| |
 |
|
Class Information
Number: 438/15
Name: Semiconductor device manufacturing: process > With measuring or testing > Packaging (e.g., with mounting, encapsulating, etc.) or treatment of packaged semiconductor
Description: Process provided including (a) multiple
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7619312 |
Method and apparatus for precisely aligning integrated circuit chips |
Nov. 17, 2009 |
| 7615422 |
Evaluation method of semiconductor device, manufacturing method of the semiconductor device, design management system of device comprising the semiconductor device, dose amount control program |
Nov. 10, 2009 |
| 7608469 |
Method of fabricating a chip |
Oct. 27, 2009 |
| 7601559 |
Apparatus and method for identifying proper orientation and electrical conductivity between a semiconductor device and a socket or contactor |
Oct. 13, 2009 |
| 7598100 |
Manufacturing method of semiconductor integrated circuit device |
Oct. 6, 2009 |
| 7582494 |
Device structures for reducing device mismatch due to shallow trench isolation induced oxides stresses |
Sep. 1, 2009 |
| 7582542 |
Die attaching method |
Sep. 1, 2009 |
| 7566575 |
Mounting circuit and method for producing semiconductor-chip-mounting circuit |
Jul. 28, 2009 |
| 7557597 |
Stacked chip security |
Jul. 7, 2009 |
| 7556973 |
Manufacturing method for semiconductor device |
Jul. 7, 2009 |
| 7553679 |
Method of determining plasma ion density, wafer voltage, etch rate and wafer current from applied bias voltage and current |
Jun. 30, 2009 |
| 7553680 |
Methods to provide and expose a diagnostic connector on overmolded electronic packages |
Jun. 30, 2009 |
| 7553681 |
Carbon nanotube-based stress sensor |
Jun. 30, 2009 |
| 7549560 |
Wafer dividing method |
Jun. 23, 2009 |
| 7524684 |
Semiconductor device with electrode pad having probe mark |
Apr. 28, 2009 |
| 7514274 |
Enhanced uniqueness for pattern recognition |
Apr. 7, 2009 |
| 7514276 |
Aligning stacked chips using resistance assistance |
Apr. 7, 2009 |
| 7507633 |
Method and structure for improved alignment in MRAM integration |
Mar. 24, 2009 |
| 7498181 |
Method of preparing an integrated circuit die for imaging |
Mar. 3, 2009 |
| 7498192 |
Methods of providing a family of related integrated circuits of different sizes |
Mar. 3, 2009 |
| 7498678 |
Electronic assemblies and systems with filled no-flow underfill |
Mar. 3, 2009 |
| 7494828 |
Substrate holder and device manufacturing method |
Feb. 24, 2009 |
| 7491556 |
Efficient method of forming and assembling a microelectronic chip including solder bumps |
Feb. 17, 2009 |
| 7485489 |
Electronics circuit manufacture |
Feb. 3, 2009 |
| 7482180 |
Method for determining the impact of layer thicknesses on laminate warpage |
Jan. 27, 2009 |
| 7479701 |
Dummy metal fill shapes for improved reliability of hybrid oxide/low-k dielectrics |
Jan. 20, 2009 |
| 7478022 |
Component emulation device and method of design |
Jan. 13, 2009 |
| 7476555 |
Method of chip manufacturing |
Jan. 13, 2009 |
| 7476553 |
Transfer base substrate and method of semiconductor device |
Jan. 13, 2009 |
| 7468309 |
Semiconductor wafer treatment method |
Dec. 23, 2008 |
| 7468525 |
Test structures for development of metal-insulator-metal (MIM) devices |
Dec. 23, 2008 |
| 7452733 |
Method of increasing reliability of packaged semiconductor integrated circuit dice |
Nov. 18, 2008 |
| 7452732 |
Comparing identifying indicia formed using laser marking techniques to an identifying indicia model |
Nov. 18, 2008 |
| 7449362 |
One-component hot-setting epoxy resin composition and semiconductor mounting underfill material |
Nov. 11, 2008 |
| 7445959 |
Sensor module and method of manufacturing same |
Nov. 4, 2008 |
| 7442559 |
Method for producing an optical or electronic module provided with a plastic package |
Oct. 28, 2008 |
| 7442576 |
Placement of absorbing material in a semiconductor device |
Oct. 28, 2008 |
| 7444012 |
Method and apparatus for performing failure analysis with fluorescence inks |
Oct. 28, 2008 |
| 7439090 |
Method for manufacturing a lower substrate of a liquid crystal display device |
Oct. 21, 2008 |
| 7439168 |
Apparatus and method of forming silicide in a localized manner |
Oct. 21, 2008 |
| 7433229 |
Flash memory device with shunt |
Oct. 7, 2008 |
| 7429497 |
Hybrid package with non-insertable and insertable conductive features, complementary receptacle, and methods of fabrication therefor |
Sep. 30, 2008 |
| 7427517 |
Stacking apparatus and method for stacking integrated circuit elements |
Sep. 23, 2008 |
| 7427520 |
Method and apparatus for measuring thickness of thin film formed on substrate |
Sep. 23, 2008 |
| 7422914 |
Fabrication method of semiconductor integrated circuit device |
Sep. 9, 2008 |
| 7423286 |
Laser transfer article and method of making |
Sep. 9, 2008 |
| 7416910 |
Pyramid socket suspension |
Aug. 26, 2008 |
| 7414323 |
Tab tape and method of manufacturing the same |
Aug. 19, 2008 |
| 7407822 |
Method for inspecting insulating film for film carrier tape for mounting electronic components thereon, inspection apparatus for inspecting the insulating film, punching apparatus for punching |
Aug. 5, 2008 |
| 7405103 |
Process for fabricating chip embedded package structure |
Jul. 29, 2008 |
|
|
|