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Class Information
Number: 438/125
Name: Semiconductor device manufacturing: process > Packaging (e.g., with mounting, encapsulating, etc.) or treatment of packaged semiconductor > Insulative housing or support
Description: Process for making a structure wherein the semiconductive device is supported or enclosed by preformed insulative body.










Sub-classes under this class:

Class Number Class Name Patents
438/126 And encapsulating 1,196


Patents under this class:

Patent Number Title Of Patent Date Issued
8709933 Interposer having molded low CTE dielectric Apr. 29, 2014
8709877 Integrated circuit packaging system with an encapsulation and method of manufacture thereof Apr. 29, 2014
8704360 Top port surface mount silicon condenser microphone package Apr. 22, 2014
8704351 Stacked microelectronic assemblies Apr. 22, 2014
8692385 Device for connecting nano-objects to external electrical systems, and method for producing said device Apr. 8, 2014
8692364 Semiconductor device and method for manufacturing the same Apr. 8, 2014
8691632 Wafer level package and fabrication method Apr. 8, 2014
8686550 Method and apparatus for high pressure sensor device Apr. 1, 2014
8686548 Wiring substrate, method for manufacturing wiring substrate, and semiconductor package including wiring substrate Apr. 1, 2014
8673691 Method for manufacturing a semiconductor device Mar. 18, 2014
8665605 Substrate structure and package structure using the same Mar. 4, 2014
8664776 Interconnection tape providing a serial electrode pad connection in a semiconductor device Mar. 4, 2014
8664752 Semiconductor die package and method for making the same Mar. 4, 2014
8664047 Integrated circuit tampering protection and reverse engineering prevention coatings and methods Mar. 4, 2014
8658473 Ultrathin buried die module and method of manufacturing thereof Feb. 25, 2014
8653655 Semiconductor device and manufacturing method thereof Feb. 18, 2014
8653626 Package structures including a capacitor and methods of forming the same Feb. 18, 2014
8652883 Methods of manufacture of bottom port surface mount silicon condenser microphone packages Feb. 18, 2014
8643140 Suspended beam for use in MEMS device Feb. 4, 2014
8642388 Method for manufacturing light emitting diodes including forming circuit structures with a connecting section Feb. 4, 2014
8637997 Semiconductor device and method of manufacturing the same Jan. 28, 2014
8637979 Semiconductor device Jan. 28, 2014
8637971 Semiconductor device and method of manufacturing semiconductor device Jan. 28, 2014
8633583 Semiconductor package substrate and methods for forming same, in particular for MEMS devices Jan. 21, 2014
8633582 Chip package and fabrication method thereof Jan. 21, 2014
8633064 Methods of manufacture of top port multipart surface mount silicon condenser microphone package Jan. 21, 2014
8633057 Semiconductor package and method of fabricating the same Jan. 21, 2014
8629552 Top port multi-part surface mount silicon condenser microphone package Jan. 14, 2014
8629005 Methods of manufacture of bottom port surface mount silicon condenser microphone packages Jan. 14, 2014
8629001 Semiconductor device and method of manufacturing semiconductor device Jan. 14, 2014
8624387 Top port multi-part surface mount silicon condenser microphone package Jan. 7, 2014
8624386 Bottom port multi-part surface mount silicon condenser microphone package Jan. 7, 2014
8624385 Top port surface mount silicon condenser microphone package Jan. 7, 2014
8624384 Bottom port surface mount silicon condenser microphone package Jan. 7, 2014
8623710 Methods of manufacture of bottom port multi-part surface mount silicon condenser microphone packages Jan. 7, 2014
8623709 Methods of manufacture of top port surface mount silicon condenser microphone packages Jan. 7, 2014
8618653 Integrated circuit package system with wafer scale heat slug Dec. 31, 2013
8618652 Forming functionalized carrier structures with coreless packages Dec. 31, 2013
8617934 Methods of manufacture of top port multi-part surface mount silicon condenser microphone packages Dec. 31, 2013
8614120 Semiconductor chip package and method of making same Dec. 24, 2013
8610292 Resin sealing method of semiconductor device Dec. 17, 2013
8610262 Ball grid array package with improved thermal characteristics Dec. 17, 2013
8609470 Semiconducting sheet Dec. 17, 2013
8609463 Integrated circuit package system employing multi-package module techniques Dec. 17, 2013
8604602 Integrated circuit packaging system with reinforced encapsulant having embedded interconnect and method of manufacture thereof Dec. 10, 2013
8593817 Power semiconductor module and method for operating a power semiconductor module Nov. 26, 2013
8575748 Wafer-level packaging with compression-controlled seal ring bonding Nov. 5, 2013
8574966 Semiconductor device having a semiconductor chip, and method for the production thereof Nov. 5, 2013
8574965 Semiconductor chip device with liquid thermal interface material Nov. 5, 2013
8569113 Method for producing a microfluid component, as well as microfluid component Oct. 29, 2013











 
 
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