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Class Information
Number: 438/126
Name: Semiconductor device manufacturing: process > Packaging (e.g., with mounting, encapsulating, etc.) or treatment of packaged semiconductor > Insulative housing or support > And encapsulating
Description: Process including a step of surrounding the semiconductor substrate or insulative housing or support with an electrically insulating material which forms a sealed encasement therefor.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7619312 |
Method and apparatus for precisely aligning integrated circuit chips |
Nov. 17, 2009 |
| 7615415 |
Vertical stack type multi-chip package having improved grounding performance and lower semiconductor chip reliability |
Nov. 10, 2009 |
| 7615842 |
Inductor integrated chip |
Nov. 10, 2009 |
| 7615862 |
Heat dissipating package structure and method for fabricating the same |
Nov. 10, 2009 |
| 7611926 |
Thermosetting die bonding film |
Nov. 3, 2009 |
| 7608486 |
Device and method for encapsulating with encapsulating material and electronic component fixed on a carrier |
Oct. 27, 2009 |
| 7605021 |
Manufacturing method of electronic device |
Oct. 20, 2009 |
| 7605018 |
Method for forming a die-attach layer during semiconductor packaging processes |
Oct. 20, 2009 |
| 7601563 |
Small form factor molded memory card and a method thereof |
Oct. 13, 2009 |
| 7592694 |
Chip package and method of manufacturing the same |
Sep. 22, 2009 |
| 7579215 |
Method for fabricating a low cost integrated circuit (IC) package |
Aug. 25, 2009 |
| 7579219 |
Semiconductor device with a protected active die region and method therefor |
Aug. 25, 2009 |
| 7572680 |
Packaged integrated circuit with enhanced thermal dissipation |
Aug. 11, 2009 |
| 7569419 |
Method for manufacturing semiconductor device that includes mounting chip on board and sealing with two resins |
Aug. 4, 2009 |
| 7569427 |
Semiconductor component with connecting elements and method for producing the same |
Aug. 4, 2009 |
| 7566591 |
Method and system for secure heat sink attachment on semiconductor devices with macroscopic uneven surface features |
Jul. 28, 2009 |
| 7563649 |
Chip packaging with metal frame pin grid array |
Jul. 21, 2009 |
| 7563652 |
Method for encapsulating sensor chips |
Jul. 21, 2009 |
| 7556984 |
Package structure of chip and the package method thereof |
Jul. 7, 2009 |
| 7554182 |
Semiconductor device and package, and method of manufacturer therefor |
Jun. 30, 2009 |
| 7553697 |
Multiple chip semiconductor package |
Jun. 30, 2009 |
| 7553701 |
Semiconductor packaging method |
Jun. 30, 2009 |
| 7553710 |
Composition for stripping photoresist and method for manufacturing thin transistor array panel using the same |
Jun. 30, 2009 |
| 7550320 |
Method of fabricating substrate with embedded component therein |
Jun. 23, 2009 |
| 7550322 |
Manufacturing method for resin sealed semiconductor device |
Jun. 23, 2009 |
| 7550859 |
System and method for hermetically sealing a package |
Jun. 23, 2009 |
| 7547564 |
Method of manufacturing device having flexible substrate and device having flexible substrate manufactured using the same |
Jun. 16, 2009 |
| 7547580 |
Method for manufacturing a semiconductor wiring base that includes a wiring base with wiring extending inside and outside of a mounting region |
Jun. 16, 2009 |
| 7541222 |
Wire sweep resistant semiconductor package and manufacturing method therefor |
Jun. 2, 2009 |
| 7537966 |
Method for fabricating board on chip (BOC) semiconductor package with circuit side polymer layer |
May. 26, 2009 |
| 7537967 |
Mold cleaning sheet and manufacturing method of a semiconductor device using the same |
May. 26, 2009 |
| 7534662 |
Methods for hermetic sealing of post media-filled MEMS package |
May. 19, 2009 |
| 7528077 |
Semiconductor device and method for manufacturing the same |
May. 5, 2009 |
| 7524704 |
Method for encapsulating a component, especially an electric or electronic component, by means of an improved solder seam |
Apr. 28, 2009 |
| 7521293 |
Method of manufacturing semiconductor device, semiconductor device, circuit board, and electronic instrument |
Apr. 21, 2009 |
| 7514276 |
Aligning stacked chips using resistance assistance |
Apr. 7, 2009 |
| 7514299 |
Chip package structure and manufacturing method thereof |
Apr. 7, 2009 |
| 7508083 |
Electronic component comprising a semiconductor chip and a plastic housing, and method for producing the same |
Mar. 24, 2009 |
| 7501696 |
Semiconductor chip-embedded substrate and method of manufacturing same |
Mar. 10, 2009 |
| 7498205 |
Method for manufacturing substrate with cavity |
Mar. 3, 2009 |
| 7498197 |
Silica nanoparticles thermoset resin compositions |
Mar. 3, 2009 |
| 7494843 |
Method of making a semiconductor chip assembly with thermal conductor and encapsulant grinding |
Feb. 24, 2009 |
| 7488622 |
Method for producing a surface-mountable semiconductor component |
Feb. 10, 2009 |
| 7485491 |
Secure digital memory card using land grid array structure |
Feb. 3, 2009 |
| 7485499 |
Customized non-volatile memory device packages |
Feb. 3, 2009 |
| 7479407 |
Digital and RF system and method therefor |
Jan. 20, 2009 |
| 7479413 |
Method for fabricating semiconductor package with circuit side polymer layer |
Jan. 20, 2009 |
| 7479694 |
Membrane 3D IC fabrication |
Jan. 20, 2009 |
| 7476969 |
Semiconductor packages for surface mounting and method of producing same |
Jan. 13, 2009 |
| 7473585 |
Technique for manufacturing an overmolded electronic assembly |
Jan. 6, 2009 |
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