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Class Information
Number: 438/124
Name: Semiconductor device manufacturing: process > Packaging (e.g., with mounting, encapsulating, etc.) or treatment of packaged semiconductor > Metallic housing or support > And encapsulating
Description: Process including a step of surrounding the semiconductor substrate or the metallic housing or support with an electrically insulating material which forms a sealed encasement therefor.










Patents under this class:
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Patent Number Title Of Patent Date Issued
7445968 Methods for integrated circuit module packaging and integrated circuit module packages Nov. 4, 2008
7439101 Resin encapsulation molding method for semiconductor device Oct. 21, 2008
7439099 Thin ball grid array package Oct. 21, 2008
7435625 Semiconductor device with reduced package cross-talk and loss Oct. 14, 2008
7427523 Method of making light emitting device with silicon-containing encapsulant Sep. 23, 2008
7425469 Method for encapsulating an electronic component using a foil layer Sep. 16, 2008
7423342 Method for assembling semiconductor switching elements and heat sink in rotary electric machine and rotary electric machine Sep. 9, 2008
7417309 Circuit device and portable device with symmetrical arrangement Aug. 26, 2008
7410836 Method for fabricating a photosensitive semiconductor package Aug. 12, 2008
7410830 Leadless plastic chip carrier and method of fabricating same Aug. 12, 2008
7407832 Method for manufacturing semiconductor package Aug. 5, 2008
7405107 Semiconductor device, method and apparatus for fabricating the same Jul. 29, 2008
7402458 Stress relieved flat frame for DMD window Jul. 22, 2008
7391119 Temperature sustaining flip chip assembly process Jun. 24, 2008
7384805 Transfer mold semiconductor packaging processes Jun. 10, 2008
7378301 Method for molding a small form factor digital memory card May. 27, 2008
7378300 Integrated circuit package system May. 27, 2008
7378299 Leadless semiconductor package and manufacturing method thereof May. 27, 2008
7372133 Microelectronic package having a stiffening element and method of making same May. 13, 2008
7371617 Method for fabricating semiconductor package with heat sink May. 13, 2008
7371610 Process for fabricating an integrated circuit package with reduced mold warping May. 13, 2008
7371606 Manufacturing method of a semiconductor device May. 13, 2008
7368326 Methods and apparatus to reduce growth formations on plated conductive leads May. 6, 2008
7364948 Method for fabricating semiconductor package Apr. 29, 2008
7351611 Method of making the mould for encapsulating a leadframe package Apr. 1, 2008
7344921 Integrated circuit device having reduced bow and method for making same Mar. 18, 2008
7344920 Integrated circuit package and method for fabricating same Mar. 18, 2008
7339280 Semiconductor package with lead frame as chip carrier and method for fabricating the same Mar. 4, 2008
7338841 Leadframe with encapsulant guide and method for the fabrication thereof Mar. 4, 2008
7335532 Method of assembly for multi-flip chip on lead frame on overmolded IC package Feb. 26, 2008
7332804 Semiconductor device and method of manufacturing the same Feb. 19, 2008
7314778 Wafer-level processing of chip-packaging compositions including bis-maleimides Jan. 1, 2008
RE39957 Method of making semiconductor package with heat spreader Dec. 25, 2007
7312526 Semiconductor device and method of manufacturing thereof Dec. 25, 2007
7312106 Method for encapsulating a chip having a sensitive surface Dec. 25, 2007
7309624 Semiconductor device and method for the fabrication thereof including grinding a major portion of the frame Dec. 18, 2007
7309622 Integrated circuit package system with heat sink Dec. 18, 2007
7303947 Source bridge for cooling and/or external connection Dec. 4, 2007
7298027 SMT three phase inverter package and lead frame Nov. 20, 2007
7291513 Hermetic wafer-level packaging for MEMS devices with low-temperature metallurgy Nov. 6, 2007
7288439 Leadless microelectronic package and a method to maximize the die size in the package Oct. 30, 2007
7285443 Stacked semiconductor module Oct. 23, 2007
7282395 Method of making exposed pad ball grid array package Oct. 16, 2007
7282394 Printed circuit board including embedded chips and method of fabricating the same using plating Oct. 16, 2007
7278201 Method of manufacturing a resistor Oct. 9, 2007
7276398 System and method for hermetically sealing a package Oct. 2, 2007
7273770 Compliant passivated edge seal for low-k interconnect structures Sep. 25, 2007
7273769 Method and apparatus for removing encapsulating material from a packaged microelectronic device Sep. 25, 2007
7271038 Methods of forming ruthenium film by changing process conditions during chemical vapor deposition and ruthenium films formed thereby Sep. 18, 2007
7271035 Manufacturing method for resin sealed semiconductor device Sep. 18, 2007

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