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Class Information
Number: 438/125
Name: Semiconductor device manufacturing: process > Packaging (e.g., with mounting, encapsulating, etc.) or treatment of packaged semiconductor > Insulative housing or support
Description: Process for making a structure wherein the semiconductive device is supported or enclosed by preformed insulative body.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7615415 |
Vertical stack type multi-chip package having improved grounding performance and lower semiconductor chip reliability |
Nov. 10, 2009 |
| 7615704 |
Multiple digital printing techniques for fabricating printed circuits |
Nov. 10, 2009 |
| 7615842 |
Inductor integrated chip |
Nov. 10, 2009 |
| 7608485 |
Highly reliable, cost effective and thermally enhanced AuSn die-attach technology |
Oct. 27, 2009 |
| 7598117 |
Method for manufacturing semiconductor module using interconnection structure |
Oct. 6, 2009 |
| 7598125 |
Method for wafer level packaging and fabricating cap structures |
Oct. 6, 2009 |
| 7592204 |
Package design of small diameter sensor |
Sep. 22, 2009 |
| 7588962 |
Method of making semiconductor device |
Sep. 15, 2009 |
| 7589417 |
Microelectronic assembly having thermoelectric elements to cool a die and a method of making the same |
Sep. 15, 2009 |
| 7586189 |
Heat dissipation structure accommodated in electronic control device |
Sep. 8, 2009 |
| 7582514 |
Microelectromechanical systems encapsulation process with anti-stiction coating |
Sep. 1, 2009 |
| 7579217 |
Methods of making a die-up ball grid array package with printed circuit board attachable heat spreader |
Aug. 25, 2009 |
| 7579688 |
Heat radiation structure of semiconductor device, and manufacturing method thereof |
Aug. 25, 2009 |
| 7579687 |
Circuit module turbulence enhancement systems and methods |
Aug. 25, 2009 |
| 7575953 |
Stacked die with a recess in a die BGA package |
Aug. 18, 2009 |
| 7575956 |
Fabrication method for semiconductor package heat spreaders |
Aug. 18, 2009 |
| 7572670 |
Methods of forming semiconductor packages |
Aug. 11, 2009 |
| 7572677 |
Arrangement in semiconductor packages for inhibiting adhesion of lid to substrate while providing compression support |
Aug. 11, 2009 |
| 7572681 |
Embedded electronic component package |
Aug. 11, 2009 |
| 7572665 |
Microelectronics grade metal substrate, related metal-embedded devices and methods for fabricating same |
Aug. 11, 2009 |
| 7569917 |
Semiconductor device |
Aug. 4, 2009 |
| 7569426 |
Apparatus and method integrating an electro-osmotic pump and microchannel assembly into a die package |
Aug. 4, 2009 |
| 7566584 |
Electronic substrate manufacturing method, semiconductor device manufacturing method, and electronic equipment manufacturing method |
Jul. 28, 2009 |
| 7563651 |
Method of fabricating a substrate with a concave surface |
Jul. 21, 2009 |
| 7563650 |
Circuit board and the manufacturing method |
Jul. 21, 2009 |
| 7563646 |
Molded ceramic surface mount package |
Jul. 21, 2009 |
| 7557014 |
Semiconductor system-in-package |
Jul. 7, 2009 |
| 7553699 |
Method of fabricating microelectronic devices |
Jun. 30, 2009 |
| 7550321 |
Substrate having a functionally gradient coefficient of thermal expansion |
Jun. 23, 2009 |
| 7550320 |
Method of fabricating substrate with embedded component therein |
Jun. 23, 2009 |
| 7550319 |
Low temperature co-fired ceramic (LTCC) tape compositions, light emitting diode (LED) modules, lighting devices and method of forming thereof |
Jun. 23, 2009 |
| 7544542 |
Reduction of damage to thermal interface material due to asymmetrical load |
Jun. 9, 2009 |
| 7545027 |
Wafer level package having redistribution interconnection layer and method of forming the same |
Jun. 9, 2009 |
| 7541220 |
Integrated circuit device having flexible leadframe |
Jun. 2, 2009 |
| 7541222 |
Wire sweep resistant semiconductor package and manufacturing method therefor |
Jun. 2, 2009 |
| 7537967 |
Mold cleaning sheet and manufacturing method of a semiconductor device using the same |
May. 26, 2009 |
| 7537964 |
Method of fabricating a miniature silicon condenser microphone |
May. 26, 2009 |
| 7534636 |
Lids for wafer-scale optoelectronic packages |
May. 19, 2009 |
| 7531894 |
Method of electrically connecting a microelectronic component |
May. 12, 2009 |
| 7524701 |
Chip-scale package |
Apr. 28, 2009 |
| 7524703 |
Integrated circuit stacking system and method |
Apr. 28, 2009 |
| 7525188 |
Multilayer circuit board and production method for same |
Apr. 28, 2009 |
| 7521795 |
Semiconductor package |
Apr. 21, 2009 |
| 7521296 |
Methods of fabricating a microlens including selectively curing flowable, uncured optically trasmissive material |
Apr. 21, 2009 |
| 7517723 |
Method for fabricating a flip chip system in package |
Apr. 14, 2009 |
| 7517734 |
Method of manufacturing a wafer level package with a cap structure for hermetically sealing a micro device |
Apr. 14, 2009 |
| 7514289 |
Methods and structures for facilitating proximity communication |
Apr. 7, 2009 |
| 7514298 |
Printed wiring board for mounting semiconductor |
Apr. 7, 2009 |
| 7510913 |
Method of making an encapsulated plasma sensitive device |
Mar. 31, 2009 |
| 7498203 |
Thermally enhanced BGA package with ground ring |
Mar. 3, 2009 |
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