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Class Information
Number: 438/15
Name: Semiconductor device manufacturing: process > With measuring or testing > Packaging (e.g., with mounting, encapsulating, etc.) or treatment of packaged semiconductor
Description: Process provided including (a) multiple










Patents under this class:

Patent Number Title Of Patent Date Issued
8710859 Method for testing multi-chip stacked packages Apr. 29, 2014
8709871 Stacked type semiconductor memory device and chip selection circuit Apr. 29, 2014
8709870 Method of forming solderable side-surface terminals of quad no-lead frame (QFN) integrated circuit packages Apr. 29, 2014
8709832 Chip on film (COF) package having test line for testing electrical function of chip and method for manufacturing same Apr. 29, 2014
8703508 Method for wafer-level testing diced multi-chip stacked packages Apr. 22, 2014
8689436 Two abutting sections of an align fixture together floatingly engaging an electronic component Apr. 8, 2014
8685761 Method for making a redistributed electronic device using a transferrable redistribution layer Apr. 1, 2014
8679975 Method for forming trenches in a semiconductor component Mar. 25, 2014
8679865 Resin application apparatus, optical property correction apparatus and method, and method for manufacturing LED package Mar. 25, 2014
8674496 System and method for fine pitch PoP structure Mar. 18, 2014
8674379 Light-emitting device package and method of manufacturing the same Mar. 18, 2014
8664753 Semiconductor device with protruding component portion and method of packaging Mar. 4, 2014
8658464 Mold chase design for package-on-package applications Feb. 25, 2014
8658437 Package method for electronic components by thin substrate Feb. 25, 2014
8653629 Semiconductor device and wafer Feb. 18, 2014
8652858 Chip testing method Feb. 18, 2014
8652857 Test apparatus, test method and manufacturing method for testing a device under test packaged in a test package Feb. 18, 2014
8638117 Production device, production method, test apparatus and integrated circuit package Jan. 28, 2014
8629004 Method of manufacturing semiconductor modules and semiconductor module Jan. 14, 2014
8617928 Dicing/die bonding film Dec. 31, 2013
8614107 Liner-free tungsten contact Dec. 24, 2013
8614106 Liner-free tungsten contact Dec. 24, 2013
8614105 Production flow and reusable testing method Dec. 24, 2013
8609473 Method for fabricating a neo-layer using stud bumped bare die Dec. 17, 2013
8603840 Manufacturing method of semiconductor device Dec. 10, 2013
8603839 In-line metrology system Dec. 10, 2013
8603838 Method for producing a contact for solar cells Dec. 10, 2013
8597988 System for flash-free overmolding of led array substrates Dec. 3, 2013
8593817 Power semiconductor module and method for operating a power semiconductor module Nov. 26, 2013
8587012 LED package and mold of manufacturing the same Nov. 19, 2013
8586408 Contact and method of formation Nov. 19, 2013
8580615 Method and system for wafer level singulation Nov. 12, 2013
8574933 Fabrication method of semiconductor device Nov. 5, 2013
8574932 PCB-mounted integrated circuits Nov. 5, 2013
8574931 Singulation and strip testing of no-lead integrated circuit packages without tape frame Nov. 5, 2013
8569082 Semiconductor package with a mold material encapsulating a chip and a portion of a lead frame Oct. 29, 2013
8564093 Semiconductor device and manufacturing method therefor Oct. 22, 2013
8563334 Method to remove sapphire substrate Oct. 22, 2013
8558229 Passivation layer for packaged chip Oct. 15, 2013
8557614 Method for manufacturing lighting device Oct. 15, 2013
8551003 Ultrasonic probe and ultrasonic diagnosis device Oct. 8, 2013
8546904 Integrated circuit with temperature increasing element and electronic system having the same Oct. 1, 2013
8546153 Resin dispensing apparatus for light emitting device package and method of manufacturing light emitting device package using the same Oct. 1, 2013
8536670 Semiconductor device, manufacturing method therefor, and electronic apparatus Sep. 17, 2013
8525315 Semiconductor power module and method of manufacturing the same Sep. 3, 2013
8518722 Method for detecting the under-fill void in flip chip BGA Aug. 27, 2013
8513066 Method of making an inverted-T channel transistor Aug. 20, 2013
8513034 Method of manufacturing layered chip package Aug. 20, 2013
8507297 Packaging and testing of multiple MEMS devices on a wafer Aug. 13, 2013
8502553 Semiconductor package test apparatus Aug. 6, 2013











 
 
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