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Class Information
Number: 438/124
Name: Semiconductor device manufacturing: process > Packaging (e.g., with mounting, encapsulating, etc.) or treatment of packaged semiconductor > Metallic housing or support > And encapsulating
Description: Process including a step of surrounding the semiconductor substrate or the metallic housing or support with an electrically insulating material which forms a sealed encasement therefor.










Patents under this class:
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Patent Number Title Of Patent Date Issued
7101732 Semiconductor device and method of manufacturing the same Sep. 5, 2006
7102213 Leadframe-based housing, leadframe strip, surface-mounted optoelectronic-component, and production method Sep. 5, 2006
7098082 Microelectronics package assembly tool and method of manufacture therewith Aug. 29, 2006
7091060 Circuit and substrate encapsulation methods Aug. 15, 2006
7091581 Integrated circuit package and process for fabricating the same Aug. 15, 2006
7087461 Process and lead frame for making leadless semiconductor packages Aug. 8, 2006
7087465 Method of packaging a semiconductor light emitting device Aug. 8, 2006
7084003 Method for manufacturing semiconductor device packages Aug. 1, 2006
7084008 Manufacturing method for electronic component-mounted component, manufacturing method for electronic component-mounted completed product with the electronic component-mounted component, and el Aug. 1, 2006
7084511 Semiconductor device having resin-sealed area on circuit board thereof Aug. 1, 2006
7078270 Semiconductor device and manufacturing method of semiconductor device Jul. 18, 2006
7078271 Leadframe-to-plastic lock for IC package Jul. 18, 2006
7075172 Lead-frame for semiconductor devices Jul. 11, 2006
7071034 Method of making semiconductor device Jul. 4, 2006
7067356 Method of fabricating microelectronic package having a bumpless laminated interconnection layer Jun. 27, 2006
7063987 Backside failure analysis of integrated circuits Jun. 20, 2006
7060536 Dual row leadframe and fabrication method Jun. 13, 2006
7061119 Tape attachment chip-on-board assemblies Jun. 13, 2006
7061125 Semiconductor package with pattern leads and method for manufacturing the same Jun. 13, 2006
7049166 Methods and apparatus for making integrated circuit package including opening exposing portion of the IC May. 23, 2006
7049173 Method for fabricating semiconductor component with chip on board leadframe May. 23, 2006
7041535 Power module and method of manufacturing the same May. 9, 2006
7041536 Semiconductor integrated circuit card manufacturing method, and semiconductor integrated circuit card May. 9, 2006
7038321 Method of attaching a flip chip device and circuit assembly formed thereby May. 2, 2006
7033866 Method for making dual gauge leadframe Apr. 25, 2006
7030505 Resin-sealed-type semiconductor device, and production process for producing such semiconductor device Apr. 18, 2006
7031170 Electronic device having a plastic housing and components of a height-structured metallic leadframe and methods for the production of the electronic device Apr. 18, 2006
7026176 Mold making method for wafer scale caps Apr. 11, 2006
7026720 Flip-chip mounted integrated circuit card element Apr. 11, 2006
7015073 Method of forming heat spreader with down set leg attachment feature Mar. 21, 2006
7008820 Chip scale package with open substrate Mar. 7, 2006
7005320 Method for manufacturing flip chip package devices with a heat spreader Feb. 28, 2006
7005325 Semiconductor package with passive device integration Feb. 28, 2006
7001799 Method of making a leadframe for semiconductor devices Feb. 21, 2006
7002236 Semiconductor package and method for producing the same Feb. 21, 2006
6998180 Package with a substrate of high thermal conductivity Feb. 14, 2006
6998296 Electronic component and method for its production Feb. 14, 2006
6998297 Wafer level packaging Feb. 14, 2006
6987030 Method of manufacturing semiconductor device Jan. 17, 2006
6982482 Packaging of solid state devices Jan. 3, 2006
6982486 Cavity ball grid array apparatus having improved inductance characteristics and method of fabricating the same Jan. 3, 2006
6977190 Semiconductor device and method for production thereof Dec. 20, 2005
6972216 Semiconductor package with enhanced electrical and thermal performance and method for fabricating the same Dec. 6, 2005
6969640 Air pocket resistant semiconductor package system Nov. 29, 2005
6969641 Method and system for integrated circuit packaging Nov. 29, 2005
6967125 Quad flat no lead (QFN) grid array package, method of making and memory module and computer system including same Nov. 22, 2005
6967127 Methods for making semiconductor packages with leadframe grid arrays Nov. 22, 2005
6967128 Semiconductor device and method of manufacturing the same Nov. 22, 2005
6967393 Semiconductor differential interconnect Nov. 22, 2005
6962836 Method of manufacturing a semiconductor device having leads stabilized during die mounting Nov. 8, 2005

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