 2009
7479701 Dummy metal fill shapes for improved reliability of hybrid oxide/low-k dielectrics Jan. 20, 2009
7478022 Component emulation device and method of design Jan. 13, 2009
7476555 Method of chip manufacturing Jan. 13, 2009
7476553 Transfer base substrate and method of semiconductor device Jan. 13, 2009
7468309 Semiconductor wafer treatment method Dec. 23, 2008
7468525 Test structures for development of metal-insulator-metal (MIM) devices Dec. 23, 2008
7452733 Method of increasing reliability of packaged semiconductor integrated circuit dice Nov. 18, 2008
7452732 Comparing identifying indicia formed using laser marking techniques to an identifying indicia model Nov. 18, 2008
7449362 One-component hot-setting epoxy resin composition and semiconductor mounting underfill material Nov. 11, 2008
7445959 Sensor module and method of manufacturing same Nov. 4, 2008
7442559 Method for producing an optical or electronic module provided with a plastic package Oct. 28, 2008
7442576 Placement of absorbing material in a semiconductor device Oct. 28, 2008
7444012 Method and apparatus for performing failure analysis with fluorescence inks Oct. 28, 2008
7439090 Method for manufacturing a lower substrate of a liquid crystal display device Oct. 21, 2008
7439168 Apparatus and method of forming silicide in a localized manner Oct. 21, 2008
7433229 Flash memory device with shunt Oct. 7, 2008
7429497 Hybrid package with non-insertable and insertable conductive features, complementary receptacle, and methods of fabrication therefor Sep. 30, 2008
7427517 Stacking apparatus and method for stacking integrated circuit elements Sep. 23, 2008
7427520 Method and apparatus for measuring thickness of thin film formed on substrate Sep. 23, 2008
7422914 Fabrication method of semiconductor integrated circuit device Sep. 9, 2008
7423286 Laser transfer article and method of making Sep. 9, 2008
7416910 Pyramid socket suspension Aug. 26, 2008
7414323 Tab tape and method of manufacturing the same Aug. 19, 2008
7407822 Method for inspecting insulating film for film carrier tape for mounting electronic components thereon, inspection apparatus for inspecting the insulating film, punching apparatus for punching Aug. 5, 2008
7405103 Process for fabricating chip embedded package structure Jul. 29, 2008

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