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Class Information
Number: 438/124
Name: Semiconductor device manufacturing: process > Packaging (e.g., with mounting, encapsulating, etc.) or treatment of packaged semiconductor > Metallic housing or support > And encapsulating
Description: Process including a step of surrounding the semiconductor substrate or the metallic housing or support with an electrically insulating material which forms a sealed encasement therefor.










Patents under this class:
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Patent Number Title Of Patent Date Issued
6479327 Semiconductor device and method for manufacturing the same Nov. 12, 2002
6479886 Integrated circuit package with EMI shield Nov. 12, 2002
6476502 Semiconductor device and manufacturing method thereof Nov. 5, 2002
6472250 Method for producing a chip module Oct. 29, 2002
6472252 Methods for ball grid array (BGA) encapsulation mold Oct. 29, 2002
6468835 Method for making smart card or similar electronic device Oct. 22, 2002
6465274 Lead frame tooling design for bleed barrier groove Oct. 15, 2002
6465280 In-situ cap and method of fabricating same for an integrated circuit device Oct. 15, 2002
6458627 Semiconductor chip package and method of fabricating same Oct. 1, 2002
6459160 Package with low stress hermetic seal Oct. 1, 2002
6455348 Lead frame, resin-molded semiconductor device, and method for manufacturing the same Sep. 24, 2002
6455356 Methods for moding a leadframe in plastic integrated circuit devices Sep. 24, 2002
6451625 Method of fabricating a flip-chip ball-grid-array package with molded underfill Sep. 17, 2002
6451627 Semiconductor device and process for manufacturing and packaging a semiconductor device Sep. 17, 2002
6451628 Method fabricating a semiconductor device with a decreased mounting area Sep. 17, 2002
6451629 Leadframe alteration to direct compound flow into package Sep. 17, 2002
6444494 Process of packaging a semiconductor device with reinforced film substrate Sep. 3, 2002
6444497 Method and apparatus for reducing BGA warpage caused by encapsulation Sep. 3, 2002
6444498 Method of making semiconductor package with heat spreader Sep. 3, 2002
6444500 Split-mold and method for manufacturing semiconductor device by using the same Sep. 3, 2002
6444501 Two stage transfer molding method to encapsulate MMC module Sep. 3, 2002
6440772 Bow resistant plastic semiconductor package and method of fabrication Aug. 27, 2002
6432745 Two-pole SMT miniature housing for semiconductor components and method for the manufacture thereof Aug. 13, 2002
6432750 Power module package having insulator type heat sink attached to rear surface of lead frame and manufacturing method thereof Aug. 13, 2002
6432751 Resin mold electric part and producing method therefor Aug. 13, 2002
6432752 Stereolithographic methods for fabricating hermetic semiconductor device packages and semiconductor devices including stereolithographically fabricated hermetic packages Aug. 13, 2002
6427976 Lead-frame-based chip-scale package and method of manufacturing the same Aug. 6, 2002
6429048 Metal foil laminated IC package Aug. 6, 2002
6429530 Miniaturized chip scale ball grid array semiconductor package Aug. 6, 2002
6426241 Method for forming three-dimensional circuitization and circuits formed Jul. 30, 2002
6424024 Leadframe of quad flat non-leaded package Jul. 23, 2002
6420211 Method for protecting an integrated circuit chip Jul. 16, 2002
6420212 Method and apparatus to enclose dice Jul. 16, 2002
6420213 Method for fixing a semiconductor device having stud bumps to a substrate by an electrically non-conductive adhesive Jul. 16, 2002
6417018 Asymmetrical molding method for multiple part matrixes Jul. 9, 2002
6417026 Acoustic wave device face-down mounted on a substrate Jul. 9, 2002
6417028 Method and apparatus for removing contaminants on electronic devices Jul. 9, 2002
6414397 Anisotropic conductive film, method of mounting semiconductor chip, and semiconductor device Jul. 2, 2002
6410363 Semiconductor device and method of manufacturing same Jun. 25, 2002
6410365 Semiconductor device with two stacked chips in one resin body and method of producing Jun. 25, 2002
6406934 Wafer level production of chip size semiconductor packages Jun. 18, 2002
6406938 Semiconductor and flip chip packages and method having a back-side connection Jun. 18, 2002
6406943 Transverse hybrid LOC package Jun. 18, 2002
6406944 Method of fabricating a reinforcement of lead bonding in microelectronic packages Jun. 18, 2002
6403387 Method and apparatus for transfer molding encapsulation of a semiconductor die with attached heat sink Jun. 11, 2002
6403398 Semiconductor device, manufacturing method thereof and aggregate type semiconductor device Jun. 11, 2002
6404065 Electrically isolated power semiconductor package Jun. 11, 2002
6395582 Methods for forming ground vias in semiconductor packages May. 28, 2002
6395584 Method for improving the liquid dispensing of IC packages May. 28, 2002
6396708 Circuit board frame and method of use thereof for manufacturing semiconductor device May. 28, 2002

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