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Class Information
Number: 438/127
Name: Semiconductor device manufacturing: process > Packaging (e.g., with mounting, encapsulating, etc.) or treatment of packaged semiconductor > Encapsulating
Description: Process including a step of surrounding the semiconductor substrate with an electrically insulating material which forms a sealed encasement therefor.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7619312 |
Method and apparatus for precisely aligning integrated circuit chips |
Nov. 17, 2009 |
| 7618849 |
Integrated circuit package with etched leadframe for package-on-package interconnects |
Nov. 17, 2009 |
| 7618842 |
Method of applying encapsulant to wire bonds |
Nov. 17, 2009 |
| 7617600 |
Process of making an electronic circuit device having flexibility and a reduced footprint |
Nov. 17, 2009 |
| 7615416 |
Secure package with anti-tamper peripheral guard ring |
Nov. 10, 2009 |
| 7615415 |
Vertical stack type multi-chip package having improved grounding performance and lower semiconductor chip reliability |
Nov. 10, 2009 |
| 7615412 |
System in package (SIP) integrated circuit and packaging method thereof |
Nov. 10, 2009 |
| 7615409 |
Method of stacking and interconnecting semiconductor packages via electrical connectors extending between adjoining semiconductor packages |
Nov. 10, 2009 |
| 7615408 |
Method of manufacturing semiconductor device |
Nov. 10, 2009 |
| 7615395 |
Method for containing a device and a corresponding device |
Nov. 10, 2009 |
| 7614888 |
Flip chip package process |
Nov. 10, 2009 |
| 7608487 |
B-stageable underfill encapsulant and method for its application |
Oct. 27, 2009 |
| 7605018 |
Method for forming a die-attach layer during semiconductor packaging processes |
Oct. 20, 2009 |
| 7601563 |
Small form factor molded memory card and a method thereof |
Oct. 13, 2009 |
| 7598881 |
Sensor and circuit configuration for occupant detection |
Oct. 6, 2009 |
| 7598126 |
Use of nanoscale particles for creating scratch-resistant protective layers on semiconductor chips |
Oct. 6, 2009 |
| 7598122 |
Die attach method and microarray leadframe structure |
Oct. 6, 2009 |
| 7595209 |
Low stress thin film microshells |
Sep. 29, 2009 |
| 7592205 |
Over-passivation process of forming polymer layer over IC chip |
Sep. 22, 2009 |
| 7592204 |
Package design of small diameter sensor |
Sep. 22, 2009 |
| 7591863 |
Laminating system, IC sheet, roll of IC sheet, and method for manufacturing IC chip |
Sep. 22, 2009 |
| 7588968 |
Linked chip attach and underfill |
Sep. 15, 2009 |
| 7588967 |
Curable silicone rubber composition and semiconductor device |
Sep. 15, 2009 |
| 7582514 |
Microelectromechanical systems encapsulation process with anti-stiction coating |
Sep. 1, 2009 |
| 7582510 |
Electronic packaging materials for use with low-k dielectric-containing semiconductor devices |
Sep. 1, 2009 |
| 7579219 |
Semiconductor device with a protected active die region and method therefor |
Aug. 25, 2009 |
| 7579215 |
Method for fabricating a low cost integrated circuit (IC) package |
Aug. 25, 2009 |
| 7579213 |
Modified chip attach process |
Aug. 25, 2009 |
| 7579206 |
Anchors for microelectromechanical systems having an SOI substrate, and method of fabricating same |
Aug. 25, 2009 |
| 7572681 |
Embedded electronic component package |
Aug. 11, 2009 |
| 7572680 |
Packaged integrated circuit with enhanced thermal dissipation |
Aug. 11, 2009 |
| 7572679 |
Heat extraction from packaged semiconductor chips, scalable with chip area |
Aug. 11, 2009 |
| 7569427 |
Semiconductor component with connecting elements and method for producing the same |
Aug. 4, 2009 |
| 7566584 |
Electronic substrate manufacturing method, semiconductor device manufacturing method, and electronic equipment manufacturing method |
Jul. 28, 2009 |
| 7563652 |
Method for encapsulating sensor chips |
Jul. 21, 2009 |
| 7563649 |
Chip packaging with metal frame pin grid array |
Jul. 21, 2009 |
| 7560309 |
Drop-in heat sink and exposed die-back for molded flip die package |
Jul. 14, 2009 |
| 7556987 |
Method of fabricating an integrated circuit with etched ring and die paddle |
Jul. 7, 2009 |
| 7556986 |
Tape supported memory card leadframe structure |
Jul. 7, 2009 |
| 7556984 |
Package structure of chip and the package method thereof |
Jul. 7, 2009 |
| 7554182 |
Semiconductor device and package, and method of manufacturer therefor |
Jun. 30, 2009 |
| 7553701 |
Semiconductor packaging method |
Jun. 30, 2009 |
| 7550320 |
Method of fabricating substrate with embedded component therein |
Jun. 23, 2009 |
| 7550315 |
Method for fabricating semiconductor package with multi-layer die contact and external contact |
Jun. 23, 2009 |
| 7544727 |
Encapsulant of epoxy resin, curing agent, and secondary aminosilane coupling agent or phosphate |
Jun. 9, 2009 |
| 7541222 |
Wire sweep resistant semiconductor package and manufacturing method therefor |
Jun. 2, 2009 |
| 7537967 |
Mold cleaning sheet and manufacturing method of a semiconductor device using the same |
May. 26, 2009 |
| 7537962 |
Method of fabricating a shielded stacked integrated circuit package system |
May. 26, 2009 |
| 7537958 |
High performance multi-chip flip chip package |
May. 26, 2009 |
| 7534664 |
Semiconductor device and method of manufacturing same |
May. 19, 2009 |
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