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Class Information
Number: 438/124
Name: Semiconductor device manufacturing: process > Packaging (e.g., with mounting, encapsulating, etc.) or treatment of packaged semiconductor > Metallic housing or support > And encapsulating
Description: Process including a step of surrounding the semiconductor substrate or the metallic housing or support with an electrically insulating material which forms a sealed encasement therefor.

Patents under this class:

Patent Number Title Of Patent Date Issued
8373287 Polymeric compositions comprising per(phenylethynyl) arene derivatives Feb. 12, 2013
8373286 Curable organopolysiloxane composition, optical semiconductor element sealant, and optical semiconductor device Feb. 12, 2013
8373258 Semiconductor device and production method thereof Feb. 12, 2013
8368215 Semiconductor device and method of manufacturing the same Feb. 5, 2013
8367481 Four MOSFET full bridge module Feb. 5, 2013
8367480 Semiconductor device and method of forming dam material around periphery of die to reduce warpage Feb. 5, 2013
8367477 Electronic device package and method for forming the same Feb. 5, 2013
8367476 Metallic solderability preservation coating on metal part of semiconductor package to prevent oxide Feb. 5, 2013
8361841 Mold array process method to encapsulate substrate cut edges Jan. 29, 2013
8357568 Thermal enhanced package Jan. 22, 2013
8350377 Semiconductor device package structure and method for the same Jan. 8, 2013
8349661 Manufacturing method of semiconductor device Jan. 8, 2013
8349660 Cavity closure process for at least one microelectronic device Jan. 8, 2013
8344485 Anticounterfeiting system and method for integrated circuits Jan. 1, 2013
8343811 Semiconductor device Jan. 1, 2013
8343809 Semiconductor device and method of forming repassivation layer with reduced opening to contact pad of semiconductor die Jan. 1, 2013
8338231 Encapsulated semiconductor chip with external contact pads and manufacturing method thereof Dec. 25, 2012
8334601 Package-on-package system with through vias and method of manufacture thereof Dec. 18, 2012
8334175 Manufacturing method of LED package structure Dec. 18, 2012
8334173 Method for manufacturing semiconductor apparatus Dec. 18, 2012
8329509 Packaging process to create wettable lead flank during board assembly Dec. 11, 2012
8324026 Method for manufacturing a semiconductor component Dec. 4, 2012
8324025 Power semiconductor device packaging Dec. 4, 2012
8319333 Power semiconductor module Nov. 27, 2012
8318549 Molded semiconductor package having a filler material Nov. 27, 2012
8318547 Integrated circuit package with electrically isolated leads Nov. 27, 2012
8318513 Method of encapsulating light-emitting diode devices using bent frames Nov. 27, 2012
8313983 Fabrication method for resin-encapsulated semiconductor device Nov. 20, 2012
8310038 Integrated circuit packaging system with embedded conductive structure and method of manufacture thereof Nov. 13, 2012
8304869 Fan-in interposer on lead frame for an integrated circuit package on package system Nov. 6, 2012
8304296 Semiconductor packaging system with multipart conductive pillars and method of manufacture thereof Nov. 6, 2012
8304295 Method of manufacturing an electronic device with a package locking system Nov. 6, 2012
8304294 Lead frame substrate and method of manufacturing the same Nov. 6, 2012
8304293 Thermally enhanced semiconductor package Nov. 6, 2012
8304292 Method of making a semiconductor chip assembly with a ceramic/metal substrate Nov. 6, 2012
8304268 Fabrication method of semiconductor package structure Nov. 6, 2012
8299603 Power semiconductor device Oct. 30, 2012
8298872 Manufacturing method for semiconductor device Oct. 30, 2012
8298869 Resin package and production method thereof Oct. 30, 2012
8298861 Package structure of compound semiconductor device and fabricating method thereof Oct. 30, 2012
8294256 Chip package structure and method of making the same Oct. 23, 2012
8293588 Method of providing an electronic device including dies, a dielectric layer, and an encapsulating layer Oct. 23, 2012
8293572 Injection molding system and method of chip package Oct. 23, 2012
8288863 Semiconductor package device with a heat dissipation structure and the packaging method thereof Oct. 16, 2012
8288201 Semiconductor device and method of forming FO-WLCSP with discrete semiconductor components mounted under and over semiconductor die Oct. 16, 2012
8278153 Manufacturing method of semiconductor device, adhesive sheet used therein, and semiconductor device obtained thereby Oct. 2, 2012
8278150 Stackable packages for three-dimensional packaging of semiconductor dice Oct. 2, 2012
8273587 Underfill process for flip-chip LEDs Sep. 25, 2012
8268676 Process of forming an electronic device including removing a conductive member to form a trench and electrically isolate leads Sep. 18, 2012
8263437 Semiconductor device and method of forming an IPD over a high-resistivity encapsulant separated from other IPDS and baseband circuit Sep. 11, 2012

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