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Class Information
Number: 438/124
Name: Semiconductor device manufacturing: process > Packaging (e.g., with mounting, encapsulating, etc.) or treatment of packaged semiconductor > Metallic housing or support > And encapsulating
Description: Process including a step of surrounding the semiconductor substrate or the metallic housing or support with an electrically insulating material which forms a sealed encasement therefor.










Patents under this class:

Patent Number Title Of Patent Date Issued
6391682 Method of performing flip-chip underfill in a wire-bonded chip-on-chip ball-grid array integrated circuit package module May. 21, 2002
6387731 Method and apparatus for reducing BGA warpage caused by encapsulation May. 14, 2002
6383841 Method for encapsulating with a fixing member to secure an electronic device May. 7, 2002
6379996 Package for semiconductor chip having thin recess portion and thick plane portion Apr. 30, 2002
6380062 Method of fabricating semiconductor package having metal peg leads and connected by trace lines Apr. 30, 2002
6376277 Semiconductor package Apr. 23, 2002
6376282 Inner-digitized bond fingers on bus bars of semiconductor device package Apr. 23, 2002
6376283 Mono-chip multimediacard fabrication method Apr. 23, 2002
6372539 Leadless packaging process using a conductive substrate Apr. 16, 2002
6372551 Method of manufacturing an image-sensor integrated circuit package without resin flash on lead frame and with increased wire bondability Apr. 16, 2002
6372552 Semiconductor device, ball grid array connection system, and method of making Apr. 16, 2002
6372619 Method for fabricating wafer level chip scale package with discrete package encapsulation Apr. 16, 2002
6373132 Semiconductor die with attached heat sink and transfer mold Apr. 16, 2002
6368895 Method of producing an electronic circuit device Apr. 9, 2002
6368898 Solid-state image sensing device Apr. 9, 2002
6368899 Electronic device packaging Apr. 9, 2002
6365432 Fabrication process of semiconductor package and semiconductor package Apr. 2, 2002
6365434 Method and apparatus for reduced flash encapsulation of microelectronic devices Apr. 2, 2002
6365960 Integrated circuit package with EMI shield Apr. 2, 2002
6358775 Multi-die semiconductor encapsulation method Mar. 19, 2002
6358778 Semiconductor package comprising lead frame with punched parts for terminals Mar. 19, 2002
6358780 Semiconductor package assemblies with moisture vents and methods of making same Mar. 19, 2002
6355506 Method of forming heat sink and semiconductor chip assemblies Mar. 12, 2002
6350634 Semiconductor device having a built-in heat sink and process of manufacturing same Feb. 26, 2002
6350668 Low cost chip size package and method of fabricating the same Feb. 26, 2002
6348399 Method of making chip scale package Feb. 19, 2002
6342407 Low stress hermetic seal Jan. 29, 2002
6338981 Centrifugally assisted underfill method Jan. 15, 2002
6338984 Resin-molded semiconductor device, method for manufacturing the same, and leadframe Jan. 15, 2002
6335223 Method for producing a resin-sealed semiconductor device Jan. 1, 2002
6335225 High density direct connect LOC assembly Jan. 1, 2002
6333209 One step method for curing and joining BGA solder balls Dec. 25, 2001
6333211 Process for manufacturing a premold type semiconductor package using support pins in the mold and external connector bumps Dec. 25, 2001
6333212 Semiconductor device and manufacturing method thereof Dec. 25, 2001
6333252 Low-pin-count chip package and manufacturing method thereof Dec. 25, 2001
6331448 Leadframes including offsets extending from a major plane thereof, packaged semiconductor devices including same, and methods of designing and fabricating such leadframes Dec. 18, 2001
6331452 Method of fabricating integrated circuit package with opening allowing access to die Dec. 18, 2001
6326238 Die paddle clamping method for wire bond enhancement Dec. 4, 2001
6326242 Semiconductor package with heat sink and method of fabrication Dec. 4, 2001
6326243 Resin sealed semiconductor device including a die pad uniformly having heat conducting paths and circulating holes for fluid resin Dec. 4, 2001
6326244 Method of making a cavity ball grid array apparatus Dec. 4, 2001
6323065 Methods for manufacturing ball grid array assembly semiconductor packages Nov. 27, 2001
6323066 Heat-dissipating structure for integrated circuit package Nov. 27, 2001
6316290 Method of fabricating a semiconductor device utilizing a residual organic compound to facilitate gate break on a carrier substrate Nov. 13, 2001
6312978 Method for leadless die interconnect without substrate cavity Nov. 6, 2001
6309902 Method for coating semiconductor element with resin, coating resin, and liquid crystal display device Oct. 30, 2001
6309913 Technique for attaching die to leads Oct. 30, 2001
6309914 Method for making a semiconductor package Oct. 30, 2001
6306685 Method of molding a bump chip carrier and structure made thereby Oct. 23, 2001
6306687 Tape under frame for conventional-type IC package assembly Oct. 23, 2001











 
 
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