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Class Information
Number: 438/127
Name: Semiconductor device manufacturing: process > Packaging (e.g., with mounting, encapsulating, etc.) or treatment of packaged semiconductor > Encapsulating
Description: Process including a step of surrounding the semiconductor substrate with an electrically insulating material which forms a sealed encasement therefor.










Patents under this class:

Patent Number Title Of Patent Date Issued
8710683 Method of forming wafer level mold using glass fiber and wafer structure formed by the same Apr. 29, 2014
8710640 Integrated circuit packaging system with heat slug and method of manufacture thereof Apr. 29, 2014
8710634 Integrated circuit packaging system with an integral-interposer-structure and method of manufacture thereof Apr. 29, 2014
8709933 Interposer having molded low CTE dielectric Apr. 29, 2014
8709879 Method of forming a semiconductor package Apr. 29, 2014
8709878 Methods of packaging imager devices and optics modules, and resulting assemblies Apr. 29, 2014
8709874 Manufacturing method for semiconductor device carrier and semiconductor package using the same Apr. 29, 2014
8709868 Sensor packages and method of packaging dies of differing sizes Apr. 29, 2014
8704365 Integrated circuit packaging system having a cavity Apr. 22, 2014
8704205 Semiconductor structure with improved capacitance of bit line Apr. 22, 2014
8703537 System and method to manufacture an implantable electrode Apr. 22, 2014
8703534 Semiconductor packages and methods of packaging semiconductor devices Apr. 22, 2014
8703533 Semiconductor package and method for manufacturing the same Apr. 22, 2014
8703532 Semiconductor device and manufacturing method thereof Apr. 22, 2014
8691630 Semiconductor package structure and manufacturing method thereof Apr. 8, 2014
8691341 Method of controlling the height of encapsulant on an inkjet printhead Apr. 8, 2014
8686550 Method and apparatus for high pressure sensor device Apr. 1, 2014
8686547 Stack die structure for stress reduction and facilitation of electromagnetic shielding Apr. 1, 2014
8680585 Light emitting diode package and method of manufacturing the same Mar. 25, 2014
8674502 Semiconductor-encapsulating adhesive, semiconductor-encapsulating film-form adhesive, method for producing semiconductor device, and semiconductor device Mar. 18, 2014
8673690 Method for manufacturing a semiconductor device and a semiconductor device Mar. 18, 2014
8673684 Semiconductor device and manufacturing method thereof Mar. 18, 2014
8669649 Integrated circuit packaging system with interlock and method of manufacture thereof Mar. 11, 2014
8669143 Device and method for manufacturing a device Mar. 11, 2014
8664779 Semiconductor device with front and back side resin layers having different thermal expansion coefficient and elasticity modulus Mar. 4, 2014
8664753 Semiconductor device with protruding component portion and method of packaging Mar. 4, 2014
8664752 Semiconductor die package and method for making the same Mar. 4, 2014
8659129 Semiconductor device and method of manufacturing same Feb. 25, 2014
8659050 Slim LED package Feb. 25, 2014
8658465 System and method to manufacture an implantable electrode Feb. 25, 2014
8658445 Method for manufacturing phosphor film and method for making LED package having the phosphor film Feb. 25, 2014
8653675 Package including at least one topological feature on an encapsulant material to resist out-of-plane deformation Feb. 18, 2014
8653673 Method for packaging semiconductors at a wafer level Feb. 18, 2014
8652866 Sensor device and method Feb. 18, 2014
8643161 Semiconductor device having double side electrode structure Feb. 4, 2014
8643140 Suspended beam for use in MEMS device Feb. 4, 2014
8642397 Semiconductor wafer level package (WLP) and method of manufacture thereof Feb. 4, 2014
8642388 Method for manufacturing light emitting diodes including forming circuit structures with a connecting section Feb. 4, 2014
8642387 Method of fabricating stacked packages using laser direct structuring Feb. 4, 2014
8637984 Multi-chip package with pillar connection Jan. 28, 2014
8637341 Semiconductor module Jan. 28, 2014
8633602 Semiconductor device, and method and apparatus for manufacturing the same Jan. 21, 2014
8633060 Semiconductor device production method and semiconductor device Jan. 21, 2014
8633057 Semiconductor package and method of fabricating the same Jan. 21, 2014
8633056 Integrated circuit package system and method of manufacture thereof Jan. 21, 2014
8629043 Methods for de-bonding carriers Jan. 14, 2014
8629003 Epoxy encapsulating and lamination adhesive and method of making same Jan. 14, 2014
8623711 Integrated circuit packaging system with package-on-package and method of manufacture thereof Jan. 7, 2014
8623708 Integrated circuit packaging system with grid-array mechanism and method of manufacture thereof Jan. 7, 2014
8623707 Method of fabricating a semiconductor package with integrated substrate thermal slug Jan. 7, 2014











 
 
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