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Class Information
Number: 438/124
Name: Semiconductor device manufacturing: process > Packaging (e.g., with mounting, encapsulating, etc.) or treatment of packaged semiconductor > Metallic housing or support > And encapsulating
Description: Process including a step of surrounding the semiconductor substrate or the metallic housing or support with an electrically insulating material which forms a sealed encasement therefor.

Patents under this class:
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Patent Number Title Of Patent Date Issued
7262074 Methods of fabricating underfilled, encapsulated semiconductor die assemblies Aug. 28, 2007
7256410 Solid state relay Aug. 14, 2007
7247928 Semiconductor device with electrical connection balls between an integrated circuit chip and a support plate, and process for fabricating it Jul. 24, 2007
7247520 Microelectronic component assemblies and microelectronic component lead frame structures Jul. 24, 2007
7244637 Chip on board and heat sink attachment methods Jul. 17, 2007
7239030 Flexible wiring board for tape carrier package having improved flame resistance Jul. 3, 2007
7238547 Packaging integrated circuits for accelerated detection of transient particle induced soft error rates Jul. 3, 2007
7235873 Protective device for subassemblies and method for producing a protective device Jun. 26, 2007
7217594 Alternative flip chip in leaded molded package design and method for manufacture May. 15, 2007
7211471 Exposed lead QFP package fabricated through the use of a partial saw process May. 1, 2007
7208347 Connection technology for power semiconductors comprising a layer of electrically insulating material that follows the surface contours Apr. 24, 2007
7205644 Memory card structure and manufacturing method thereof Apr. 17, 2007
7205170 Method for the production of LED bodies Apr. 17, 2007
7198987 Overmolded semiconductor package with an integrated EMI and RFI shield Apr. 3, 2007
7195957 Packaged microelectronic components Mar. 27, 2007
7192798 Fingerprint sensor apparatus and manufacturing method thereof Mar. 20, 2007
7192795 Method of making light emitting device with silicon-containing encapsulant Mar. 20, 2007
7189601 System and method for forming mold caps over integrated circuit devices Mar. 13, 2007
7186584 Integrated circuit chip, electronic device and method of manufacturing the same, and electronic instrument Mar. 6, 2007
7183138 Method and apparatus for decoupling conductive portions of a microelectronic device package Feb. 27, 2007
7179689 Package stress management Feb. 20, 2007
7176582 Semiconductor device and method of manufacturing same Feb. 13, 2007
7176563 Electronically grounded heat spreader Feb. 13, 2007
7176062 Lead-frame method and assembly for interconnecting circuits within a circuit module Feb. 13, 2007
7169691 Method of fabricating wafer-level packaging with sidewall passivation and related apparatus Jan. 30, 2007
7169651 Process and lead frame for making leadless semiconductor packages Jan. 30, 2007
7169649 Wafer scale integration of electroplated 3D structures using successive lithography, electroplated sacrificial layers, and flip-chip bonding Jan. 30, 2007
7168161 Manufacturing method of solid-state image sensing device Jan. 30, 2007
7165316 Methods for manufacturing resistors using a sacrificial layer Jan. 23, 2007
7164210 Semiconductor package with heat sink and method for fabricating same Jan. 16, 2007
7163838 Method and apparatus for forming a DMD window frame with molded glass Jan. 16, 2007
7160759 Semiconductor device and method of manufacturing the same Jan. 9, 2007
7157308 Circuit substrates, semiconductor devices, semiconductor manufacturing apparatus methods for manufacturing circuit substrates, and methods for manufacturing semiconductor devices Jan. 2, 2007
7151013 Semiconductor package having exposed heat dissipating surface and method of fabrication Dec. 19, 2006
7148083 Transfer mold semiconductor packaging processes Dec. 12, 2006
7145225 Interposer configured to reduce the profiles of semiconductor device assemblies and packages including the same and methods Dec. 5, 2006
7144754 Device having resin package and method of producing the same Dec. 5, 2006
7141509 Method for fabricating a circuit device Nov. 28, 2006
7126216 Two part mold for wafer scale caps Oct. 24, 2006
7125798 Circuit device and manufacturing method of circuit device Oct. 24, 2006
7125752 Methods for making microwave circuits including a ground plane Oct. 24, 2006
7125751 Semiconductor device and method for the fabrication thereof grinding frame portion such that plural electrode constituent portions Oct. 24, 2006
7122406 Semiconductor device package diepad having features formed by electroplating Oct. 17, 2006
7122401 Area array type semiconductor package fabrication method Oct. 17, 2006
7109065 Bumped chip carrier package using lead frame and method for manufacturing the same Sep. 19, 2006
7109064 Method of forming a semiconductor package and leadframe therefor Sep. 19, 2006
7109062 Semiconductor integrated device including support substrate fastened using resin, and manufacturing method thereof Sep. 19, 2006
7109057 Sealing apparatus for semiconductor wafer and method of manufacturing semiconductor device by using sealing apparatus Sep. 19, 2006
7105383 Packaged semiconductor with coated leads and method therefore Sep. 12, 2006
7105384 Circuit device manufacturing method including mounting circuit elements on a conductive foil, forming separation grooves in the foil, and etching the rear of the foil Sep. 12, 2006

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