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Class Information
Number: 438/126
Name: Semiconductor device manufacturing: process > Packaging (e.g., with mounting, encapsulating, etc.) or treatment of packaged semiconductor > Insulative housing or support > And encapsulating
Description: Process including a step of surrounding the semiconductor substrate or insulative housing or support with an electrically insulating material which forms a sealed encasement therefor.










Patents under this class:

Patent Number Title Of Patent Date Issued
8709865 Fabrication method of packaging substrate having through-holed interposer embedded therein Apr. 29, 2014
8703599 Microelectronic devices having intermediate contacts for connection to interposer substrates, and associated methods of packaging microelectronic devices with intermediate contacts Apr. 22, 2014
8692265 Lighting device Apr. 8, 2014
8680665 Encapsulation, MEMS and encapsulation method Mar. 25, 2014
8680585 Light emitting diode package and method of manufacturing the same Mar. 25, 2014
8669143 Device and method for manufacturing a device Mar. 11, 2014
8669138 Semiconductor device and method for manufacturing the same Mar. 11, 2014
8664752 Semiconductor die package and method for making the same Mar. 4, 2014
8659175 Integrated circuit package system with offset stack Feb. 25, 2014
8653655 Semiconductor device and manufacturing method thereof Feb. 18, 2014
8652880 Semiconductor device and method of manufacturing same Feb. 18, 2014
8643140 Suspended beam for use in MEMS device Feb. 4, 2014
8642469 Semiconductor device and method of forming multi-layered UBM with intermediate insulating buffer layer to reduce stress for semiconductor wafer Feb. 4, 2014
8642388 Method for manufacturing light emitting diodes including forming circuit structures with a connecting section Feb. 4, 2014
8642387 Method of fabricating stacked packages using laser direct structuring Feb. 4, 2014
8637977 Semiconductor device and method of packaging a semiconductor device with a clip Jan. 28, 2014
8637971 Semiconductor device and method of manufacturing semiconductor device Jan. 28, 2014
8637969 Stacked chips in a semiconductor package Jan. 28, 2014
8633602 Semiconductor device, and method and apparatus for manufacturing the same Jan. 21, 2014
8633057 Semiconductor package and method of fabricating the same Jan. 21, 2014
8629001 Semiconductor device and method of manufacturing semiconductor device Jan. 14, 2014
8623707 Method of fabricating a semiconductor package with integrated substrate thermal slug Jan. 7, 2014
8617935 Back side alignment structure and manufacturing method for three-dimensional semiconductor device packages Dec. 31, 2013
8617926 Semiconductor chip device with polymeric filler trench Dec. 31, 2013
8614120 Semiconductor chip package and method of making same Dec. 24, 2013
8598692 Semiconductor device and method for manufacturing same Dec. 3, 2013
8597989 Manufacturing method of semiconductor device Dec. 3, 2013
8592968 Semiconductor device, semiconductor package, interposer, semiconductor device manufacturing method and interposer manufacturing method Nov. 26, 2013
8592253 Hybrid layers for use in coatings on electronic devices or other articles Nov. 26, 2013
8590145 Method of fabricating a circuit structure Nov. 26, 2013
8586421 Method of forming semiconductor device package having high breakdown voltage and low parasitic inductance Nov. 19, 2013
8580614 Embedded wafer-level bonding approaches Nov. 12, 2013
8574967 Method for fabricating array-molded package-on-package Nov. 5, 2013
8574966 Semiconductor device having a semiconductor chip, and method for the production thereof Nov. 5, 2013
8574963 Method of manufacturing semiconductor device Nov. 5, 2013
8569869 Integrated circuit packaging system with encapsulation and method of manufacture thereof Oct. 29, 2013
8558368 Bi-directional, reverse blocking battery switch Oct. 15, 2013
8546924 Package structures for integrating thermoelectric components with stacking chips Oct. 1, 2013
8546842 LED chip assembly, LED package, and manufacturing method of LED package Oct. 1, 2013
8546194 Integrated circuit packaging system with interconnects and method of manufacture thereof Oct. 1, 2013
8546190 Method for positioning chips during the production of a reconstituted wafer Oct. 1, 2013
8536688 Integrated circuit leadframe and fabrication method therefor Sep. 17, 2013
8524542 Blank including a composite panel with semiconductor chips and plastic package molding compound and method and mold for producing the same Sep. 3, 2013
8524535 Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board Sep. 3, 2013
8524534 Semiconductor device and manufacturing method thereof Sep. 3, 2013
8519545 Electronic device comprising a chip disposed on a pin Aug. 27, 2013
8518753 Assembly method for three dimensional integrated circuit Aug. 27, 2013
8518752 Integrated circuit packaging system with stackable package and method of manufacture thereof Aug. 27, 2013
8518742 Semiconductor packaging with internal wiring bus Aug. 27, 2013
8518741 Wafer-to-wafer process for manufacturing a stacked structure Aug. 27, 2013











 
 
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