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Class Information
Number: 438/124
Name: Semiconductor device manufacturing: process > Packaging (e.g., with mounting, encapsulating, etc.) or treatment of packaged semiconductor > Metallic housing or support > And encapsulating
Description: Process including a step of surrounding the semiconductor substrate or the metallic housing or support with an electrically insulating material which forms a sealed encasement therefor.










Patents under this class:
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Patent Number Title Of Patent Date Issued
6767767 Method of manufacturing a semiconductor device in which a block molding package utilizes air vents in a substrate Jul. 27, 2004
6768660 Multi-chip memory devices and modules including independent control of memory chips Jul. 27, 2004
6764882 Two-stage transfer molding method to encapsulate MMC module Jul. 20, 2004
6762079 Methods for fabricating dual loc semiconductor die assembly employing floating lead finger structure Jul. 13, 2004
6762118 Package having array of metal pegs linked by printed circuit lines Jul. 13, 2004
6762492 Semiconductor device, image scanning unit and image forming apparatus Jul. 13, 2004
6759271 Flip chip type semiconductor device and method of manufacturing the same Jul. 6, 2004
6759307 Method to prevent die attach adhesive contamination in stacked chips Jul. 6, 2004
6753594 Electronic component with a semiconductor chip and fabrication method Jun. 22, 2004
6750082 Method of assembling a package with an exposed die backside with and without a heatsink for flip-chip Jun. 15, 2004
6747342 Flip-chip packaging Jun. 8, 2004
6743663 Method for producing a hybrid frame or hybrid housing and corresponding hybrid frame or hybrid housing Jun. 1, 2004
6743664 Flip-chip on flex for high performance packaging applications Jun. 1, 2004
6744118 Frame for semiconductor package Jun. 1, 2004
6734045 Lossy RF shield for integrated circuits May. 11, 2004
6734550 In-situ cap and method of fabricating same for an integrated circuit device May. 11, 2004
6730539 Method of manufacturing semiconductor device package May. 4, 2004
6730544 Stackable semiconductor package and method for manufacturing same May. 4, 2004
6730546 Molded component and method of producing the same May. 4, 2004
6723656 Method and apparatus for etching a semiconductor die Apr. 20, 2004
6724072 Lead frame, resin sealing mold and method for manufacturing a semiconductor device using the same Apr. 20, 2004
6720208 Semiconductor device Apr. 13, 2004
6716673 Two-pole SMT miniature housing for semiconductor components and method for the manufacture thereof Apr. 6, 2004
6716677 Microwave monolithic integrated circuit package Apr. 6, 2004
6713321 Super low profile package with high efficiency of heat dissipation Mar. 30, 2004
6713850 Tape carrier package structure with dummy pads and dummy leads for package reinforcement Mar. 30, 2004
6713882 Resin sealing apparatus and resin sealing method Mar. 30, 2004
6709895 Packaged microelectronic elements with enhanced thermal conduction Mar. 23, 2004
6709897 Method of forming IC package having upward-facing chip cavity Mar. 23, 2004
6706547 Method of manufacturing a circuit device with trenches in a conductive foil Mar. 16, 2004
6706553 Dispensing process for fabrication of microelectronic packages Mar. 16, 2004
6706558 Manufacturing method of semiconductor device Mar. 16, 2004
6706560 Method of forming heat sink and semiconductor chip assemblies Mar. 16, 2004
6706563 Heat spreader interconnect methodology for thermally enhanced PBGA packages Mar. 16, 2004
6703260 Leadframes including offsets extending from a major plane thereof, packaged semiconductor devices including same, and methods of designing and fabricating such leadframes Mar. 9, 2004
6703261 Semiconductor device and manufacturing the same Mar. 9, 2004
6703262 Method for planarizing circuit board and method for manufacturing semiconductor device Mar. 9, 2004
6699731 Substrate of semiconductor package Mar. 2, 2004
6692989 Plastic molded type semiconductor device and fabrication process thereof Feb. 17, 2004
6692991 Resin-encapsulated semiconductor device and method for manufacturing the same Feb. 17, 2004
6689636 Semiconductor device and fabrication method of the same Feb. 10, 2004
6689638 Substrate-on-chip packaging process Feb. 10, 2004
6689640 Chip scale pin array Feb. 10, 2004
6689642 Semiconductor device and manufacturing method thereof Feb. 10, 2004
6684496 Method of making an integrated circuit package Feb. 3, 2004
6682952 Method of forming the resin sealed semiconductor device using the lead frame Jan. 27, 2004
6682957 Semiconductor substrate and land grid array semiconductor package using same and fabrication methods thereof Jan. 27, 2004
6677179 Method of applying no-flow underfill Jan. 13, 2004
6677681 Carrier substrate and carrier assembly using residual organic compounds to facilitate gate break Jan. 13, 2004
6670214 Insulated bonding wire for microelectronic packaging Dec. 30, 2003

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